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21507190x90 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000769
€5.40

215-0719090 Stencil Template

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STXRLINK STM8 ST7 STM32 STR7 STR9 Incircuit Debugger Programmer Supporting JTAG and ICC Protocols

STX-RLINK is adapted for the St series MCU a versatile Tools for Economic Development. It can be downloaded on line simulation and St stm8, ST7, STM32, str7 and str9 Family of devices.

Software supported

The direct support of ride7 raisonance and rflasher7.

Official St IDE (Integrated Development Environment software) ST (STVD) visual Development and visual recording software program (St stvp).

Compatible Devices

Swim interface with support for all the stm8 MCU

Supports all ST7 MCU interface with ICC

With JTAG interface supports all str7 / SWD STM32 MCU, and str9

Functionality, performance

Functions of programming: The Programming of Flash ROM, EEPROM, etc.

The Simulation Capabilities: support to run at full speed, stepping, breakpoints, and another method of Cleansing, you can see the State of the variable Data, etc.

Simulation of Performance debugging Simulation: USB2.0 interface, Step by step, breakpoints, Rapid Response!

Program Performance: USB2.0 interface to swim / ICC / / SWD JTAG download, download speed!

Special Note: STX RLINK can't Trace. Original explained as follows:

The RLINK includes no support for Tracing devices based on arm kernel and Trace macrocell with Embedded System such as str9. With the capacity of monitoring tools are available in the str9 Professional Developer Kit (DK / raisonance str9 - Signum jtagjet RAIS), and in the str91x Advanced Developer's kit (IAR str91xdk / IAR) with J Trace.

Using the USB Interface to connect the PC

STX RLINK Integrated Development Tools, drivers, USB high speed communication.

Upgradeable firmware

In the Future, will launch more St stm8, ST7, STM32, str7 and str9 Models, the new device is added to the list of compatible devices and ride7 STVD Model, when you need to use in the future development of new models, and updates ride7 STVD, Firmware Update, should be supported by new models

Package Contains:

STX RLINK x 1

USB type B type cable x 1

Swim cable x 1

ICC / 4 - pin Adapter Adapter x 1 swim

JTAG Adapter x 1

SWD 20 pin JTAG - x 1

Does not contain CD software program

CH002083
€171.56

STX-RLINK STM8 ST7 STM32 STR7 STR9 In-circuit Debugger Programmer Supporting JTAG and ICC Protocols

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TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for RT809H TNM5000 Programmer - Pin to Pin

CH002085
€28.00

TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

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iphoneX Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000772
€5.72

iphoneX Stencil Template

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N3350 SR2Z7 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000776
€7.71

N3350 SR2Z7 Stencil Template

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SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000789
€5.40

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

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J1900 SR1SC Stencil Template

J1900 SR1SC Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000800
€6.22

J1900 SR1SC Stencil Template

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G84601A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000802
€5.40

G84-601-A2 Stencil Template

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EZP2010 USB Programmer Support 24252693 EEPROM Flash Bios and Adapter Socket

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package includes:

1* EZP2010 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* Off-line 5V USB Power Supply

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter

CH002131
€19.77

EZP2010 USB Programmer Support 24/25/26/93 EEPROM Flash Bios and Adapter Socket

21507190x90 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000769
€5.40

215-0719090 Stencil Template

wishlist
Compare

STXRLINK STM8 ST7 STM32 STR7 STR9 Incircuit Debugger Programmer Supporting JTAG and ICC Protocols

STX-RLINK is adapted for the St series MCU a versatile Tools for Economic Development. It can be downloaded on line simulation and St stm8, ST7, STM32, str7 and str9 Family of devices.

Software supported

The direct support of ride7 raisonance and rflasher7.

Official St IDE (Integrated Development Environment software) ST (STVD) visual Development and visual recording software program (St stvp).

Compatible Devices

Swim interface with support for all the stm8 MCU

Supports all ST7 MCU interface with ICC

With JTAG interface supports all str7 / SWD STM32 MCU, and str9

Functionality, performance

Functions of programming: The Programming of Flash ROM, EEPROM, etc.

The Simulation Capabilities: support to run at full speed, stepping, breakpoints, and another method of Cleansing, you can see the State of the variable Data, etc.

Simulation of Performance debugging Simulation: USB2.0 interface, Step by step, breakpoints, Rapid Response!

Program Performance: USB2.0 interface to swim / ICC / / SWD JTAG download, download speed!

Special Note: STX RLINK can't Trace. Original explained as follows:

The RLINK includes no support for Tracing devices based on arm kernel and Trace macrocell with Embedded System such as str9. With the capacity of monitoring tools are available in the str9 Professional Developer Kit (DK / raisonance str9 - Signum jtagjet RAIS), and in the str91x Advanced Developer's kit (IAR str91xdk / IAR) with J Trace.

Using the USB Interface to connect the PC

STX RLINK Integrated Development Tools, drivers, USB high speed communication.

Upgradeable firmware

In the Future, will launch more St stm8, ST7, STM32, str7 and str9 Models, the new device is added to the list of compatible devices and ride7 STVD Model, when you need to use in the future development of new models, and updates ride7 STVD, Firmware Update, should be supported by new models

Package Contains:

STX RLINK x 1

USB type B type cable x 1

Swim cable x 1

ICC / 4 - pin Adapter Adapter x 1 swim

JTAG Adapter x 1

SWD 20 pin JTAG - x 1

Does not contain CD software program

CH002083
€171.56

STX-RLINK STM8 ST7 STM32 STR7 STR9 In-circuit Debugger Programmer Supporting JTAG and ICC Protocols

wishlist
Compare

TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for RT809H TNM5000 Programmer - Pin to Pin

CH002085
€28.00

TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

wishlist
Compare

iphoneX Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000772
€5.72

iphoneX Stencil Template

wishlist
Compare

N3350 SR2Z7 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000776
€7.71

N3350 SR2Z7 Stencil Template

wishlist
Compare

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000789
€5.40

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

wishlist
Compare

J1900 SR1SC Stencil Template

J1900 SR1SC Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000800
€6.22

J1900 SR1SC Stencil Template

wishlist
Compare

G84601A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000802
€5.40

G84-601-A2 Stencil Template

wishlist
Compare

EZP2010 USB Programmer Support 24252693 EEPROM Flash Bios and Adapter Socket

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package includes:

1* EZP2010 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* Off-line 5V USB Power Supply

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter

CH002131
€19.77

EZP2010 USB Programmer Support 24/25/26/93 EEPROM Flash Bios and Adapter Socket

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