• Show Sidebar

There are 2062 products.

Active filters

  • Categories: EFI Rom Cable
  • Categories: Other BGA Chips & ICs
  • Categories: Pin Holder
  • Categories: Programmer & Sockets
wishlist
Compare
Quickview

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA100-01 V2.5

1pcs x Frame 14x18

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH001979
€89.00

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

wishlist
Compare
Quickview

ITE IT8502E KXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000652
€3.45

ITE IT8502E (KXO)

wishlist
Compare
Quickview

ITE IT8585VG FXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000655
€6.35

ITE IT8585VG FXO

wishlist
Compare
Quickview

MXIC MX25L1605DM2I

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000659
€3.45

MXIC MX25L1605DM2I

wishlist
Compare
Quickview

OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

OBDSTAR RFID Adapter

Product Name: Chip Reader

Product Data: IMMO for VW AUDI SKODA SEAT 4 & 5 GEN

Suits Products: Key Master DP/ X300 DP/ DP PAD/ Key Master/ X300 Pro3/ X100 Pro

The 4th and 5th generation for the programming of VW/AUDI/SKODA/SEAT are added as follows:

1. CDC+24C32 Types

2. NEC+24C32 Types

3. 2013 Johnson Types;

4. Motorola 9S12XHZ512 Types;

5. NEC+24C64 Color Screen- Type 1

6. NEC+24C64 Color Screen- Type 2

7. NEC+24C64 White Screen Type

8. NEC+24C64(VDO -12)Type

9. NEC+95320 Type

10. NEC+35XX Type

11. Magotan/ CC Type

12. Q7/A6L(C6)9S12DT(G)128 Type

13. Q7/A6L(C6)9S12DT(G)256 Type

14. Lifan Marvell models are added, which includes Add/Clear Keys, Program/Delete ESCL functions.

15. Jiangling MU-X models are added as key programming and key clearing.

Package includes:

1pc x OBDSTAR RFID Adapter

CH002035
€231.24

OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

wishlist
Compare
Quickview

BGEE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000661
€3.45

BG=EE

wishlist
Compare
Quickview

CHIP PROGRAMMER SOCKET TQFP32 QFP32 LQFP32 TO DIP32 adapter socket support ATMEGA8 series

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

Description:

Best quality, QFP32 to 32Dip Adapter

Suitable for QFP32 IC

patch size : 0.8mm 7mm * 7mm

Feature:

Support Atmel Atmega TQFP32 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP32 Atmega328 format, Pin to pin comptabile with Atmega DIP32 MCU format

Package included:

Programmer Adapter QFP32 to DIP32

CH002049
€28.00

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

wishlist
Compare
Quickview

SIS 630S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000664
€15.89

SIS 630S

wishlist
Compare
Quickview

R270 V120 CAS4 BDM Key Programmer For BMW Cars 20012009 Auto Diagnostic Tool

1. Software Version: 1.2

2. Supported for BMW Car Model Year: Most 2001-2009

3. Support M35080 Series of Quick Clear, Read and Write (35080/35080-V6/35080-VP/D80 D0WQ/D160/35160, etc.)

Language: English

Description:

Directly read and write chip data quickly and safely, support the new 2009 7 Series (F01/F02) CAS4 odometer and chips read and write data,safe and effective.

CAS4 includes all the features of CAS3 programmer. It has a powerful Motorola MCU programming function: removing-free programm Motorola MCU EEPROM (HC908) and FLASH (HC912, HC9S12, HC9S12X) series.

Function:

1.Support CAS and CAS4 (0K50E/2K79X/0L01Y/0L15Y/1L15Y, etc.)

2.Support EWS4 (2L86D)

3.Support for Benz EZS (1J35D/2J74Y/4J74Y/3K91D/1L85D/1L59W/3L40K/4L 40K, etc.)

4.Supports a variety of SRS modules:(9H91F/0K13J/0K75F/0L85D/0J38M/1E62H/1K7 9X/5H55W, etc.)

5.Applicable to all kinds of EIS/CAS/SRS/ECU automotive modules.

