1 Pair 1000V 10A Universal Digital Multimeter Meter Probe Test LeadsPin Red + Black

Features :

100% brand new and high quality.

and more accurate.

Up to 10A / 1000V

Material: PVC and Alloy

Color: Black + Red

Size length: 1.2 m

Package includeds :

1 x Pair of Digital Multimeter Meter Probe

AM5545HE44HL A8-5545M

Part Number AM5545HE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

AM5545HE44HL A8-5545M Processor for Laptop AMD A-Series BGA827 1.7 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

TV160-MiniLVDS-transfer LVDS converter with 6th-7th Generation Easy to Carry - Powerful protection Function

N12E-GE2-B-A1 GT555M

Part Number N12E-GE2-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1047

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Specification:

Brand new

Type: K

Material: fiberglass

Size: approx. 24*72*108 mm

Cable length: 1M

Line 2 * 0.4 (Diameter of the wire is 0.4mm )

Temperature range: -50~ 300?

Measurement range: -50? to 750?

Resolution: 1?

Working temperature: 0 to 50?

Storage temperature: -30 to 60?

Probe measuring range: -50 to 204 ?

Humidity: = 80%RH

Power supply: one 9V battery (not included)

Feature:

LCD screen, easy to read.

Low power consumption.

High accuracy and stability.

Safe and reliable.

Durable in use.

Convenient and easy to operate.

Accuracy:

0? to 500?: +(0.75%+1?)

500? to 750?: +(1%+1?)

0? to 20?: +2?

-20? to -40?: +3?

-40? to -50?: +4?

Packaged included:

1 x K Type Thermometer With Thermocouple Probe

G98-634-U2

Part Number G98-634-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Product Information

The Rigol DS1102E Digital Oscilloscope is equipped with up to one million points of deep memory to capture long signals with ease. This oscilloscope has two analog channels and additional trigger with 1 GSa/sec sample rate to identify elusive problems quickly. Its 5.7-inch TFT QVGA display renders enhanced visuals of the waveforms and signal values. Featuring P/F out, RS-232 and USB ports, this oscilloscope enables connectivity and has a 100 MHz bandwidth.

Product Identifiers

Brand RIGOL

MPN DS1102E

UPC 0000888884877, 4016138544817

Model DS1102E

Product Key Features

Channels 2

Type Digital

Additional Product Features

Vertical Resolution 8 Bits

Equivalent Time Sample Rate 25GSa/s

Time BASE Range 2ns/Div to 50 S/Div

Interface DB9 RS-232

Rise Time 3.5ns

Memory Depth 1 Million

Input Impedance 1 Ma| with 15pF

Vertical Sensitivity 2 Mv/Div to 10V/Div

Display Size 5.7in.

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

NOTE: Battery is not inclued in package

N13M-GS-S-A2

Part Number N13M-GS-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0856050

Part Number 216-0856050 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1416

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Due to the large number of intelligent network TV on the market, the main program is getting larger and larger, and the main program burning tool is becoming more and more specialized. A TSD flash chip writer with high cost performance is specially developed, and its performance is as follows:

This programmer is 50 mm long and 42 mm wide, small in size, with an engineering plastic shell, high in strength and easy to carry. Because it uses a high-speed USB2.0 interface, it is fast and can write the main program with 1gd capacity in less than 4 minutes. It is currently widely used in the 8a08 and 8a10 cores of Skyworth. TSD chip has large capacity, low price and high cost performance. It will be widely used in the future smart flat-panel TV. However, due to the large capacity of tsd-flash chip, it is impossible to burn it with a small serial port board, so it is necessary to burn the main program of the intelligent TV system. At present, it is widely used in the hands of manufacturing, production and development engineers. In order to facilitate the front-line maintenance personnel This writer is specially developed for front-line personnel. It can solve the burning problem of main program. The product is low in price, small in size, easy to carry, and fast in burning and writing chips. It is one of the necessary tools for maintenance and testing of intelligent TV, MP3, MP4, navigation, U disk manufacturers, etc.

TSD burning refers to writing the executable code (such as u-boot), user data (such as preset data) compiled by PC or the whole system image and other data into TSD in the way of logical address operation before TSD mounting, which saves time and labor after assembling the whole machine. At the same time, it is also one of the necessary tools for maintenance personnel to burn and write the main program of intelligent network TV.

At present, when the main program of Skyworth main push movement 8A08 and 8A10 is lost, it is necessary to use this burners to burn !

Only support Foresee