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SR23Q M5Y71

SR23Q M-5Y71

Part Number SR23Q M-5Y71 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001644
€57.44

SR23Q M-5Y71

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2160810084

216-0810084

Part Number 216-0810084 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 360 pcs Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001661
€40.05

216-0810084

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N10MGSSA3

N10M-GS-S-A3

Part Number N10M-GS-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001664
€16.89

N10M-GS-S-A3

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FX150 Conductor Wire 002mm

FX-150 Conductor Wire 0.02mm

Tracking Line conductor

Description:

Brand New and high quality!

150 m / Roll of 0.02mm Copper Welding Wire

Can be used to connect Jump cable for Computer and Mobile Phone Repair Base Plate

There is no need to remove the Lacquer, Direct welding

Specification:

Material: Copper

Diameter: 0.02mm

Gross Weight: 12.20g

Storage: on

Please use a small bag deoxidizer and a desiccant sealed if long time no use

What's in the package:

1 Roll (150 m) * 0.02mm Copper Welding Wire (Vacuum sealed)

CH001049
€7.34

FX-150 Conductor Wire 0.02mm

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DH82HM86 SR17E

DH82HM86 SR17E

Part Number DH82HM86 SR17E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1436

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001667
€45.95

DH82HM86 SR17E

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N10MNSSB1 G103M

N10M-NS-S-B1 G103M

Part Number N10M-NS-S-B1 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001672
€15.59

N10M-NS-S-B1 G103M

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25K Qwin 040mm BGA Leaded Solder Balls

25K Qwin 0.40mm BGA Leaded Solder Balls

Part Number 0.40mm BGA Leaded Solder Balls Manufacturer Qwin

BGA Alloy Sn63/Pb37 Date Code 19+

Package/Case 25K Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001078
€3.11

25K Qwin 0.40mm BGA Leaded Solder Balls

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G84600A2 8600MGT 128Bit 256Mb

G84-600-A2 8600MGT 128Bit 256Mb

Part Number G84-600-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1327

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001678
€49.23

G84-600-A2 8600MGT 128Bit 256Mb

SR23Q M5Y71

SR23Q M-5Y71

Part Number SR23Q M-5Y71 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001644
€57.44

SR23Q M-5Y71

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2160810084

216-0810084

Part Number 216-0810084 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 360 pcs Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001661
€40.05

216-0810084

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Compare

N10MGSSA3

N10M-GS-S-A3

Part Number N10M-GS-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001664
€16.89

N10M-GS-S-A3

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FX150 Conductor Wire 002mm

FX-150 Conductor Wire 0.02mm

Tracking Line conductor

Description:

Brand New and high quality!

150 m / Roll of 0.02mm Copper Welding Wire

Can be used to connect Jump cable for Computer and Mobile Phone Repair Base Plate

There is no need to remove the Lacquer, Direct welding

Specification:

Material: Copper

Diameter: 0.02mm

Gross Weight: 12.20g

Storage: on

Please use a small bag deoxidizer and a desiccant sealed if long time no use

What's in the package:

1 Roll (150 m) * 0.02mm Copper Welding Wire (Vacuum sealed)

CH001049
€7.34

FX-150 Conductor Wire 0.02mm

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DH82HM86 SR17E

DH82HM86 SR17E

Part Number DH82HM86 SR17E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1436

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001667
€45.95

DH82HM86 SR17E

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N10MNSSB1 G103M

N10M-NS-S-B1 G103M

Part Number N10M-NS-S-B1 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001672
€15.59

N10M-NS-S-B1 G103M

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25K Qwin 040mm BGA Leaded Solder Balls

25K Qwin 0.40mm BGA Leaded Solder Balls

Part Number 0.40mm BGA Leaded Solder Balls Manufacturer Qwin

BGA Alloy Sn63/Pb37 Date Code 19+

Package/Case 25K Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001078
€3.11

25K Qwin 0.40mm BGA Leaded Solder Balls

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Compare

G84600A2 8600MGT 128Bit 256Mb

G84-600-A2 8600MGT 128Bit 256Mb

Part Number G84-600-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1327

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001678
€49.23

G84-600-A2 8600MGT 128Bit 256Mb

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