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i76820HQ SR2FU Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003058
€6.84

i7-6820HQ SR2FU Stencil Template

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GTX1050TI N17PG1A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003059
€5.40

GTX1050TI N17P-G1-A1 Stencil Template

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ATHEROS AR8162BL3A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003060
€3.45

ATHEROS AR8162-BL3A

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SR24B 3825U

SR24B 3825U

Part Number 3825U SR24B Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003061
€78.77

SR24B 3825U

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K9F1G08U0DSCB0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003062
€6.04

K9F1G08U0D-SCB0

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2160772000 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003064
€17.14

216-0772000 Stencil Template 90*90

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TI TPS2061 D8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003065
€3.45

TI TPS2061 D8

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G86771A2 8600MGS

G86-771-A2 8600MGS

Part Number G86-771-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1432

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003066
€29.54

G86-771-A2 8600MGS

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HAYEAR 14 Million Pixels Full HD Color Screen Digital Magnifier Microscope Camera

Use Tutorials Video: * HAYEAR 14 Million Pixels Full HD

Feature:

14 megapixel Panas'onic sensor 1/2.3 inch

Effective pixel:14 megapixel

Pixel size:1.43*1.43um

Frame rate:60fps

Display:FULL HD

Material:metal,glass

Lens:CS for test, custom provide

White balance:Auto/manual

Digital magnification:5 times digital zoom

Brightness control:Auto/manual

Color:R/G/B adjustable

Freeze:Support

OSD:Support

Film and record:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:Support multi-color, 5pcs of transverse lines/vertical lines, moveable

SNR:Support

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

Lens:C

USB interface :Standard usb2.0 interface (Type B)

Specification:

Model: Camera with HDMI USB2.0 two output

Image format: jpg,png,tiff

Image resolution: 4320*3240 (for TF card) 1920 *1080 @ 60FPS(for TF card)

Video format: MP4

Video recorder: 1920 *1080 @ 60FPS (for TF Card)

USB Video resolution: 1920 *1080 @ 30FPS

White Balance: Auto

Light: Auto

Color: Color

Negative: Support

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese

Line: different color,5 horizontal line , 5 vertical line,any positions

C-MOUNT Lens parameter:

Working distance: 55mm-200mm

Field of view: 2.4mm-36mm

zoom c-mount Lens:

Magnification Power by 8X~120X

Size: 100mm(L) * 25mm(DIA)

Package includes:

1 * HDMI camera

1 * HDMI cable

1 * remote control

1 * C-MOUNT Lens

1 * 12V power supply

1 * Table Stand

CH003067
€172.81

HAYEAR 14 Million Pixels Full HD Color Screen Digital Magnifier Microscope Camera

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AUOP12301

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003068
€3.45

AUO-P12301

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SEMTECH SC471

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003069
€3.45

SEMTECH SC471

i76820HQ SR2FU Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003058
€6.84

i7-6820HQ SR2FU Stencil Template

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GTX1050TI N17PG1A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003059
€5.40

GTX1050TI N17P-G1-A1 Stencil Template

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Compare

ATHEROS AR8162BL3A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003060
€3.45

ATHEROS AR8162-BL3A

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Compare

SR24B 3825U

SR24B 3825U

Part Number 3825U SR24B Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003061
€78.77

SR24B 3825U

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Compare

K9F1G08U0DSCB0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003062
€6.04

K9F1G08U0D-SCB0

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Compare

2160772000 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003064
€17.14

216-0772000 Stencil Template 90*90

wishlist
Compare

TI TPS2061 D8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003065
€3.45

TI TPS2061 D8

wishlist
Compare

G86771A2 8600MGS

G86-771-A2 8600MGS

Part Number G86-771-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1432

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003066
€29.54

G86-771-A2 8600MGS

wishlist
Compare

HAYEAR 14 Million Pixels Full HD Color Screen Digital Magnifier Microscope Camera

Use Tutorials Video: * HAYEAR 14 Million Pixels Full HD

Feature:

14 megapixel Panas'onic sensor 1/2.3 inch

Effective pixel:14 megapixel

Pixel size:1.43*1.43um

Frame rate:60fps

Display:FULL HD

Material:metal,glass

Lens:CS for test, custom provide

White balance:Auto/manual

Digital magnification:5 times digital zoom

Brightness control:Auto/manual

Color:R/G/B adjustable

Freeze:Support

OSD:Support

Film and record:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:Support multi-color, 5pcs of transverse lines/vertical lines, moveable

SNR:Support

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

Lens:C

USB interface :Standard usb2.0 interface (Type B)

Specification:

Model: Camera with HDMI USB2.0 two output

Image format: jpg,png,tiff

Image resolution: 4320*3240 (for TF card) 1920 *1080 @ 60FPS(for TF card)

Video format: MP4

Video recorder: 1920 *1080 @ 60FPS (for TF Card)

USB Video resolution: 1920 *1080 @ 30FPS

White Balance: Auto

Light: Auto

Color: Color

Negative: Support

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese

Line: different color,5 horizontal line , 5 vertical line,any positions

C-MOUNT Lens parameter:

Working distance: 55mm-200mm

Field of view: 2.4mm-36mm

zoom c-mount Lens:

Magnification Power by 8X~120X

Size: 100mm(L) * 25mm(DIA)

Package includes:

1 * HDMI camera

1 * HDMI cable

1 * remote control

1 * C-MOUNT Lens

1 * 12V power supply

1 * Table Stand

CH003067
€172.81

HAYEAR 14 Million Pixels Full HD Color Screen Digital Magnifier Microscope Camera

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Compare

AUOP12301

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003068
€3.45

AUO-P12301

wishlist
Compare

SEMTECH SC471

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003069
€3.45

SEMTECH SC471

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Compare
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