216-0749001 HD5470

Part Number 216-0749001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

Top 6 Reasons To Get FGTech Galletto 4

1. Latest Version: V54

2. Supported Operating System: windows XP. more friendly than Fgtech v53 , much easier to operate

3. Unlock Version: Can Use Directly. No Need To Activate

4. FGTECH V54 PCB board

5. Supported Language: English, Italian, German, French, Spanish, Portuguese, Czech, Turkish

6. Support Tricore Function

FG Tech Galletto 4-Master V54 BDM-OBD is a famous chip tuning tool for all cars, trucks, motorcycles, Marine, BDM MPCxx, BDM Boot Mode , checksum. This item cannot only work as FGTech Galletto 4-Master, but can also work for BDM-OBD.

FGTech Galletto 4-Master this new system developed with high-speed USB2 technology is the fastest and most secure product on the market, it is easy to install and use by anyone. Our system comes furnished complete with all Car, Truck, Motorbyke, Marine, BDM MPCxx , BDM Boot Mode, checksum.

Boot Mode System:

Infineon Sak TC1766

Infineon Sak TC1767

Infineon Sak TC1792

Infineon Sak TC1796

Infineon Sak TC1797

NEW JTAG - BDM - MOTOROLA - FREESCALE - INFINEON

Freescale MPC 5553/5554/5565/5566 NEXSUS PORT New IAW MJD 8F2 - Mair 8GMF

New Delphy DCM3.5xx DCM3.7xx TRW

Motorola Freescale MPC 555/556/561/562/563/564/565

Motorola MC 68332 - MC YQQCU - MC 68377 Trionic 5/7/8 GM-OPEL-SAAB

Motorola MC 68376 Campi 01 Lamborghini - Lotus

Motorola MC 68336 MEMS D5 ROVER

Motorola ZC 439615 - ZC 439507 IAW FIAT - VAG

New Line OBD protocols VPM GM - Hummer-Corvette-Munstang-Blazer-Cadilac

New Line OBD protocols Tx-Rx - Subaru - Mitsubischi - Hitachi - Denso ecu

All EDC17 MED17 is good always modify with Boot Mode .

Automatic Checksum:

All old protocols included from Bosch MExx / EDCxx / Marelli / Siemens / Delpy / Lucas / Denso

Boot Mode C167x / ST10, Boot Mode Infineon With password Bosch , Siemens

Motorola MC68332 - MCYQQCU - MC68377 , MC68376 , MC68336, ZC439615 ,ZC439507

Motorola Freescale MPC 555/556/561/562/563/564/565

Freescale MPC 5553/5554/5565/5566

BDM .

5-30V Car / Industrial Vehicles, L line / K line KWP, CAN

Can Bus V2.0 50Kb > 1000Kb

J1850 VPW PWM GM -FORD

Rx Tx RS232,

RS 485,

Automatic setup Pull up K-L line 250, 500, 1000 ohm,

Automatic setup termination Can bus 0, 60,120 ohm,

Master Version:

Recovery Mode Completa

Funzione scan tool per eliminare i DTC

Function scan tool for erase the DTC

Controllo tensione di batteria auto in tempo reale

Check tension of battery car in real time

Package including:

1pc x New version main interface

1pc x ECU cable for boot

1pc x Adapter for BDM to CMD with bdm cables

3pcs x BDM adapters

6pcs x BDM connectors

2pcs x Power cable

1pc x OBD2 cable

1pc x USB cable (1.5meter)

1pc x CD (2012 version SW -MASTER, documents pdf, pictures, etc.)

Taiwan lead-free high quality 936 iron head

Characteristic:

1. special cast iron process, corrosion resistance, oxidation resistance, especially for long life.

2. strong immersion prolonged, easy to melt, Shangxi, solder joint round.

3. ? uniform inductance, stable quality, lead-free material.

4. lead-free environmental production, has passed the SGS test.

