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  • Categories: Bios Chip Programming
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PT1502

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000673
€3.45

PT1502

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OZMICRO OZ9910SN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000674
€3.45

OZMICRO OZ9910SN

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A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74750HQ ME293LLA

PO000116
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4750HQ ME293LL/A

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A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74850HQ BTOCTO

PO000117
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4850HQ BTO/CTO

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RICHTEK RT9226

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000677
€3.45

RICHTEK RT9226

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ITE IT8502E NXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000680
€3.45

ITE IT8502E (NXO)

  • -20%
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A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74960HQ BTOCTO

PO000118
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4960HQ BTO/CTO

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Realtek ALC861

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000684
€3.45

Realtek ALC861

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CONEXANT CX2058311Z

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000685
€3.45

CONEXANT CX20583-11Z

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A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74770HQ MGXA2LLA

PO000121
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4770HQ MGXA2LL/A

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Realtek ALC889

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000687
€3.45

Realtek ALC889

  • -20%
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A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74870HQ BTOCTO

PO000122
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4870HQ BTO/CTO

PT1502

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000673
€3.45

PT1502

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OZMICRO OZ9910SN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000674
€3.45

OZMICRO OZ9910SN

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  • -20%

A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74750HQ ME293LLA

PO000116
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4750HQ ME293LL/A

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  • -20%

A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74850HQ BTOCTO

PO000117
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4850HQ BTO/CTO

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RICHTEK RT9226

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000677
€3.45

RICHTEK RT9226

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Compare

ITE IT8502E NXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000680
€3.45

ITE IT8502E (NXO)

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  • -20%

A1398 EMC 2674 Bios Chip EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I74960HQ BTOCTO

PO000118
€18.00 €22.50

A1398 EMC 2674 Bios EFI Firmware 820-3662 Retina Late 2013 15 Core i7 I7-4960HQ BTO/CTO

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Realtek ALC861

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000684
€3.45

Realtek ALC861

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Compare

CONEXANT CX2058311Z

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000685
€3.45

CONEXANT CX20583-11Z

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  • -20%

A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74770HQ MGXA2LLA

PO000121
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4770HQ MGXA2LL/A

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Realtek ALC889

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000687
€3.45

Realtek ALC889

wishlist
Compare
  • -20%

A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74870HQ BTOCTO

PO000122
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4870HQ BTO/CTO

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