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EMC EMB24B03G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003254
€3.45

EMC EMB24B03G

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ATHEROS AR8161BL3A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003255
€3.45

ATHEROS AR8161-BL3A

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N11MLP2SA3 G210M

N11M-LP2-S-A3 G210M

Part Number N11M-LP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003259
€18.46

N11M-LP2-S-A3 G210M

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MXIC MX25L3205

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003260
€3.45

MXIC MX25L3205

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SOP to PLCC 16 Universal Programmer Adapter Sockets for TL866 RT809H

16 Universal Adapter Package Contents

1: 1.8 V Adpater 1 pcs

2: TSSOP28 Adpater< Gold Plating >1 pcs

3: SOIC8 SOP8 IC Flash clip 1 pcs

4: Adaptador 300mil SOP28-DIP28 < Gold Plating > 1 pcs

5: SOP20-DIP20 Adaptador 200-208mil< Gold Plating > 1 pcs

6: SOP8-DIP8 200-208mil adpater< Gold Plating > 1 pcs

7: Adaptador 150mil SOP16-DIP16 < Gold Plating > 1 pcs

8: Adaptador 150mil SOP8-DIP8< Gold Plating > 1 pcs

9. Adaptador PLCC44-DIP40 1 pcs

10: PLCC32-DIP32 1 pcs

11. Adaptador PLCC28-DIP24 1 pcs

12. Adaptador PLCC20-DIP20 1 pcs

13: SOP16/SOP14/SOP8-DIP8 adpater

14. SOP8/MSOP8/SSOP8/SOP16-DIP16 simple adaptador 1 pcs

15. Adaptador SOP8-DIP8 simples 1 pcs

16: PLCC IC Extractor 1 pcs

CH003261
€45.00

SOP to PLCC 16 Universal Programmer Adapter Sockets for TL866 RT809H

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Intersil ISL6265CHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003262
€3.45

Intersil ISL6265CHRTZ

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Realtek ALC272X

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003264
€3.45

Realtek ALC272X

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i73667U SR0N5 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003265
€17.14

i7-3667U SR0N5 Stencil Template 90*90

EMC EMB24B03G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003254
€3.45

EMC EMB24B03G

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ATHEROS AR8161BL3A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003255
€3.45

ATHEROS AR8161-BL3A

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N11MLP2SA3 G210M

N11M-LP2-S-A3 G210M

Part Number N11M-LP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003259
€18.46

N11M-LP2-S-A3 G210M

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MXIC MX25L3205

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003260
€3.45

MXIC MX25L3205

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SOP to PLCC 16 Universal Programmer Adapter Sockets for TL866 RT809H

16 Universal Adapter Package Contents

1: 1.8 V Adpater 1 pcs

2: TSSOP28 Adpater< Gold Plating >1 pcs

3: SOIC8 SOP8 IC Flash clip 1 pcs

4: Adaptador 300mil SOP28-DIP28 < Gold Plating > 1 pcs

5: SOP20-DIP20 Adaptador 200-208mil< