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  • Categories: BGA Reballing Kits, Stencils
  • Categories: DC Jacks, Connector
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G84601A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000802
€5.40

G84-601-A2 Stencil Template

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M5Y31 SR23G Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000803
€7.46

M-5Y31 SR23G Stencil Template

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G73VZANA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000809
€5.40

G73-VZA-N-A2 Stencil Template

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N4000 SR3S1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000810
€14.92

N4000 SR3S1 Stencil Template 90*90

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DC Power Jack Part PJ060

Compaq Mini 700 Series DC Power Jack Connector: 700, 700EA, 700ED, 700EE, 700EF, 700EI, 700EK, 700EL, 700EN, 700EP, 700ER, 700ES, 700ET, 700EW, 701ED, 701EG, 701EM, 701EN, 701ER, 701ES, 701ET, 702EA, 702EG, 703EA, 705EI, 705EL, 705ES, 730, 730EB, 730EE, 730EJ, 730EO, 730EV, 730EQ, 730EZ, 731EH, 731EI, 731ET, 732EG, 732ET, 733EF, 735EF, 735EI, 735EJ, 735EO, 735EQ

HP Mini 1000 Series DC Power Jack Connector: 1000, 1000 CTO, 1001XX, 1001TU, 1002TU, 1002XX, 1003TU, 1004TU, 1005TU, 1006TU, 1007TU, 1008TU, 1009TU, 1010LA, 1010NR, 1010TU, 1011TU, 1012TU, 1013TU, 1014TU, 1015TU, 1016TU, 1017TU, 1020LA, 1021TU, 1022TU, 1023TU, 1024TU, 1025TU, 1030NR, 1033CL, 1035NR, 1050LA, 1090LA, 1100, 1100 CTO, 1100CM, 1101TU, 1102TU, 1103TU, 1104TU, 1105TU, 1106TU, 1107TU, 1108TU, 1109TU, 1110NR, 1110TU, 1112TU, 1113TU, 1114TU, 1115NR, 1115TU, 1116NR, 1116TU, 1118TU, 1119TU, 1120LA, 1120BR, 1120NR, 1121TU, 1122TU, 1123TU, 1124TU, 1125NR, 1125TU, 1126NR, 1126TU, 1127TU, 1128TU, 1129TU, 1130CM, 1131TU, 1132TU, 1133CA, 1135CA, 1137NR, 1139NR, 1150BR, 1150CM, 1150NR, 1151NR, 1152NR, 1153NR, 1154NR, 1160CM, 1170CM, 1180CM

HP Mini 1000 Vivienne Tam Edition DC Power Jack Connector: 1000, 1018TU, 1019TU, 1020TU, 1097EI, 1098EI, 1099EA, 1099ED, 1099EE, 1099EF, 1099EG, 1099EK, 1099EL, 1099EI, 1099EM, 1099EN, 1099EP, 1099ER, 1099ES, 1099ET, 1099EW, 1100, 1100 CTO, 1111TU, 1117TU, 1120TU, 1140NR, 1141NR, 1198EO, 1199EA, 1199EB, 1199EC, 1199EE, 1199EH, 1199EJ, 1199EO, 1199ET, 1199EQ, 1199EV, 1199EZ

CH004023
€6.96

DC Power Jack, Part #PJ060

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i33110M SR0N2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000811
€9.97

i3-3110M SR0N2 Stencil Template 90*90

G84601A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000802
€5.40

G84-601-A2 Stencil Template

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M5Y31 SR23G Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000803
€7.46

M-5Y31 SR23G Stencil Template

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G73VZANA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000809
€5.40

G73-VZA-N-A2 Stencil Template

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N4000 SR3S1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000810
€14.92

N4000 SR3S1 Stencil Template 90*90

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DC Power Jack Part PJ060

Compaq Mini 700 Series DC Power Jack Connector: 700, 700EA, 700ED, 700EE, 700EF, 700EI, 700EK, 700EL, 700EN, 700EP, 700ER, 700ES, 700ET, 700EW, 701ED, 701EG, 701EM, 701EN, 701ER, 701ES, 701ET, 702EA, 702EG, 703EA, 705EI, 705EL, 705ES, 730, 730EB, 730EE, 730EJ, 730EO, 730EV, 730EQ, 730EZ, 731EH, 731EI, 731ET, 732EG, 732ET, 733EF, 735EF, 735EI, 735EJ, 735EO, 735EQ

HP Mini 1000 Series DC Power Jack Connector: 1000, 1000 CTO, 1001XX, 1001TU, 1002TU, 1002XX, 1003TU, 1004TU, 1005TU, 1006TU, 1007TU, 1008TU, 1009TU, 1010LA, 1010NR, 1010TU, 1011TU, 1012TU, 1013TU, 1014TU, 1015TU, 1016TU, 1017TU, 1020LA, 1021TU, 1022TU, 1023TU, 1024TU, 1025TU, 1030NR, 1033CL, 1035NR, 1050LA, 1090LA, 1100, 1100 CTO, 1100CM, 1101TU, 1102TU, 1103TU, 1104TU, 1105TU, 1106TU, 1107TU, 1108TU, 1109TU, 1110NR, 1110TU, 1112TU, 1113TU, 1114TU, 1115NR, 1115TU, 1116NR, 1116TU, 1118TU, 1119TU, 1120LA, 1120BR, 1120NR, 1121TU, 1122TU, 1123TU, 1124TU, 1125NR, 1125TU, 1126NR, 1126TU, 1127TU, 1128TU, 1129TU, 1130CM, 1131TU, 1132TU, 1133CA, 1135CA, 1137NR, 1139NR, 1150BR, 1150CM, 1150NR, 1151NR, 1152NR, 1153NR, 1154NR, 1160CM, 1170CM, 1180CM

HP Mini 1000 Vivienne Tam Edition DC Power Jack Connector: 1000, 1018TU, 1019TU, 1020TU, 1097EI, 1098EI, 1099EA, 1099ED, 1099EE, 1099EF, 1099EG, 1099EK, 1099EL, 1099EI, 1099EM, 1099EN, 1099EP, 1099ER, 1099ES, 1099ET, 1099EW, 1100, 1100 CTO, 1111TU, 1117TU, 1120TU, 1140NR, 1141NR, 1198EO, 1199EA, 1199EB, 1199EC, 1199EE, 1199EH, 1199EJ, 1199EO, 1199ET, 1199EQ, 1199EV, 1199EZ

CH004023
€6.96

DC Power Jack, Part #PJ060

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i33110M SR0N2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000811
€9.97

i3-3110M SR0N2 Stencil Template 90*90

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