• Show Sidebar

There are 5250 products.

Active filters

wishlist
Compare
Quickview

SOIC16 SOP16 To DIP16 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

SOIC16 SOP16 To DIP16 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 30CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

CH003154
€9.95

SOIC16 SOP16 To DIP16 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

wishlist
Compare
Quickview

INTEL PC87392VJG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003156
€3.45

INTEL PC87392-VJG

wishlist
Compare
Quickview

AM2302 Digital Temperature Humidity Sensor Temperature Humidity Module Replace DHT22 SHT11 SHT15

AM2302 Digital Temperature Humidity Sensor Temperature Humidity Module Replace DHT22 SHT11 SHT15

Product Overview

AM2302 digital temperature and humidity sensor is a calibrated digital output signal containing temperature and humidity sensor complex. It uses a dedicated digital modules collection technology and temperature and humidity sensor technology to ensure that products with high reliability and excellent long-term stability. Includes a capacitive sensor element and a sense of wet NTC temperature measurement devices, and with a high-performance 8-bit microcontroller connected. Therefore, the product has excellent quality, fast response, anti-interference ability, high cost and other advantages. Each AM2302 sensors are extremely accurate calibration of humidity calibration chamber. Calibration coefficients stored in the form of a program OTP memory, internal sensor detection signals in the process to call these calibration coefficients. Single-wire serial interface, the system integration becomes simpler and faster. Ultra-small size, low power consumption, signal transmission distance up to 20 meters or more, making all kinds of applications and even the most demanding applications is the best selection. Products for the 4-pin single row pin package. Easy connection, special packages can be provided according to user needs.

Applications

HVAC, dehumidifiers, testing and inspection equipment, consumer goods, automotive, automation, data loggers, appliances, humidifiers, medical, weather, and other relevant humidity detection control.

Highlights

Ultra-low power, transmission distance, fully automated calibration, using capacitive humidity sensor, completely interchangeable, standard digital single-bus output, excellent long-term stability, high precision NTC.

CH003157
€6.19

AM2302 Digital Temperature Humidity Sensor Temperature Humidity Module Replace DHT22 SHT11 SHT15

wishlist
Compare
Quickview

G96600A1 9600MGS

G96-600-A1 9600MGS

Part Number G96-600-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1131

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003158
€25.93

G96-600-A1 9600MGS

wishlist
Compare
Quickview

QF9EES Stencil Template

QF9EES Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003160
€6.22

QF9EES Stencil Template

wishlist
Compare
Quickview

G86730A2 8400MGS

G86-730-A2 8400MGS

Part Number G86-730-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1019

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003161
€54.97

G86-730-A2 8400MGS

wishlist
Compare
Quickview

AM4657DFE44HJ Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003163
€5.40

AM4657DFE44HJ Stencil Template

wishlist
Compare
Quickview

TI BQ24164

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003164
€3.45

TI BQ24164

wishlist
Compare
Quickview

N11PGS1A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003165
€5.40

N11P-GS1-A2 Stencil Template

SOIC16 SOP16 To DIP16 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

SOIC16 SOP16 To DIP16 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 30CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

CH003154
€9.95

SOIC16 SOP16 To DIP16 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

wishlist
Compare

INTEL PC87392VJG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003156
€3.45

INTEL PC87392-VJG

wishlist
Compare

AM2302 Digital Temperature Humidity Sensor Temperature Humidity Module Replace DHT22 SHT11 SHT15

AM2302 Digital Temperature Humidity Sensor Temperature Humidity Module Replace DHT22 SHT11 SHT15

Product Overview

AM2302 digital temperature and humidity sensor is a calibrated digital output signal containing temperature and humidity sensor complex. It uses a dedicated digital modules collection technology and temperature and humidity sensor technology to ensure that products with high reliability and excellent long-term stability. Includes a capacitive sensor element and a sense of wet NTC temperature measurement devices, and with a high-performance 8-bit microcontroller connected. Therefore, the product has excellent quality, fast response, anti-interference ability, high cost and other advantages. Each AM2302 sensors are extremely accurate calibration of humidity calibration chamber. Calibration coefficients stored in the form of a program OTP memory, internal sensor detection signals in the process to call these calibration coefficients. Single-wire serial interface, the system integration becomes simpler and faster. Ultra-small size, low power consumption, signal transmission distance up to 20 meters or more, making all kinds of applications and even the most demanding applications is the best selection. Products for the 4-pin single row pin package. Easy connection, special packages can be provided according to user needs.

Applications

HVAC, dehumidifiers, testing and inspection equipment, consumer goods, automotive, automation, data loggers, appliances, humidifiers, medical, weather, and other relevant humidity detection control.

Highlights

Ultra-low power, transmission distance, fully automated calibration, using capacitive humidity sensor, completely interchangeable, standard digital single-bus output, excellent long-term stability, high precision NTC.

CH003157
€6.19

AM2302 Digital Temperature Humidity Sensor Temperature Humidity Module Replace DHT22 SHT11 SHT15

wishlist
Compare

G96600A1 9600MGS

G96-600-A1 9600MGS

Part Number G96-600-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1131

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003158
€25.93

G96-600-A1 9600MGS

wishlist
Compare

QF9EES Stencil Template

QF9EES Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003160
€6.22

QF9EES Stencil Template

wishlist
Compare

G86730A2 8400MGS

G86-730-A2 8400MGS

Part Number G86-730-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1019

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003161
€54.97

G86-730-A2 8400MGS

wishlist
Compare

AM4657DFE44HJ Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003163
€5.40

AM4657DFE44HJ Stencil Template

wishlist
Compare

TI BQ24164

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003164
€3.45

TI BQ24164

wishlist
Compare

N11PGS1A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003165
€5.40

N11P-GS1-A2 Stencil Template

wishlist
Compare
Back to top