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N10MNESA3

N10M-NE-S-A3

Part Number N1N10M-NE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001400
€16.71

N10M-NE-S-A3

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SOIC8 SOP8 To DIP8 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 40CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

CH001842
€7.42

SOIC8 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

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GF116200KAA1 GTS450

GF116-200-KA-A1 GTS450

Part Number GF116-200-KA-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1238

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001403
€65.64

GF116-200-KA-A1 GTS450

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2160841000

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001432
€21.77

216-0841000

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N13MGSBA2

N13M-GS-B-A2

Part Number N13M-GS-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001445
€25.93

N13M-GS-B-A2

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SR1EF i54210U

SR1EF i5-4210U

Part Number SR1EF i5-4210U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 440 PCS Description Original new

SR1EF i5-4210U CL8064701477802 Intel Core i5 Mobile CPU BGA1168 1.7 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001446
€211.69

SR1EF i5-4210U

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2180844012 FCH Hudson M1

218-0844012 FCH Hudson M1

Part Number 218-0844012 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1247

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001458
€26.96

218-0844012 FCH Hudson M1

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NF7050620IA2

NF-050-620I-A2

Part Number NF-7050-620I-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001472
€18.46

NF-7050-620I-A2

N10MNESA3

N10M-NE-S-A3

Part Number N1N10M-NE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001400
€16.71

N10M-NE-S-A3

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SOIC8 SOP8 To DIP8 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 40CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

CH001842
€7.42

SOIC8 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

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GF116200KAA1 GTS450

GF116-200-KA-A1 GTS450

Part Number GF116-200-KA-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1238

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001403
€65.64

GF116-200-KA-A1 GTS450

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2160841000

216-0841000

Part Number 216-0841000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001432
€21.77

216-0841000

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Compare

N13MGSBA2

N13M-GS-B-A2

Part Number N13M-GS-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1428

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001445
€25.93

N13M-GS-B-A2

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SR1EF i54210U

SR1EF i5-4210U

Part Number SR1EF i5-4210U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 440 PCS Description Original new

SR1EF i5-4210U CL8064701477802 Intel Core i5 Mobile CPU BGA1168 1.7 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001446
€211.69

SR1EF i5-4210U

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2180844012 FCH Hudson M1

218-0844012 FCH Hudson M1

Part Number 218-0844012 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1247

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001458
€26.96

218-0844012 FCH Hudson M1

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Compare

NF7050620IA2

NF-050-620I-A2

Part Number NF-7050-620I-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001472
€18.46

NF-7050-620I-A2

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