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  • Categories: Bios Chip Programming
  • Categories: Ebay Store Chipsetpro
  • Categories: Other BGA Chips & ICs

A1398 EMC 2910 Bios Chip EFI Firmware 820-00163 Retina Mid2015 15 Core i7 I74870HQ MJLT2LLA

PO000129
€18.00 €22.50

A1398 EMC 2910 Bios EFI Firmware 820-00163 Retina Mid-2015 15 Core i7 I7-4870HQ MJLT2LL/A

OZMICRO OZ8116

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000720
€3.45

OZMICRO OZ8116

ITE IT8720F CXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000725
€3.97

ITE IT8720F CXS

ITE IT8517E DXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000727
€3.45

ITE IT8517E (DXS)

91955B TO252

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000732
€3.45

91955B TO252

MXIC MX25L2005

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000735
€3.45

MXIC MX25L2005

Intersil ISL6267HRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000736
€3.45

Intersil ISL6267HRZ

LGE2121MS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000739
€19.06

LGE2121-MS

Winbond W25Q64BVSIG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000740
€3.45

Winbond W25Q64BVSIG

NIKOS P2808B0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000743
€7.94

NIKOS P2808B0

TI BQ24022BQ24022DRC AZU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000749
€4.77

TI BQ24022(BQ24022DRC, AZU)

Gold PIN VSOP SOIC 208mil Ribbon cable bios spi rom jtag flashing backup 8pin spi25 flash

In package include: 

1 PCS  - JTAG SOIC8 DIP SILICONE CABLE WITH GOLD 8 PINS 

You can select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Technical information:

SOIC 8pin , 208mm, 1,27mm

SST 25VF064C 

Chip width: 5.18-5.38mm

Chip length: 7.08-7.34mm

---------------------------------------

VSOP 8pin, 208mm, 1,27mm

Winbond W25Q32FV 

Chip width (E1): 5.18-5.28mm

Chip length (D): 5.18-5.28mm

----------------------------------------

You can used GOLD PIN SILICONE CABLE and read this bios chip (visit our shop and check)

Apple Macbook Pro A1286 M98_820-2330-A_G96-632-C1_SST25VF032B - support GOLDEN pin silicone cable. 

Apple A1278 K6 MCP89MZ-A2 SST25VF032B -  EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Imac 27 A1312 820-2828-A_MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1370 820-2855-A MX25L6406D

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MacBook Pro A1297 820-2914-B-MX25L6406E -  (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1278-820-2936-B-MXIC MX25L6406E - (support only GOLDEN PIN silicone cable)

Apple A1466 820-3209-A Apple MX25L6406E-1.820-3209-A

Apple MacBook Air A1369 2011-820-3023-A-MX25L6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Pro Retina 13" A1425 820-3462-A 2012 Year MX25L6406E

Apple MacBook Pro 13" A1278 820-3115-B MD101 MX25L6406E  - (support only GOLDEN PIN silicone cable)

Apple MacBook Pro Retina 13" A1502 Late 2013 Mid 2014 820-3476-A 4G 8G MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MAC Mini A1347 820-3228-A mx25l6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

----------------------------------------

Information for customer / Información para el cliente:
if you are not from Europe, please inquire about customs tax, VAT of your country.
We do not ship products in Russia.
Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000140
€52.88

Soic8, Vsop8 208mil Pin Holder, bios reflashing gold pin cable spi25 flash

  • -20%

A1398 EMC 2910 Bios Chip EFI Firmware 820-00163 Retina Mid2015 15 Core i7 I74870HQ MJLT2LLA

PO000129
€18.00 €22.50

A1398 EMC 2910 Bios EFI Firmware 820-00163 Retina Mid-2015 15 Core i7 I7-4870HQ MJLT2LL/A

OZMICRO OZ8116

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000720
€3.45

OZMICRO OZ8116

ITE IT8720F CXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000725
€3.97

ITE IT8720F CXS

ITE IT8517E DXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000727
€3.45

ITE IT8517E (DXS)

91955B TO252

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000732
€3.45

91955B TO252

MXIC MX25L2005

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000735
€3.45

MXIC MX25L2005

Intersil ISL6267HRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000736
€3.45

Intersil ISL6267HRZ

LGE2121MS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000739
€19.06

LGE2121-MS

Winbond W25Q64BVSIG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000740
€3.45

Winbond W25Q64BVSIG

NIKOS P2808B0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000743
€7.94

NIKOS P2808B0

TI BQ24022BQ24022DRC AZU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000749
€4.77

TI BQ24022(BQ24022DRC, AZU)

Gold PIN VSOP SOIC 208mil Ribbon cable bios spi rom jtag flashing backup 8pin spi25 flash

In package include: 

1 PCS  - JTAG SOIC8 DIP SILICONE CABLE WITH GOLD 8 PINS 

You can select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Technical information:

SOIC 8pin , 208mm, 1,27mm

SST 25VF064C 

Chip width: 5.18-5.38mm

Chip length: 7.08-7.34mm

---------------------------------------

VSOP 8pin, 208mm, 1,27mm

Winbond W25Q32FV 

Chip width (E1): 5.18-5.28mm

Chip length (D): 5.18-5.28mm

----------------------------------------

You can used GOLD PIN SILICONE CABLE and read this bios chip (visit our shop and check)

Apple Macbook Pro A1286 M98_820-2330-A_G96-632-C1_SST25VF032B - support GOLDEN pin silicone cable. 

Apple A1278 K6 MCP89MZ-A2 SST25VF032B -  EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Imac 27 A1312 820-2828-A_MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1370 820-2855-A MX25L6406D

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MacBook Pro A1297 820-2914-B-MX25L6406E -  (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1278-820-2936-B-MXIC MX25L6406E - (support only GOLDEN PIN silicone cable)

Apple A1466 820-3209-A Apple MX25L6406E-1.820-3209-A

Apple MacBook Air A1369 2011-820-3023-A-MX25L6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Pro Retina 13" A1425 820-3462-A 2012 Year MX25L6406E

Apple MacBook Pro 13" A1278 820-3115-B MD101 MX25L6406E  - (support only GOLDEN PIN silicone cable)

Apple MacBook Pro Retina 13" A1502 Late 2013 Mid 2014 820-3476-A 4G 8G MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MAC Mini A1347 820-3228-A mx25l6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

----------------------------------------

Information for customer / Información para el cliente:
if you are not from Europe, please inquire about customs tax, VAT of your country.
We do not ship products in Russia.
Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000140
€52.88

Soic8, Vsop8 208mil Pin Holder, bios reflashing gold pin cable spi25 flash