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  • Categories: Bios Chip Programming
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A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57287U BTOCTO

PO000108
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7287U BTO/CTO

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A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i7 I77567U BTOCTO

PO000109
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i7 I7-7567U BTO/CTO

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2150848004 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000734
€9.97

215-0848004 Stencil Template 90*90

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A1398 EMC 2512 Bios Chip EFI Firmware 820-3332 Retina Mid2012 Core i7 I73615QM MC975LLA

PO000110
€18.00 €22.50

A1398 EMC 2512 Bios EFI Firmware 820-3332 Retina Mid-2012 Core i7 I7-3615QM MC975LL/A

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TU102300AK5A1 TU102400A1 TU102875A1 TU102300AK1A1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000741
€9.97

TU102-300A-K5-A1 TU102-400-A1 TU102-875-A1 TU102-300A-K1-A1 Stencil Template 90*90

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A1398 EMC 2512 Bios Chip EFI Firmware 820-3332 Retina Mid2012 Core i7 I73720QM MC976LLA

PO000111
€18.00 €22.50

A1398 EMC 2512 Bios EFI Firmware 820-3332 Retina Mid-2012 Core i7 I7-3720QM MC976LL/A

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GK107450A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000742
€5.40

GK107-450-A2 Stencil Template

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NH82801HR Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000744
€5.40

NH82801HR Stencil Template

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A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73635QM ME664LLA

PO000113
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3635QM ME664LL/A

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A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73740QM ME665LLA

PO000114
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3740QM ME665LL/A

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2160772003 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000754
€9.97

216-0772003 Stencil Template 90*90

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i72637M SR0D3 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000763
€9.97

i7-2637M SR0D3 Stencil Template 90*90

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A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57287U BTOCTO

PO000108
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7287U BTO/CTO

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  • -20%

A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i7 I77567U BTOCTO

PO000109
€18.00 €22.50

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i7 I7-7567U BTO/CTO

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2150848004 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000734
€9.97

215-0848004 Stencil Template 90*90

wishlist
Compare
  • -20%

A1398 EMC 2512 Bios Chip EFI Firmware 820-3332 Retina Mid2012 Core i7 I73615QM MC975LLA

PO000110
€18.00 €22.50

A1398 EMC 2512 Bios EFI Firmware 820-3332 Retina Mid-2012 Core i7 I7-3615QM MC975LL/A

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TU102300AK5A1 TU102400A1 TU102875A1 TU102300AK1A1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000741
€9.97

TU102-300A-K5-A1 TU102-400-A1 TU102-875-A1 TU102-300A-K1-A1 Stencil Template 90*90

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A1398 EMC 2512 Bios Chip EFI Firmware 820-3332 Retina Mid2012 Core i7 I73720QM MC976LLA

PO000111
€18.00 €22.50

A1398 EMC 2512 Bios EFI Firmware 820-3332 Retina Mid-2012 Core i7 I7-3720QM MC976LL/A

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GK107450A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000742
€5.40

GK107-450-A2 Stencil Template

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Compare

NH82801HR Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000744
€5.40

NH82801HR Stencil Template

wishlist
Compare
  • -20%

A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73635QM ME664LLA

PO000113
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3635QM ME664LL/A

wishlist
Compare
  • -20%

A1398 EMC 2673 Bios Chip EFI Firmware 820-3332 Retina Early 2013 Core i7 I73740QM ME665LLA

PO000114
€18.00 €22.50

A1398 EMC 2673 Bios EFI Firmware 820-3332 Retina Early 2013 Core i7 I7-3740QM ME665LL/A

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Compare

2160772003 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000754
€9.97

216-0772003 Stencil Template 90*90

wishlist
Compare

i72637M SR0D3 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000763
€9.97

i7-2637M SR0D3 Stencil Template 90*90

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