215-0752003

Part Number 215-0752003 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1112

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GPS3010D HIGH-PRECISION VOLTAGE REGULATED LAB POWER SUPPLY 30V 10A POWER SUPPLIES ADJUSTABLE VOLTAGE

SR29E N3700

Part Number SR29E N3700 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

250K PMTC 0.55mm BGA No Pb/Lead Free Solder Balls

Part Number 0.55mm BGA Solder Balls Manufacturer PMTC

BGA Alloy Sn96.5/Ag3/Cu0.5 Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

ES120 plus somatosensory electric screwdriver.

Standard configuration: Motor host x1, S2 steel batch head x16, warranty card and manual x1.

Operation introduction of electric screwdriver: press and hold the work button, and then swing your hand to the left / right to start the forward and reverse rotation (circle swing on the left and right planes). It's not overwhelming. Press the work button three times in a row to enter different torque gear settings and set the appropriate torque gear. (4 gears: a automatic gear and 3 fixed torque and speed gears: H / M / L = high / medium / low). The speed of M / h / L is the same, 170 rpm. H torque is large, m torque is medium, l torque is small.

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Es120plus body feeling precision electric screwdriver.

The design orientation of es120plus is very clear. Medium speed, medium and large torque, for the disassembly and assembly requirements of screws within 5mm and 5mm (non self tapping screws, non large electrical screws, non mechanical equipment steel screws, these equipment screws are not suitable for use. )Applicable to electronic products, bolts, nuts and fasteners made of steel, aluminum and plastic. According to his design orientation, suitable for: desktop small electrical appliances small furniture mobile phone digital flat camera notebook glasses toy model aircraft model UAV electronic digital products disassembly maintenance disassembly screw use. High speed, small, medium and large torque can be set to avoid screw breakage, safe and practical. Moreover, some special fastening screws can be directly operated by hand, which can withstand 30 KGF.CM Peak torque.

(1) The fuselage is made of 304 stainless steel with strong texture, good handle, exquisite workmanship and strong durability.

(2) The built-in lithium battery can be used for charging or charging at the same time.

(3) Hand self integrated protection design: not only can be used independently, but also can be used independently and manually, and can be used at the same time.

(4) 3 fixed torque + a automatic gear design, to meet the torque requirements of small and medium sized screws in different equipment.

(5) With somatosensory chip, it can control forward and reverse rotation according to gesture swing direction. In a automatic gear, it can automatically control speed and torque through gesture swing speed (realize stepless speed change and stepless torque adjustment).

(6) Using high-speed motor, about 170 rpm, enough to meet the speed and efficiency needs of mobile phone digital toys, flat glasses camera, UAV model aircraft, notebook personal maintenance and dismantling customers (the speed of similar electric screwdriver is about 100 RPM).

(7) Electric high torque 2.5 kgf.cm The manual torque is too large to bear the torque of 30 kgf.cm

(8) The internal firmware can be upgraded, and the firmware can be downloaded from the factory official forum to update the new version of firmware. Moreover, users with programming ability can increase the torque gear and adjust the torque by themselves. Open source design, very user-friendly

215-0674058

Part Number 215-0674058 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GM107-400-A2 GTX750TI

Part Number GM107-400-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1630

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

TMS91429CT New Inverter Transformer for SAMSUNG 943NW 953BW

Part Number TMS91429CT Pin Distance 24*17mm

Size 29*55mm Total 6+4 PIN

Weight 30g Description Bulk new

Model number: T-FLEX700

Size: 15mm*15mm*1.5mmT

Temperature resistance: -40~220?

Thermal conductivity: 5.0W/mk

Thermal resistance coefficient: 0.15?-in/W

Density: 1.73g/cc

SR2UW i3-6006U

Part Number i3-6006U SR2UW Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

i3-6006U SR2UW FJ8066201931106 Core i3 Mobile

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Taiwan lead-free high quality 936 iron head

Characteristic:

1. special cast iron process, corrosion resistance, oxidation resistance, especially for long life.

2. strong immersion prolonged, easy to melt, Shangxi, solder joint round.

3. ? uniform inductance, stable quality, lead-free material.

4. lead-free environmental production, has passed the SGS test.

All soldering stations used in the 900M-T series

Such as table machine, 936 series welding platform

900M series lead-free soldering iron

? made of pure copper components, high thermal conductivity, fast heat transfer

? special iron surface plating, high temperature resistance, corrosion resistance

Special process, suitable for lead-free solder welding

? strong tin capacity, no oxidation, no tin, no tin, tin climbing phenomenon

? the outer layer is bright and delicate and very strong in rust resistance

? this product has passed the SGS environmental protection test

Life of soldering iron head

The life of the iron head is determined by the number of welds, and the length of life guaranteed depends on the coating thickness of the head. The thicker the coating, the longer the life of the iron head, but the heat transfer efficiency will be greatly reduced, the life of the iron tip for the same temperature series of iron head, fine iron head, life expectancy than a rough iron head life is shorter. Because the iron head is working, it will inevitably cause wear and tear on the surface of the nozzle life. Therefore, the fine iron head is more prone to wear, so to reduce the life of the soldering iron.

Maintenance of iron head

The use of new electric iron, electric iron can not bring the new use, need to be plated with a layer of solder in the iron head method is: according to the power supply when the temperature gradually increased, the rosin coated iron head; rosin smoke, to melt the solder iron head, with a the solder layer so as to strengthen the tip life.

216-0729042 HD4650

Part Number 216-0729042 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock