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Rigol DP832 Programmable Linear DC Power Supply 3 Channels

Other DC Power Supply

The DP800 Series Power Supplies combine the ability to source, analyze, and coordinate over time in a powerful new package. The DP800 Series is a family of linear power supplies systems with 1, 2, or 3 outputs and up to 200 Watts in total. With one channel isolated users can reconfigure instruments into any number of systems or applications. Built in V, A, and W measurements make power monitoring easy, but additional wave tracking, timing, and analysis features in the advanced A series supplies means there are even more ways to use the instruments. New digital triggering between instruments also makes it possible to reliably combine and connect supplies together. Intuitive to use for everything from education labs to the R & D bench, the DP800 family of power supplies provide incredible value for any application. Select the value models for best price performance or upgrade to the A model to improve resolution and add advanced monitoring, triggering, and programming capabilities.

Features:

? 3 Outputs; total power up to 195W

? Low Ripple Noise <350 uVrms/2mVpp

? Fast transient response time: <50 us

? Channel isolation: CH1 || CH2,CH3

? OVP/OCP/OTP protection functions

? Built in V, A, W measurements and waveform display

? Support for output Delay, Analysis, Monitor, and Preset function

? 3.5 inch TFT Display

? Connectivity including USB Host & Device, LAN, and Digital IO

Specifications:

Model

DP832

Channels

3

DC Output (0C to 40C )

Voltage/current

CH1: 0 to 30V/0 to 3A

CH2: 0 to 30V/0 to 3A

CH3: 0 to 5V/0 to 3A

OVP/OCP

CH1: 10mV~33V/1mA~3.3A

CH2: 10mV~33V/1mA~3.3A

CH3: 10mV~5.5V/1mA~3.3A

Load Regulation Rate (Output Percentage + Offset)

Voltage

<0.01%+2mV

Current

<0.01%+250uA

Linear Regulation Rate (Output Percentage + Offset)

Voltage

<0.01%+2mV

Current

<0.01%+250uA

Ripples and Noise (20Hz to 20MHz)

Normal Mode Voltage

<350Vrms/2mVpp

Normal Mode Current

<2mArms

Common Mode Current

<1.5Arms

Annual Accuracy [1] (25C 5C ) (Output Percentage + Offset)

Programming

Voltage

0.05% + 10mV

Current

0.2% + 10mA

Readback

Voltage

0.05% + 5mV

Current

0.15%+ 5mA

Resolution

Programming

Voltage

10mV

With high-resolution option:

1mV

Current

1mA

Readback

Voltage

10mV

With high-resolution option:

0.1mV

Current

1mA

With high-resolution option:

0.1mA

Display

Voltage

10mV

With high-resolution option:

1mV

Current

10mA

With high-resolution option:

1mA

Transient Response Time

Less than 50s for output to recover to within 15mV following a change in output current from full load to half load or vice versa.

Command Processing Time [2]

<118ms

Temperature Coefficient per? (Output Percentage + Offset)

Voltage

CH1/CH2: 0.01%+5mV

CH3: 0.01%+2mV

Current

0.01%+2mA

Stability [3] (Output Percentage + Offset)

Voltage

CH1/CH2: 0.02%+2mV

CH3: 0.01%+1mV

Current

0.05%+2mA

Product Features:

? Low Ripple and Noise: <350uVrms / 2mVpp

Low Ripple and Noise design output the high purity power supply.

? Fast Transient Response Time: <50us

Fast Transient Response Time meet the requirement of fast transient voltage wave.

? Excellent Linear Regulation Rate and Load Regulation Rate ensure the output stable and safty. (e.g.DP831A)

Excellent Linear Regulation Rate and Load Regulation Rate ensure the output stable and safty. (e.g.DP831A)

? Timing output

When the timer is enabled, the instrument outputs the preset voltage and current values (at most 2048 groups). Users can set the number of output groups of the timer as well as the voltage, current and timing time of each group.

? V/A/W Display

Built-in V,A,W measurements and waveform display

? Output Analysis, Monitor

Support more advanced functions: recorder, analyzer, monitor and trigger.

? Large screen display with 3.5 LCD

Support 4 display modes: normal, waveform, dial and classic.

CH003070
€433.88

Rigol DP832 Programmable Linear DC Power Supply 3 Channels

2150876184 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003071
€6.71

215-0876184 Stencil Template

N11PGSA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003072
€5.40

N11P-GS-A1 Stencil Template

62898C2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003073
€8.70

62898C2 Stencil Template

BROADCOM BCM5782KFB

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003074
€3.97

BROADCOM BCM5782KFB

SMSC MEC1310NU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003075
€3.45

SMSC MEC1310-NU

OZMICRO OZ8618LN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003076
€3.45

OZMICRO OZ8618LN

ON NCP6132A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003077
€3.45

ON NCP6132A

SR1SD J1800

SR1SD J1800

Part Number SR1SD J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1342

Package/Case 240 PCS Description Original new

SR1SD J1800 FH8065301615103 Intel Celeron CPU BGA1170 2 4 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003078
€73.85

SR1SD J1800

RICHTEK RT9203

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003079
€3.45

RICHTEK RT9203

ENE KB926QF E0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003080
€3.45

ENE KB926QF E0

Rigol DP832 Programmable Linear DC Power Supply 3 Channels

Other DC Power Supply

The DP800 Series Power Supplies combine the ability to source, analyze, and coordinate over time in a powerful new package. The DP800 Series is a family of linear power supplies systems with 1, 2, or 3 outputs and up to 200 Watts in total. With one channel isolated users can reconfigure instruments into any number of systems or applications. Built in V, A, and W measurements make power monitoring easy, but additional wave tracking, timing, and analysis features in the advanced A series supplies means there are even more ways to use the instruments. New digital triggering between instruments also makes it possible to reliably combine and connect supplies together. Intuitive to use for everything from education labs to the R & D bench, the DP800 family of power supplies provide incredible value for any application. Select the value models for best price performance or upgrade to the A model to improve resolution and add advanced monitoring, triggering, and programming capabilities.

Features:

? 3 Outputs; total power up to 195W

? Low Ripple Noise <350 uVrms/2mVpp

? Fast transient response time: <50 us

? Channel isolation: CH1 || CH2,CH3

? OVP/OCP/OTP protection functions

? Built in V, A, W measurements and waveform display

? Support for output Delay, Analysis, Monitor, and Preset function

? 3.5 inch TFT Display

? Connectivity including USB Host & Device, LAN, and Digital IO

Specifications:

Model

DP832

Channels

3

DC Output (0C to 40C )

Voltage/current

CH1: 0 to 30V/0 to 3A

CH2: 0 to 30V/0 to 3A

CH3: 0 to 5V/0 to 3A

OVP/OCP

CH1: 10mV~33V/1mA~3.3A

CH2: 10mV~33V/1mA~3.3A

CH3: 10mV~5.5V/1mA~3.3A

Load Regulation Rate (Output Percentage + Offset)

Voltage

<0.01%+2mV

Current

<0.01%+250uA

Linear Regulation Rate (Output Percentage + Offset)

Voltage

<0.01%+2mV

Current

<0.01%+250uA

Ripples and Noise (20Hz to 20MHz)

Normal Mode Voltage

<350Vrms/2mVpp

Normal Mode Current

<2mArms

Common Mode Current

<1.5Arms

Annual Accuracy [1] (25C 5C ) (Output Percentage + Offset)

Programming

Voltage

0.05% + 10mV

Current

0.2% + 10mA

Readback

Voltage

0.05% + 5mV

Current

0.15%+ 5mA

Resolution

Programming

Voltage

10mV

With high-resolution option:

1mV

Current

1mA

Readback

Voltage

10mV

With high-resolution option:

0.1mV

Current

1mA

With high-resolution option:

0.1mA

Display

Voltage

10mV

With high-resolution option:

1mV

Current

10mA

With high-resolution option:

1mA

Transient Response Time

Less than 50s for output to recover to within 15mV following a change in output current from full load to half load or vice versa.

Command Processing Time [2]

<118ms

Temperature Coefficient per? (Output Percentage + Offset)

Voltage

CH1/CH2: 0.01%+5mV

CH3: 0.01%+2mV

Current

0.01%+2mA

Stability [3] (Output Percentage + Offset)

Voltage

CH1/CH2: 0.02%+2mV

CH3: 0.01%+1mV

Current

0.05%+2mA

Product Features:

? Low Ripple and Noise: <350uVrms / 2mVpp

Low Ripple and Noise design output the high purity power supply.

? Fast Transient Response Time: <50us

Fast Transient Response Time meet the requirement of fast transient voltage wave.

? Excellent Linear Regulation Rate and Load Regulation Rate ensure the output stable and safty. (e.g.DP831A)

Excellent Linear Regulation Rate and Load Regulation Rate ensure the output stable and safty. (e.g.DP831A)

? Timing output

When the timer is enabled, the instrument outputs the preset voltage and current values (at most 2048 groups). Users can set the number of output groups of the timer as well as the voltage, current and timing time of each group.

? V/A/W Display

Built-in V,A,W measurements and waveform display

? Output Analysis, Monitor

Support more advanced functions: recorder, analyzer, monitor and trigger.

? Large screen display with 3.5 LCD

Support 4 display modes: normal, waveform, dial and classic.

CH003070
€433.88

Rigol DP832 Programmable Linear DC Power Supply 3 Channels

2150876184 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003071
€6.71

215-0876184 Stencil Template

N11PGSA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003072
€5.40

N11P-GS-A1 Stencil Template

62898C2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003073
€8.70

62898C2 Stencil Template

BROADCOM BCM5782KFB

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003074
€3.97

BROADCOM BCM5782KFB

SMSC MEC1310NU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003075
€3.45

SMSC MEC1310-NU

OZMICRO OZ8618LN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003076
€3.45

OZMICRO OZ8618LN

ON NCP6132A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003077
€3.45

ON NCP6132A

SR1SD J1800

SR1SD J1800

Part Number SR1SD J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1342

Package/Case 240 PCS Description Original new

SR1SD J1800 FH8065301615103 Intel Celeron CPU BGA1170 2 4 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003078
€73.85

SR1SD J1800

RICHTEK RT9203

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003079
€3.45

RICHTEK RT9203

ENE KB926QF E0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003080
€3.45

ENE KB926QF E0