All soldering stations used in the 900M-T series

Such as table machine, 936 series welding platform

900M series lead-free soldering iron

? made of pure copper components, high thermal conductivity, fast heat transfer

? special iron surface plating, high temperature resistance, corrosion resistance

Special process, suitable for lead-free solder welding

? strong tin capacity, no oxidation, no tin, no tin, tin climbing phenomenon

? the outer layer is bright and delicate and very strong in rust resistance

? this product has passed the SGS environmental protection test

Life of soldering iron head

The life of the iron head is determined by the number of welds, and the length of life guaranteed depends on the coating thickness of the head. The thicker the coating, the longer the life of the iron head, but the heat transfer efficiency will be greatly reduced, the life of the iron tip for the same temperature series of iron head, fine iron head, life expectancy than a rough iron head life is shorter. Because the iron head is working, it will inevitably cause wear and tear on the surface of the nozzle life. Therefore, the fine iron head is more prone to wear, so to reduce the life of the soldering iron.

Maintenance of iron head

The use of new electric iron, electric iron can not bring the new use, need to be plated with a layer of solder in the iron head method is: according to the power supply when the temperature gradually increased, the rosin coated iron head; rosin smoke, to melt the solder iron head, with a the solder layer so as to strengthen the tip life.

IC Chip Extractor Motherboard Circuit Board Component Puller Tool

LVDS Cable Acer E5-721

Part Number Acer E5-721 Manufacturer Acer

Type LVDS Cable Date Code 16+

Package/Case 1 PCS Description Original new

218-0755042 HD6650

Part Number 218-0755034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

BD82H55 SLGZX

Part Number BD82H55 SLGZX Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1115

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

RT809H special seat mobile phone EMMC jumping seat EMMC153 seat EMMC169 adapter seat reading and writing seat mobile phone repair seat

Limit frame specification: 11.5*13mm, 11*10mm, 12*16mm, 14*18mm

Buy Limit Frame: * 11*10mm, 12*16mm, 14*18mm

GD9980 Thermal Conductive Adhesive

Color White Thermal Conductivity >0.671 W/m-K

Speciflc Gravity >2.4g/Cc Operating Temperature -4~482?

Setting Time 5~8min Net Weight 85 Grams

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: Download software Device List

Field of application:

This programmer can read and write the bios chips of DVD,TV,PC,harddisk,etc.

Features:

1. USB 2.0 interface, the speed is 12Mbps.

2. The speed of reading and writing is fast.

3. Auto detect chip modles.

4. Auto select power votage.

5. Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

6. Small shape.

7. Windows XP, Windows Vista, Win7,WIN8,WIN10.

List:

1. Programmer 1

2. Usb cable 1

3. CD 1

4. Manual(a file on CD) 1

5. Simple socket for SMD chips 2

Features:

Model: Camera with HDMI USB2.0 two output

Image format: jpg

Image resolution: 48 MegaPixel

Video format: MP4(for TF card)

Video re corder: 1080P@60FPS

HDMI Video resolution: 1920*1080 @ 60FPS

USB Video resolution: 1920*1080@30FPS; 1280*720@30FPS; 640*480@30FPS; 320*240@30FPS

White Balance: Auto/Manual

Light: Auto/Manual

Exposure: Auto/Manual, value adjustable

Color: Color

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese/French/Spanish/Japanese/German

Line: different color,5 horizontal line , 5 vertical line,any positions

Specification:

Image sensor: 48megapixel CMOS sensor 1/2.33 inch

Effective pixel: 48 megapixel

Pixel size:1.335m 1.335m

Frame rate:60fps

Definition:FULL HD

Housing:metal

Lens:C/CS

Video format: MOV

Digital Zoom:Support

Brightness control:Auto/manual

Color:R/G/B adjustable

Film and re cord:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:

Support multi-color, 5 pcs of transverse lines/vertical lines, moveable

Different color,5 horizontal line , 5 vertical line,any positions

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

USB interface:Standard usb2.0 interface (Type B)

Input Voltage: DC 12V

Working distance: 55mm-700mm

Field of view: 4mm-100mm

zoom c-mount Lens

zoom ratios: 15:1

Magnification Power by 120X

Size: 110mm(L) * 28mm(DIA)

With 35mm ring adapter

Package includes:

1 * HDMI camera

1 * HDMI cable

1 * remote control

1 * C-MOUNT Lens

1 * 12V power supply

1 * Table Stand

Note:

We will send you a plug adapter according to your country.

This product does not include a monitor

N13P-GLR-A1 GT635M

Part Number N13P-GLR-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1304

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock