• Show Sidebar

There are 789 products.

Active filters

  • Categories: CPU and Graphic Chips
  • Categories: Car Service Equipment
  • Categories: DC Jacks, Connector
  • Categories: EFI Rom Cable
  • Categories: Programmer
wishlist
Compare
Quickview

DC Power Jack Part PJ086

Samsung Series 5 Chromebook DC Power Jack Connector: XE500C21, XE500C21-AZ2, XE500C21-A01xx, XE500C21-A03xx, XE500C21-A04xx, XE500C21-HZ3, XE500C21-HZ3, XE500C21-H01xx, XE500C21-H03xx, XE500C21-H04xx, Motherboard BA92-08314A, BA92-09334A, BA92-09664B

CH003094
€7.21

DC Power Jack, Part #PJ086

wishlist
Compare
Quickview

SR0HR

SR0HR

Part Number SR0HR Manufacturer INTEL

Socket Type rPGA988B Date Code 13+

Package/Case 1 PCS Description Brand new

SR0HR FF8062700848702 B830 Mobile Celeron Dual-Core 1.8 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001381
€10.50

SR0HR

wishlist
Compare
Quickview

N10MNESA3

N10M-NE-S-A3

Part Number N1N10M-NE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001400
€16.71

N10M-NE-S-A3

wishlist
Compare
Quickview

GF116200KAA1 GTS450

GF116-200-KA-A1 GTS450

Part Number GF116-200-KA-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1238

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001403
€65.64

GF116-200-KA-A1 GTS450

wishlist
Compare
Quickview

2160841000

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001432
€21.77

216-0841000

wishlist
Compare
Quickview

N13MGSBA2

N13M-GS-B-A2

Part Number N13M-GS-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001445
€25.93

N13M-GS-B-A2

wishlist
Compare
Quickview

DC Power Jack Part PJ055

Compaq Presario DC Power Jack Connector: 900, 903, 904, 905, 906, 907, 908, 909, 910, 911, 912, 914, 915, 916, 917, 918, 919, 920, 921, 922, 925, 927, 930, 935, 940, 943, 945, 950, 955, 1500, 1505, 1507, 1508, 1510, 1515, 1522, 1523, 1525, 1527

Compaq EVO DC Power Jack Connector: N1000C, N1000V, N1005V, N1015V, N1020V

Note: This Jack is for use with AC adapter tips that are 4.75mm in diameter only. Some systems only require 2 pins of the outer Shield, all you need to do is clip off or bend up the outer shield pins you do not need.

CH003273
€7.21

DC Power Jack, Part #PJ055

wishlist
Compare
Quickview

SR1EF i54210U

SR1EF i5-4210U

Part Number SR1EF i5-4210U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 440 PCS Description Original new

SR1EF i5-4210U CL8064701477802 Intel Core i5 Mobile CPU BGA1168 1.7 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001446
€211.69

SR1EF i5-4210U

DC Power Jack Part PJ086

Samsung Series 5 Chromebook DC Power Jack Connector: XE500C21, XE500C21-AZ2, XE500C21-A01xx, XE500C21-A03xx, XE500C21-A04xx, XE500C21-HZ3, XE500C21-HZ3, XE500C21-H01xx, XE500C21-H03xx, XE500C21-H04xx, Motherboard BA92-08314A, BA92-09334A, BA92-09664B

CH003094
€7.21

DC Power Jack, Part #PJ086

wishlist
Compare

SR0HR

SR0HR

Part Number SR0HR Manufacturer INTEL

Socket Type rPGA988B Date Code 13+

Package/Case 1 PCS Description Brand new

SR0HR FF8062700848702 B830 Mobile Celeron Dual-Core 1.8 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001381
€10.50

SR0HR

wishlist
Compare

N10MNESA3

N10M-NE-S-A3

Part Number N1N10M-NE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001400
€16.71

N10M-NE-S-A3

wishlist
Compare

GF116200KAA1 GTS450

GF116-200-KA-A1 GTS450

Part Number GF116-200-KA-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1238

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001403
€65.64

GF116-200-KA-A1 GTS450

wishlist
Compare

2160841000

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001432
€21.77

216-0841000

wishlist
Compare

N13MGSBA2

N13M-GS-B-A2

Part Number N13M-GS-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001445
€25.93

N13M-GS-B-A2

wishlist
Compare

DC Power Jack Part PJ055

Compaq Presario DC Power Jack Connector: 900, 903, 904, 905, 906, 907, 908, 909, 910, 911, 912, 914, 915, 916, 917, 918, 919, 920, 921, 922, 925, 927, 930, 935, 940, 943, 945, 950, 955, 1500, 1505, 1507, 1508, 1510, 1515, 1522, 1523, 1525, 1527

Compaq EVO DC Power Jack Connector: N1000C, N1000V, N1005V, N1015V, N1020V

Note: This Jack is for use with AC adapter tips that are 4.75mm in diameter only. Some systems only require 2 pins of the outer Shield, all you need to do is clip off or bend up the outer shield pins you do not need.

CH003273
€7.21

DC Power Jack, Part #PJ055

wishlist
Compare

SR1EF i54210U

SR1EF i5-4210U

Part Number SR1EF i5-4210U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 440 PCS Description Original new

SR1EF i5-4210U CL8064701477802 Intel Core i5 Mobile CPU BGA1168 1.7 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001446
€211.69

SR1EF i5-4210U

wishlist
Compare
Back to top