• Show Sidebar

There are 761 products.

Active filters

  • Categories: CPU and Graphic Chips
  • Categories: Car Service Equipment
  • Categories: DC Jacks, Connector
  • Categories: EFI Rom Cable
wishlist
Compare
Quickview

N13MGE1SA1

N13M-GE1-S-A1

Part Number N13M-GE1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1240

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001549
€24.62

N13M-GE1-S-A1

wishlist
Compare
Quickview

2160732025 HD4850M

216-0732025 HD4850M

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001562
€26.12

216-0732025 HD4850M

wishlist
Compare
Quickview

2160728018 HD4570

216-0728018 HD4570

Part Number 216-0728018 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001572
€66.17

216-0728018 HD4570

wishlist
Compare
Quickview

G73NB1

G73-N-B1

Part Number G73-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001582
€21.33

G73-N-B1

wishlist
Compare
Quickview

SR1UU J1800

SR1UU J1800

Part Number SR1UU J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1UU J1800 FH8065301615104 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001585
€41.52

SR1UU J1800

wishlist
Compare
Quickview

N14PGTWA2

N14P-GT-W-A2

Part Number N14P-GT-W-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001624
€57.44

N14P-GT-W-A2

wishlist
Compare
Quickview

DC Power Jack Part PJ009

Toshiba Satellite M20 Series: (PSM20U), M20-S257, M20-S258, M20-S610

Toshiba Satellite P10 Series: (PSP10U), P10-104, P10-133, P10-154, P10-204, P10-231, P10-251, P10-261, P10-304, P10-371, P10-504, P10-554, P10-S429, P10-S4291

Toshiba Satellite P15 Series: (PSP10U), P15-S409, P15-S4091, P15-S420, P15-S4201, P15-S470, P15-S479

Toshiba Satellite P20 Series: (PSP20U), P20-101, P20-102, P20-103, P20-104, P20-107, P20-108, P20-134, P20-204, P20-221, P20-304, P20-311, P20-404, P20-504, P20-521, P20-531, P20-541, P20-552, P20-604, P20-761, P20-771, P20-801, P20-832, P20-842, P20-852, P20-932, P20-962, P20-973, P20-992, P20-S103, P20-S203, P20-S203F, P20-S303, P20-S304, P20-S404

Toshiba Satellite P25 Series: (PSP20U), P25-S477, P25-S487, P25-S507, P25-S508, P25-S509, P25-S5091, P25-S5092, P25-S520, P25-S526, P25-S5262, P25-S607, P25-S609

(PSP26U), P25-S670, P25-S676, P25-S6761

Gateway: M675 (with standard type ac adapter plug tip)

Note: The PSP26U models above can also use the 2.5mm PJ008. Measure the diameter of the AC adapter plug tip, 2.5mm pin has a 6.0mm tip and 3.0mm pin has a 6.5mm tip.

CH003822
€7.21

DC Power Jack, Part #PJ009

N13MGE1SA1

N13M-GE1-S-A1

Part Number N13M-GE1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1240

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001549
€24.62

N13M-GE1-S-A1

wishlist
Compare

2160732025 HD4850M

216-0732025 HD4850M

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001562
€26.12

216-0732025 HD4850M

wishlist
Compare

2160728018 HD4570

216-0728018 HD4570

Part Number 216-0728018 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001572
€66.17

216-0728018 HD4570

wishlist
Compare

G73NB1

G73-N-B1

Part Number G73-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001582
€21.33

G73-N-B1

wishlist
Compare

SR1UU J1800

SR1UU J1800

Part Number SR1UU J1800 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1UU J1800 FH8065301615104 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001585
€41.52

SR1UU J1800

wishlist
Compare

N14PGTWA2

N14P-GT-W-A2

Part Number N14P-GT-W-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001624
€57.44

N14P-GT-W-A2

wishlist
Compare

DC Power Jack Part PJ009

Toshiba Satellite M20 Series: (PSM20U), M20-S257, M20-S258, M20-S610

Toshiba Satellite P10 Series: (PSP10U), P10-104, P10-133, P10-154, P10-204, P10-231, P10-251, P10-261, P10-304, P10-371, P10-504, P10-554, P10-S429, P10-S4291

Toshiba Satellite P15 Series: (PSP10U), P15-S409, P15-S4091, P15-S420, P15-S4201, P15-S470, P15-S479

Toshiba Satellite P20 Series: (PSP20U), P20-101, P20-102, P20-103, P20-104, P20-107, P20-108, P20-134, P20-204, P20-221, P20-304, P20-311, P20-404, P20-504, P20-521, P20-531, P20-541, P20-552, P20-604, P20-761, P20-771, P20-801, P20-832, P20-842, P20-852, P20-932, P20-962, P20-973, P20-992, P20-S103, P20-S203, P20-S203F, P20-S303, P20-S304, P20-S404

Toshiba Satellite P25 Series: (PSP20U), P25-S477, P25-S487, P25-S507, P25-S508, P25-S509, P25-S5091, P25-S5092, P25-S520, P25-S526, P25-S5262, P25-S607, P25-S609

(PSP26U), P25-S670, P25-S676, P25-S6761

Gateway: M675 (with standard type ac adapter plug tip)

Note: The PSP26U models above can also use the 2.5mm PJ008. Measure the diameter of the AC adapter plug tip, 2.5mm pin has a 6.0mm tip and 3.0mm pin has a 6.5mm tip.

CH003822
€7.21

DC Power Jack, Part #PJ009

wishlist
Compare
Back to top