Buy Limit Frame: * 11.5*13mm, 12*16mm, 12*18mm, 14*18mm
Product Characteristics
1. Using standard SD interface mode, the corresponding operation such as test or burning can be realized by connecting card reader with computer or through SD interface of programmer.
2. Compatible with ball-and-ball testing, IC limit frame is molded in one. It can be replaced by different size limit frame according to IC, so that IC of different size can be used universally.
3. Supporting hot plug-in and testing for PIN connection through SD interface or through connection with board row;
4. PCB adopts four-layer circuit structure to reduce the instability of test caused by signal interference. The golden finger is plated with thick gold to ensure durability and contact.
5. At the same time compatible: Toshiba, Samsung, Hynix, Intel, Sandisk and other brand IC;
6. Compatible with 153-FBGA 169-FBGA;
7. The shrapnel is stamped by imported beryllium copper through high precision die, the head-shaped probe is designed, and the later stage is hardened and plated with thick gold layer to ensure the stability and durability of the product.
8. The whole structure of the contact module reduces the repetitive positioning problem, ensures the precise alignment between the contact point and the IC PAD, and has a high pass rate in one test.
9. The through-hole welding structure is adopted to ensure good contact, and the positioning holes of SOCKET and PCBA are precisely positioned to facilitate replacement.
10. The top-window structure is adopted, which is compatible with manual and automatic testing and easy to operate.
11. Pressure IC adopts self-adapting structure of integral moulding and spring, which ensures that IC with different thickness does not need any adjustment to ensure good contact and wide universality of IC for testing.
12. The structure is formed by injection moulding, with precise positioning, easy access to IC and higher working efficiency.
