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G98634U2

G98-634-U2

Part Number G98-634-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001522
€6.56

G98-634-U2

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N13MGEBA2

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001530
€25.93

N13M-GE-B-A2

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N13MGSSA2

N13M-GS-S-A2

Part Number N13M-GS-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001531
€16.21

N13M-GS-S-A2

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2160856050

216-0856050

Part Number 216-0856050 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1416

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001542
€20.90

216-0856050

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OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

OBDSTAR RFID Adapter

Product Name: Chip Reader

Product Data: IMMO for VW AUDI SKODA SEAT 4 & 5 GEN

Suits Products: Key Master DP/ X300 DP/ DP PAD/ Key Master/ X300 Pro3/ X100 Pro

The 4th and 5th generation for the programming of VW/AUDI/SKODA/SEAT are added as follows:

1. CDC+24C32 Types

2. NEC+24C32 Types

3. 2013 Johnson Types;

4. Motorola 9S12XHZ512 Types;

5. NEC+24C64 Color Screen- Type 1

6. NEC+24C64 Color Screen- Type 2

7. NEC+24C64 White Screen Type

8. NEC+24C64(VDO -12)Type

9. NEC+95320 Type

10. NEC+35XX Type

11. Magotan/ CC Type

12. Q7/A6L(C6)9S12DT(G)128 Type

13. Q7/A6L(C6)9S12DT(G)256 Type

14. Lifan Marvell models are added, which includes Add/Clear Keys, Program/Delete ESCL functions.

15. Jiangling MU-X models are added as key programming and key clearing.

Package includes:

1pc x OBDSTAR RFID Adapter

CH002035
€231.24

OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

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CHIP PROGRAMMER SOCKET TQFP32 QFP32 LQFP32 TO DIP32 adapter socket support ATMEGA8 series

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

Description:

Best quality, QFP32 to 32Dip Adapter

Suitable for QFP32 IC

patch size : 0.8mm 7mm * 7mm

Feature:

Support Atmel Atmega TQFP32 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP32 Atmega328 format, Pin to pin comptabile with Atmega DIP32 MCU format

Package included:

Programmer Adapter QFP32 to DIP32

CH002049
€28.00

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

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N12PNS2SA1 GT540M

N12P-NS2-S-A1 GT540M

Part Number N12P-NS2-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001548
€24.62

N12P-NS2-S-A1 GT540M

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N13MGE1SA1

N13M-GE1-S-A1

Part Number N13M-GE1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1240

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001549
€24.62

N13M-GE1-S-A1

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2160732025 HD4850M

216-0732025 HD4850M

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001562
€26.12

216-0732025 HD4850M

G98634U2

G98-634-U2

Part Number G98-634-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001522
€6.56

G98-634-U2

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N13MGEBA2

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001530
€25.93

N13M-GE-B-A2

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N13MGSSA2

N13M-GS-S-A2

Part Number N13M-GS-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001531
€16.21

N13M-GS-S-A2

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2160856050

216-0856050

Part Number 216-0856050 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1416

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001542
€20.90

216-0856050

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OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

OBDSTAR RFID Adapter

Product Name: Chip Reader

Product Data: IMMO for VW AUDI SKODA SEAT 4 & 5 GEN

Suits Products: Key Master DP/ X300 DP/ DP PAD/ Key Master/ X300 Pro3/ X100 Pro

The 4th and 5th generation for the programming of VW/AUDI/SKODA/SEAT are added as follows:

1. CDC+24C32 Types

2. NEC+24C32 Types

3. 2013 Johnson Types;

4. Motorola 9S12XHZ512 Types;

5. NEC+24C64 Color Screen- Type 1

6. NEC+24C64 Color Screen- Type 2

7. NEC+24C64 White Screen Type

8. NEC+24C64(VDO -12)Type

9. NEC+95320 Type

10. NEC+35XX Type

11. Magotan/ CC Type

12. Q7/A6L(C6)9S12DT(G)128 Type

13. Q7/A6L(C6)9S12DT(G)256 Type

14. Lifan Marvell models are added, which includes Add/Clear Keys, Program/Delete ESCL functions.

15. Jiangling MU-X models are added as key programming and key clearing.

Package includes:

1pc x OBDSTAR RFID Adapter

CH002035
€231.24

OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

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CHIP PROGRAMMER SOCKET TQFP32 QFP32 LQFP32 TO DIP32 adapter socket support ATMEGA8 series

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

Description:

Best quality, QFP32 to 32Dip Adapter

Suitable for QFP32 IC

patch size : 0.8mm 7mm * 7mm

Feature:

Support Atmel Atmega TQFP32 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP32 Atmega328 format, Pin to pin comptabile with Atmega DIP32 MCU format

Package included:

Programmer Adapter QFP32 to DIP32

CH002049
€28.00

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

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N12PNS2SA1 GT540M

N12P-NS2-S-A1 GT540M

Part Number N12P-NS2-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001548
€24.62

N12P-NS2-S-A1 GT540M

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N13MGE1SA1

N13M-GE1-S-A1

Part Number N13M-GE1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1240

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001549
€24.62

N13M-GE1-S-A1

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2160732025 HD4850M

216-0732025 HD4850M

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001562
€26.12

216-0732025 HD4850M

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