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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74870HQ BTOCTO

PO000122
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4870HQ BTO/CTO

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N10MNSSB1 G103M

N10M-NS-S-B1 G103M

Part Number N10M-NS-S-B1 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001672
€15.59

N10M-NS-S-B1 G103M

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A1398 EMC 2881 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74870HQ MGXC2LLA

PO000124
€18.00 €22.50

A1398 EMC 2881 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4870HQ MGXC2LL/A

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G84600A2 8600MGT 128Bit 256Mb

G84-600-A2 8600MGT 128Bit 256Mb

Part Number G84-600-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1327

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001678
€49.23

G84-600-A2 8600MGT 128Bit 256Mb

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2150752003

215-0752003

Part Number 215-0752003 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1112

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001689
€31.87

215-0752003

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A1398 EMC 2881 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74980HQ MGXG2LLA

PO000125
€18.00 €22.50

A1398 EMC 2881 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4980HQ MGXG2LL/A

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SR29E N3700

SR29E N3700

Part Number SR29E N3700 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001692
€58.88

SR29E N3700

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A1398 EMC 2909 Bios Chip EFI Firmware 820-00138 Retina Mid2015 15 Core i7 I74870HQ BTOCTO

PO000127
€18.00 €22.50

A1398 EMC 2909 Bios EFI Firmware 820-00138 Retina Mid-2015 15 Core i7 I7-4870HQ BTO/CTO

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2150674058

215-0674058

Part Number 215-0674058 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001696
€36.53

215-0674058

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A1398 EMC 2909 Bios Chip EFI Firmware 820-00138 Retina Mid2015 15 Core i7 I74980HQ BTOCTO

PO000128
€18.00 €22.50

A1398 EMC 2909 Bios EFI Firmware 820-00138 Retina Mid-2015 15 Core i7 I7-4980HQ BTO/CTO

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GM107400A2 GTX750TI

GM107-400-A2 GTX750TI

Part Number GM107-400-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1630

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001698
€116.51

GM107-400-A2 GTX750TI

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SR2UW i36006U

SR2UW i3-6006U

Part Number i3-6006U SR2UW Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

i3-6006U SR2UW FJ8066201931106 Core i3 Mobile

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001710
€210.05

SR2UW i3-6006U

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A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74870HQ BTOCTO

PO000122
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4870HQ BTO/CTO

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N10MNSSB1 G103M

N10M-NS-S-B1 G103M

Part Number N10M-NS-S-B1 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001672
€15.59

N10M-NS-S-B1 G103M

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A1398 EMC 2881 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74870HQ MGXC2LLA

PO000124
€18.00 €22.50

A1398 EMC 2881 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4870HQ MGXC2LL/A

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G84600A2 8600MGT 128Bit 256Mb

G84-600-A2 8600MGT 128Bit 256Mb

Part Number G84-600-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1327

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001678
€49.23

G84-600-A2 8600MGT 128Bit 256Mb

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2150752003

215-0752003

Part Number 215-0752003 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1112

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001689
€31.87

215-0752003

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A1398 EMC 2881 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74980HQ MGXG2LLA

PO000125
€18.00 €22.50

A1398 EMC 2881 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4980HQ MGXG2LL/A

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SR29E N3700

SR29E N3700

Part Number SR29E N3700 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001692
€58.88

SR29E N3700

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A1398 EMC 2909 Bios Chip EFI Firmware 820-00138 Retina Mid2015 15 Core i7 I74870HQ BTOCTO

PO000127
€18.00 €22.50

A1398 EMC 2909 Bios EFI Firmware 820-00138 Retina Mid-2015 15 Core i7 I7-4870HQ BTO/CTO

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2150674058

215-0674058

Part Number 215-0674058 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001696
€36.53

215-0674058

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A1398 EMC 2909 Bios Chip EFI Firmware 820-00138 Retina Mid2015 15 Core i7 I74980HQ BTOCTO

PO000128
€18.00 €22.50

A1398 EMC 2909 Bios EFI Firmware 820-00138 Retina Mid-2015 15 Core i7 I7-4980HQ BTO/CTO

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GM107400A2 GTX750TI

GM107-400-A2 GTX750TI

Part Number GM107-400-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1630

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001698
€116.51

GM107-400-A2 GTX750TI

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SR2UW i36006U

SR2UW i3-6006U

Part Number i3-6006U SR2UW Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

i3-6006U SR2UW FJ8066201931106 Core i3 Mobile

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001710
€210.05

SR2UW i3-6006U

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