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  • Categories: CPU and Graphic Chips
  • Categories: Laptop Parts, Repair tool
  • Categories: Other BGA Chips & ICs
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HDMI USB1080P 48mp Digital Electronic Video Microscope Camera 120X Cmount Lens Phone PCB Soldering Repair Industrial Work Set

Features:

Model: Camera with HDMI USB2.0 two output

Image format: jpg

Image resolution: 48 MegaPixel

Video format: MP4(for TF card)

Video re corder: 1080P@60FPS

HDMI Video resolution: 1920*1080 @ 60FPS

USB Video resolution: 1920*1080@30FPS; 1280*720@30FPS; 640*480@30FPS; 320*240@30FPS

White Balance: Auto/Manual

Light: Auto/Manual

Exposure: Auto/Manual, value adjustable

Color: Color

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese/French/Spanish/Japanese/German

Line: different color,5 horizontal line , 5 vertical line,any positions

Specification:

Image sensor: 48megapixel CMOS sensor 1/2.33 inch

Effective pixel: 48 megapixel

Pixel size:1.335m 1.335m

Frame rate:60fps

Definition:FULL HD

Housing:metal

Lens:C/CS

Video format: MOV

Digital Zoom:Support

Brightness control:Auto/manual

Color:R/G/B adjustable

Film and re cord:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:

Support multi-color, 5 pcs of transverse lines/vertical lines, moveable

Different color,5 horizontal line , 5 vertical line,any positions

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

USB interface:Standard usb2.0 interface (Type B)

Input Voltage: DC 12V

Working distance: 55mm-700mm

Field of view: 4mm-100mm

zoom c-mount Lens

zoom ratios: 15:1

Magnification Power by 120X

Size: 110mm(L) * 28mm(DIA)

With 35mm ring adapter

Package includes:

1 * HDMI camera

1 * HDMI cable

1 * remote control

1 * C-MOUNT Lens

1 * 12V power supply

1 * Table Stand

Note:

We will send you a plug adapter according to your country.

This product does not include a monitor

CH000746
€180.26

HDMI USB1080P 48mp Digital Electronic Video Microscope Camera 120X C-mount Lens Phone PCB Soldering Repair Industrial Work Set

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N10MGESA3

N10M-GE-S-A3

Part Number N10M-GE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001207
€18.51

N10M-GE-S-A3

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Realtek RTD2045L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000558
€3.45

Realtek RTD2045L

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12 15mm15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 1.2T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

CH000747
€2.70

1.2 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

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G86635A2 8400MGS

G86-635-A2 8400MGS

Part Number G86-635-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1119

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001208
€20.51

G86-635-A2 8400MGS

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PEF20571FV31

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000559
€31.77

PEF20571FV3.1

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N12PGVBA1 GT540M

N12P-GV-B-A1 GT540M

Part Number N12P-GV-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1108

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001215
€31.51

N12P-GV-B-A1 GT540M

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BROADCOM BCM5325EKQMG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000562
€23.83

BROADCOM BCM5325EKQMG

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NPCT650JAAYX NUVOTON

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000564
€3.45

NPCT650JAAYX NUVOTON

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G86741A2 8400MGS

G86-741-A2 8400MGS

Part Number G86-741-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1207

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001230
€54.97

G86-741-A2 8400MGS

HDMI USB1080P 48mp Digital Electronic Video Microscope Camera 120X Cmount Lens Phone PCB Soldering Repair Industrial Work Set

Features:

Model: Camera with HDMI USB2.0 two output

Image format: jpg

Image resolution: 48 MegaPixel

Video format: MP4(for TF card)

Video re corder: 1080P@60FPS

HDMI Video resolution: 1920*1080 @ 60FPS

USB Video resolution: 1920*1080@30FPS; 1280*720@30FPS; 640*480@30FPS; 320*240@30FPS

White Balance: Auto/Manual

Light: Auto/Manual

Exposure: Auto/Manual, value adjustable

Color: Color

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese/French/Spanish/Japanese/German

Line: different color,5 horizontal line , 5 vertical line,any positions

Specification:

Image sensor: 48megapixel CMOS sensor 1/2.33 inch

Effective pixel: 48 megapixel

Pixel size:1.335m 1.335m

Frame rate:60fps

Definition:FULL HD

Housing:metal

Lens:C/CS

Video format: MOV

Digital Zoom:Support

Brightness control:Auto/manual

Color:R/G/B adjustable

Film and re cord:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:

Support multi-color, 5 pcs of transverse lines/vertical lines, moveable

Different color,5 horizontal line , 5 vertical line,any positions

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

USB interface:Standard usb2.0 interface (Type B)

Input Voltage: DC 12V

Working distance: 55mm-700mm

Field of view: 4mm-100mm

zoom c-mount Lens

zoom ratios: 15:1

Magnification Power by 120X

Size: 110mm(L) * 28mm(DIA)

With 35mm ring adapter

Package includes:

1 * HDMI camera

1 * HDMI cable

1 * remote control

1 * C-MOUNT Lens

1 * 12V power supply

1 * Table Stand

Note:

We will send you a plug adapter according to your country.

This product does not include a monitor

CH000746
€180.26

HDMI USB1080P 48mp Digital Electronic Video Microscope Camera 120X C-mount Lens Phone PCB Soldering Repair Industrial Work Set

wishlist
Compare

N10MGESA3

N10M-GE-S-A3

Part Number N10M-GE-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001207
€18.51

N10M-GE-S-A3

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Realtek RTD2045L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000558
€3.45

Realtek RTD2045L

wishlist
Compare

12 15mm15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 1.2T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

CH000747
€2.70

1.2 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

wishlist
Compare

G86635A2 8400MGS

G86-635-A2 8400MGS

Part Number G86-635-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1119

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001208
€20.51

G86-635-A2 8400MGS

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Compare

PEF20571FV31

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000559
€31.77

PEF20571FV3.1

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Compare

N12PGVBA1 GT540M

N12P-GV-B-A1 GT540M

Part Number N12P-GV-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1108

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001215
€31.51

N12P-GV-B-A1 GT540M

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Compare

BROADCOM BCM5325EKQMG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000562
€23.83

BROADCOM BCM5325EKQMG

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Compare

NPCT650JAAYX NUVOTON

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000564
€3.45

NPCT650JAAYX NUVOTON

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Compare

G86741A2 8400MGS

G86-741-A2 8400MGS

Part Number G86-741-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1207

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001230
€54.97

G86-741-A2 8400MGS

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Compare
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