• Show Sidebar

There are 2050 products.

Active filters

  • Categories: Other BGA Chips & ICs
  • Categories: Pin Holder
  • Categories: Programmer & Sockets
wishlist
Compare
Quickview

QUALCOMM SMB347ET1699Y

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000651
€3.45

QUALCOMM SMB347ET-1699Y

wishlist
Compare
Quickview

ITE IT8502E KXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000652
€3.45

ITE IT8502E (KXO)

wishlist
Compare
Quickview

ITE IT8585VG FXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000655
€6.35

ITE IT8585VG FXO

wishlist
Compare
Quickview

OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

OBDSTAR RFID Adapter

Product Name: Chip Reader

Product Data: IMMO for VW AUDI SKODA SEAT 4 & 5 GEN

Suits Products: Key Master DP/ X300 DP/ DP PAD/ Key Master/ X300 Pro3/ X100 Pro

The 4th and 5th generation for the programming of VW/AUDI/SKODA/SEAT are added as follows:

1. CDC+24C32 Types

2. NEC+24C32 Types

3. 2013 Johnson Types;

4. Motorola 9S12XHZ512 Types;

5. NEC+24C64 Color Screen- Type 1

6. NEC+24C64 Color Screen- Type 2

7. NEC+24C64 White Screen Type

8. NEC+24C64(VDO -12)Type

9. NEC+95320 Type

10. NEC+35XX Type

11. Magotan/ CC Type

12. Q7/A6L(C6)9S12DT(G)128 Type

13. Q7/A6L(C6)9S12DT(G)256 Type

14. Lifan Marvell models are added, which includes Add/Clear Keys, Program/Delete ESCL functions.

15. Jiangling MU-X models are added as key programming and key clearing.

Package includes:

1pc x OBDSTAR RFID Adapter

CH002035
€231.24

OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

wishlist
Compare
Quickview

MXIC MX25L1605DM2I

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000659
€3.45

MXIC MX25L1605DM2I

wishlist
Compare
Quickview

BGEE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000661
€3.45

BG=EE

wishlist
Compare
Quickview

CHIP PROGRAMMER SOCKET TQFP32 QFP32 LQFP32 TO DIP32 adapter socket support ATMEGA8 series

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

Description:

Best quality, QFP32 to 32Dip Adapter

Suitable for QFP32 IC

patch size : 0.8mm 7mm * 7mm

Feature:

Support Atmel Atmega TQFP32 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP32 Atmega328 format, Pin to pin comptabile with Atmega DIP32 MCU format

Package included:

Programmer Adapter QFP32 to DIP32

CH002049
€28.00

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

wishlist
Compare
Quickview

SIS 630S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000664
€15.89

SIS 630S

wishlist
Compare
Quickview

Realtek RTL8101L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000672
€3.45

Realtek RTL8101L

QUALCOMM SMB347ET1699Y

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000651
€3.45

QUALCOMM SMB347ET-1699Y

wishlist
Compare

ITE IT8502E KXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000652
€3.45

ITE IT8502E (KXO)

wishlist
Compare

ITE IT8585VG FXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000655
€6.35

ITE IT8585VG FXO

wishlist
Compare

OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

OBDSTAR RFID Adapter

Product Name: Chip Reader

Product Data: IMMO for VW AUDI SKODA SEAT 4 & 5 GEN

Suits Products: Key Master DP/ X300 DP/ DP PAD/ Key Master/ X300 Pro3/ X100 Pro

The 4th and 5th generation for the programming of VW/AUDI/SKODA/SEAT are added as follows:

1. CDC+24C32 Types

2. NEC+24C32 Types

3. 2013 Johnson Types;

4. Motorola 9S12XHZ512 Types;

5. NEC+24C64 Color Screen- Type 1

6. NEC+24C64 Color Screen- Type 2

7. NEC+24C64 White Screen Type

8. NEC+24C64(VDO -12)Type

9. NEC+95320 Type

10. NEC+35XX Type

11. Magotan/ CC Type

12. Q7/A6L(C6)9S12DT(G)128 Type

13. Q7/A6L(C6)9S12DT(G)256 Type

14. Lifan Marvell models are added, which includes Add/Clear Keys, Program/Delete ESCL functions.

15. Jiangling MU-X models are added as key programming and key clearing.

Package includes:

1pc x OBDSTAR RFID Adapter

CH002035
€231.24

OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

wishlist
Compare

MXIC MX25L1605DM2I

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000659
€3.45

MXIC MX25L1605DM2I

wishlist
Compare

BGEE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000661
€3.45

BG=EE

wishlist
Compare

CHIP PROGRAMMER SOCKET TQFP32 QFP32 LQFP32 TO DIP32 adapter socket support ATMEGA8 series

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

Description:

Best quality, QFP32 to 32Dip Adapter

Suitable for QFP32 IC

patch size : 0.8mm 7mm * 7mm

Feature:

Support Atmel Atmega TQFP32 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP32 Atmega328 format, Pin to pin comptabile with Atmega DIP32 MCU format

Package included:

Programmer Adapter QFP32 to DIP32

CH002049
€28.00

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

wishlist
Compare

SIS 630S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000664
€15.89

SIS 630S

wishlist
Compare

Realtek RTL8101L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000672
€3.45

Realtek RTL8101L

wishlist
Compare
Back to top