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  • Categories: Bios Chip Programming
  • Categories: Laptop Parts, Repair tool
  • Categories: Programmer
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A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74770HQ MGXA2LLA

PO000121
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4770HQ MGXA2LL/A

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FX150 Conductor Wire 002mm

FX-150 Conductor Wire 0.02mm

Tracking Line conductor

Description:

Brand New and high quality!

150 m / Roll of 0.02mm Copper Welding Wire

Can be used to connect Jump cable for Computer and Mobile Phone Repair Base Plate

There is no need to remove the Lacquer, Direct welding

Specification:

Material: Copper

Diameter: 0.02mm

Gross Weight: 12.20g

Storage: on

Please use a small bag deoxidizer and a desiccant sealed if long time no use

What's in the package:

1 Roll (150 m) * 0.02mm Copper Welding Wire (Vacuum sealed)

CH001049
€7.34

FX-150 Conductor Wire 0.02mm

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A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74870HQ BTOCTO

PO000122
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4870HQ BTO/CTO

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A1398 EMC 2881 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74870HQ MGXC2LLA

PO000124
€18.00 €22.50

A1398 EMC 2881 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4870HQ MGXC2LL/A

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25K Qwin 040mm BGA Leaded Solder Balls

25K Qwin 0.40mm BGA Leaded Solder Balls

Part Number 0.40mm BGA Leaded Solder Balls Manufacturer Qwin

BGA Alloy Sn63/Pb37 Date Code 19+

Package/Case 25K Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001078
€3.11

25K Qwin 0.40mm BGA Leaded Solder Balls

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A1398 EMC 2881 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74980HQ MGXG2LLA

PO000125
€18.00 €22.50

A1398 EMC 2881 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4980HQ MGXG2LL/A

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250K PMTC 055mm Sn965Ag3Cu05 BGA No PbLead Free Solder Balls

250K PMTC 0.55mm BGA No Pb/Lead Free Solder Balls

Part Number 0.55mm BGA Solder Balls Manufacturer PMTC

BGA Alloy Sn96.5/Ag3/Cu0.5 Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001086
€29.71

250K PMTC 0.55mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls

  • -20%

A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74770HQ MGXA2LLA

PO000121
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4770HQ MGXA2LL/A

wishlist
Compare

FX150 Conductor Wire 002mm

FX-150 Conductor Wire 0.02mm

Tracking Line conductor

Description:

Brand New and high quality!

150 m / Roll of 0.02mm Copper Welding Wire

Can be used to connect Jump cable for Computer and Mobile Phone Repair Base Plate

There is no need to remove the Lacquer, Direct welding

Specification:

Material: Copper

Diameter: 0.02mm

Gross Weight: 12.20g

Storage: on

Please use a small bag deoxidizer and a desiccant sealed if long time no use

What's in the package:

1 Roll (150 m) * 0.02mm Copper Welding Wire (Vacuum sealed)

CH001049
€7.34

FX-150 Conductor Wire 0.02mm

wishlist
Compare
  • -20%

A1398 EMC 2876 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74870HQ BTOCTO

PO000122
€18.00 €22.50

A1398 EMC 2876 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4870HQ BTO/CTO

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A1398 EMC 2881 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74870HQ MGXC2LLA

PO000124
€18.00 €22.50

A1398 EMC 2881 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4870HQ MGXC2LL/A

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25K Qwin 040mm BGA Leaded Solder Balls

25K Qwin 0.40mm BGA Leaded Solder Balls

Part Number 0.40mm BGA Leaded Solder Balls Manufacturer Qwin

BGA Alloy Sn63/Pb37 Date Code 19+

Package/Case 25K Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001078
€3.11

25K Qwin 0.40mm BGA Leaded Solder Balls

wishlist
Compare
  • -20%

A1398 EMC 2881 Bios Chip EFI Firmware 820-3787 Retina Mid2014 15 Core i7 I74980HQ MGXG2LLA

PO000125
€18.00 €22.50

A1398 EMC 2881 Bios EFI Firmware 820-3787 Retina Mid-2014 15 Core i7 I7-4980HQ MGXG2LL/A

wishlist
Compare

250K PMTC 055mm Sn965Ag3Cu05 BGA No PbLead Free Solder Balls

250K PMTC 0.55mm BGA No Pb/Lead Free Solder Balls

Part Number 0.55mm BGA Solder Balls Manufacturer PMTC

BGA Alloy Sn96.5/Ag3/Cu0.5 Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001086
€29.71

250K PMTC 0.55mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls

wishlist
Compare
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