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2160728018 HD4570

216-0728018 HD4570

Part Number 216-0728018 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001572
€66.17

216-0728018 HD4570

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EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 3264bit

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include(5 items):

1 x EZP2013 programmer;

1 x USB 2.0 12Mbps cable;

1 x CD with user manual and install software & driver;

2 x Simple SMD PIN8 DIP

CH002058
€13.30

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 32/64bit

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G73NB1

G73-N-B1

Part Number G73-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001582
€21.33

G73-N-B1

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STXRLINK STM8 ST7 STM32 STR7 STR9 Incircuit Debugger Programmer Supporting JTAG and ICC Protocols

STX-RLINK is adapted for the St series MCU a versatile Tools for Economic Development. It can be downloaded on line simulation and St stm8, ST7, STM32, str7 and str9 Family of devices.

Software supported

The direct support of ride7 raisonance and rflasher7.

Official St IDE (Integrated Development Environment software) ST (STVD) visual Development and visual recording software program (St stvp).

Compatible Devices

Swim interface with support for all the stm8 MCU

Supports all ST7 MCU interface with ICC

With JTAG interface supports all str7 / SWD STM32 MCU, and str9

Functionality, performance

Functions of programming: The Programming of Flash ROM, EEPROM, etc.

The Simulation Capabilities: support to run at full speed, stepping, breakpoints, and another method of Cleansing, you can see the State of the variable Data, etc.

Simulation of Performance debugging Simulation: USB2.0 interface, Step by step, breakpoints, Rapid Response!

Program Performance: USB2.0 interface to swim / ICC / / SWD JTAG download, download speed!

Special Note: STX RLINK can't Trace. Original explained as follows:

The RLINK includes no support for Tracing devices based on arm kernel and Trace macrocell with Embedded System such as str9. With the capacity of monitoring tools are available in the str9 Professional Developer Kit (DK / raisonance str9 - Signum jtagjet RAIS), and in the str91x Advanced Developer's kit (IAR str91xdk / IAR) with J Trace.

Using the USB Interface to connect the PC

STX RLINK Integrated Development Tools, drivers, USB high speed communication.

Upgradeable firmware

In the Future, will launch more St stm8, ST7, STM32, str7 and str9 Models, the new device is added to the list of compatible devices and ride7 STVD Model, when you need to use in the future development of new models, and updates ride7 STVD, Firmware Update, should be supported by new models

Package Contains:

STX RLINK x 1

USB type B type cable x 1

Swim cable x 1

ICC / 4 - pin Adapter Adapter x 1 swim

JTAG Adapter x 1

SWD 20 pin JTAG - x 1

Does not contain CD software program

CH002083
€171.56

STX-RLINK STM8 ST7 STM32 STR7 STR9 In-circuit Debugger Programmer Supporting JTAG and ICC Protocols

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SR1UU J1800

SR1UU J1800

Part Number SR1UU J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1UU J1800 FH8065301615104 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001585
€41.52

SR1UU J1800

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TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for RT809H TNM5000 Programmer - Pin to Pin

CH002085
€28.00

TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

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N14PGTWA2

N14P-GT-W-A2

Part Number N14P-GT-W-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001624
€57.44

N14P-GT-W-A2

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SR23Q M5Y71

SR23Q M-5Y71

Part Number SR23Q M-5Y71 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001644
€57.44

SR23Q M-5Y71

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2160810084

216-0810084

Part Number 216-0810084 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 360 pcs Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001661
€40.05

216-0810084

2160728018 HD4570

216-0728018 HD4570

Part Number 216-0728018 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001572
€66.17

216-0728018 HD4570

wishlist
Compare

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 3264bit

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include(5 items):

1 x EZP2013 programmer;

1 x USB 2.0 12Mbps cable;

1 x CD with user manual and install software & driver;

2 x Simple SMD PIN8 DIP

CH002058
€13.30

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 32/64bit

wishlist
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G73NB1

G73-N-B1

Part Number G73-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001582
€21.33

G73-N-B1

wishlist
Compare

STXRLINK STM8 ST7 STM32 STR7 STR9 Incircuit Debugger Programmer Supporting JTAG and ICC Protocols

STX-RLINK is adapted for the St series MCU a versatile Tools for Economic Development. It can be downloaded on line simulation and St stm8, ST7, STM32, str7 and str9 Family of devices.

Software supported

The direct support of ride7 raisonance and rflasher7.

Official St IDE (Integrated Development Environment software) ST (STVD) visual Development and visual recording software program (St stvp).

Compatible Devices

Swim interface with support for all the stm8 MCU

Supports all ST7 MCU interface with ICC

With JTAG interface supports all str7 / SWD STM32 MCU, and str9

Functionality, performance

Functions of programming: The Programming of Flash ROM, EEPROM, etc.

The Simulation Capabilities: support to run at full speed, stepping, breakpoints, and another method of Cleansing, you can see the State of the variable Data, etc.

Simulation of Performance debugging Simulation: USB2.0 interface, Step by step, breakpoints, Rapid Response!

Program Performance: USB2.0 interface to swim / ICC / / SWD JTAG download, download speed!

Special Note: STX RLINK can't Trace. Original explained as follows:

The RLINK includes no support for Tracing devices based on arm kernel and Trace macrocell with Embedded System such as str9. With the capacity of monitoring tools are available in the str9 Professional Developer Kit (DK / raisonance str9 - Signum jtagjet RAIS), and in the str91x Advanced Developer's kit (IAR str91xdk / IAR) with J Trace.

Using the USB Interface to connect the PC

STX RLINK Integrated Development Tools, drivers, USB high speed communication.

Upgradeable firmware

In the Future, will launch more St stm8, ST7, STM32, str7 and str9 Models, the new device is added to the list of compatible devices and ride7 STVD Model, when you need to use in the future development of new models, and updates ride7 STVD, Firmware Update, should be supported by new models

Package Contains:

STX RLINK x 1

USB type B type cable x 1

Swim cable x 1

ICC / 4 - pin Adapter Adapter x 1 swim

JTAG Adapter x 1

SWD 20 pin JTAG - x 1

Does not contain CD software program

CH002083
€171.56

STX-RLINK STM8 ST7 STM32 STR7 STR9 In-circuit Debugger Programmer Supporting JTAG and ICC Protocols

wishlist
Compare

SR1UU J1800

SR1UU J1800

Part Number SR1UU J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1UU J1800 FH8065301615104 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001585
€41.52

SR1UU J1800

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Compare

TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for RT809H TNM5000 Programmer - Pin to Pin

CH002085
€28.00

TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

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N14PGTWA2

N14P-GT-W-A2

Part Number N14P-GT-W-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001624
€57.44

N14P-GT-W-A2

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SR23Q M5Y71

SR23Q M-5Y71

Part Number SR23Q M-5Y71 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001644
€57.44

SR23Q M-5Y71

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2160810084

216-0810084

Part Number 216-0810084 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 360 pcs Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001661
€40.05

216-0810084

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Compare
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