Package List:

1x R270 Main Unit

1x 26Pin Cable

1x AC Adapter

1x USB Cable

1x Adapter

1x CD Drive

CH002056
€47.24

R270 V1.20 CAS4 BDM Key Programmer For BMW Cars (2001-2009) Auto Diagnostic Tool

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA100-01 V2.5

1pcs x Frame 14x18

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH001979
€89.00

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

wishlist
Compare

ITE IT8502E KXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000652
€3.45

ITE IT8502E (KXO)

wishlist
Compare

ITE IT8585VG FXO

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000655
€6.35

ITE IT8585VG FXO

wishlist
Compare

MXIC MX25L1605DM2I

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000659
€3.45

MXIC MX25L1605DM2I

wishlist
Compare

OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

OBDSTAR RFID Adapter

Product Name: Chip Reader

Product Data: IMMO for VW AUDI SKODA SEAT 4 & 5 GEN

Suits Products: Key Master DP/ X300 DP/ DP PAD/ Key Master/ X300 Pro3/ X100 Pro

The 4th and 5th generation for the programming of VW/AUDI/SKODA/SEAT are added as follows:

1. CDC+24C32 Types

2. NEC+24C32 Types

3. 2013 Johnson Types;

4. Motorola 9S12XHZ512 Types;

5. NEC+24C64 Color Screen- Type 1

6. NEC+24C64 Color Screen- Type 2

7. NEC+24C64 White Screen Type

8. NEC+24C64(VDO -12)Type

9. NEC+95320 Type

10. NEC+35XX Type

11. Magotan/ CC Type

12. Q7/A6L(C6)9S12DT(G)128 Type

13. Q7/A6L(C6)9S12DT(G)256 Type

14. Lifan Marvell models are added, which includes Add/Clear Keys, Program/Delete ESCL functions.

15. Jiangling MU-X models are added as key programming and key clearing.

Package includes:

1pc x OBDSTAR RFID Adapter

CH002035
€231.24

OBDSTAR RFID Adapter Chip Reader Immo for VW Audi Skoda Seat

wishlist
Compare

BGEE

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000661
€3.45

BG=EE

wishlist
Compare

CHIP PROGRAMMER SOCKET TQFP32 QFP32 LQFP32 TO DIP32 adapter socket support ATMEGA8 series

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

Description:

Best quality, QFP32 to 32Dip Adapter

Suitable for QFP32 IC

patch size : 0.8mm 7mm * 7mm

Feature:

Support Atmel Atmega TQFP32 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP32 Atmega328 format, Pin to pin comptabile with Atmega DIP32 MCU format

Package included:

Programmer Adapter QFP32 to DIP32

CH002049
€28.00

CHIP PROGRAMMER SOCKET TQFP32 QFP32/ LQFP32 TO DIP32 adapter socket support ATMEGA8 series

wishlist
Compare

SIS 630S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000664
€15.89

SIS 630S

wishlist
Compare

R270 V120 CAS4 BDM Key Programmer For BMW Cars 20012009 Auto Diagnostic Tool

1. Software Version: 1.2

2. Supported for BMW Car Model Year: Most 2001-2009

3. Support M35080 Series of Quick Clear, Read and Write (35080/35080-V6/35080-VP/D80 D0WQ/D160/35160, etc.)

Language: English

Description:

Directly read and write chip data quickly and safely, support the new 2009 7 Series (F01/F02) CAS4 odometer and chips read and write data,safe and effective.

CAS4 includes all the features of CAS3 programmer. It has a powerful Motorola MCU programming function: removing-free programm Motorola MCU EEPROM (HC908) and FLASH (HC912, HC9S12, HC9S12X) series.

Function:

1.Support CAS and CAS4 (0K50E/2K79X/0L01Y/0L15Y/1L15Y, etc.)

2.Support EWS4 (2L86D)

3.Support for Benz EZS (1J35D/2J74Y/4J74Y/3K91D/1L85D/1L59W/3L40K/4L 40K, etc.)

4.Supports a variety of SRS modules:(9H91F/0K13J/0K75F/0L85D/0J38M/1E62H/1K7 9X/5H55W, etc.)

5.Applicable to all kinds of EIS/CAS/SRS/ECU automotive modules.

Package List:

1x R270 Main Unit

1x 26Pin Cable

1x AC Adapter

1x USB Cable

1x Adapter

1x CD Drive

CH002056
€47.24

R270 V1.20 CAS4 BDM Key Programmer For BMW Cars (2001-2009) Auto Diagnostic Tool

wishlist
Compare
Back to top