N13M-GE1-S-A1

Part Number N13M-GE1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1240

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Hantek PP-150 Oscilloscope Probe Accessories with Alligator Clip 1X 10X 100MHz

Descriptions:

Integral injection molding makes the usage more flexible and the oscilloscope able to adapt more testing situations. Attenuation ratio: 1x and 10x optional. Compatible with domestic and international digital and analog oscilloscopes in relevant frequency.

Features:

Attenuation ratio: 1x and 10x optional.

Portable design according with ergonomics.

Integral injection molding makes the usage more flexible and the oscilloscope able to adapt more testing situations.

Safety standards: it has passed the CE Attestation of European Community.

Compatible with domestic and international digital and analog oscilloscopes in relevant frequency.

Measurement in intermediate and low frequency signals.

Adjusting tool: adjusts compensation capacitance to assure the rapier match with oscillograph.

Specifications:

Item PP-150

Attenuation x1 x10

Input resistance 1MO:10MO

Input capacitance x1: 85pF-115pF

x10: 18.5pF-22.5pF

Compensation scope 15pF-35pF

System bandwidth x1: DC-6MHz

x10: DC-100MHz

Input voltage x1:<200V DC +Peak AC

x10: <600V DC +Peak AC

weight 76g

Cable length 120cm

Temperature scope: Operation: -10?--+50?

Not Operation: -20?--+75?

Humidity =85% (Relative humidity)

Package Included:

1 x Oscilloscope probe

1 x adjust tool

1 x tip locating sleeve

6 x color circle

1 x instructions

216-0732025 HD4850M

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

QK0806B

216-0728018 HD4570

Part Number 216-0728018 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

TV160 LVDS FPC Conversion Link Board for LG CHIMEI Samsung

G73-N-B1

Part Number G73-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Features:

Auto ranges

True RMS measurement

550V protection in resistance and capacitor atoms

Large LCD display, MAX display 6000 counts

Sample rate: 3 times per second

Backlight

Polarity identification

Low voltage indication

20A high current measurement is available

Auto power off

Main measurements: AC / DC Voltage, AC / DC Current, Resistance, Capacitance,

Diode and Continuity Testing, Frequency and duty cycle.

Frequency: 1Hz to 20MHz

Capacitance: 10pF to 6000uF

AC volts: 0.1mV to 750V

DC volts: 0.1mV to 1000V

AC current: 0.1uA to 20A

DC current: 0.1uA to 20A

Resistance: 0.1O to 60MO

Duty cycle: 1% to 99%

Specifications:

(1) frequency: 5/50/500 / 5k / 50k / 500k / 5M / 20M (+/- 0.1 + 3)

(+/- 5.0% + 5), 1000uF / 10000uF (+/- 5.0% + 5), 100nF / 1uF / 10uF / 100uF (+/- 2.0% + 5)

(3) DC volt: 600 mV (+/- 1.0% + 10), 6V / 60V / 600V / 1000V (+/- 0.5% + 3)

(4) AC volt: 600 mV (+/- 3.0% + 3), 6 V / 60 V / 600 V / 750 V (1.0% + 3)

(5) ACA / DCA: 600uA / 6000uA (+/- 1.5% + 3), 60mA / 600mA / 20A (+/- 1.5% + 3)

(+/- 0.5% + 3),6K/60K/600K/6M(+/- 0.5% + 2),60MO(+/-1.5% + 3)

(7) Duty cycle: 1% to 99% (+/- 1%)

(8) Measurement mode: Double-integral style A / D transform

(9) Over range indication: OL

(10) Working environment: 0 ~ 40 ?, relative humidity Less than 80%

(11) Supply power: 3V (1.5V AA batteries * 2 Pcs) (Not included)

(12) Dimension: 180*90*45mm

(13)Material:plastic

(14)Color:Blue

Package List:

1 x VC15B + multimeter

1 x a pair of test leads

1 x User manual

Only the above package content, other products are not included.

Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

SR1UU J1800

Part Number SR1UU J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1UU J1800 FH8065301615104 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N14P-GT-W-A2

Part Number N14P-GT-W-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR23Q M-5Y71

Part Number SR23Q M-5Y71 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0810084

Part Number 216-0810084 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 360 pcs Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock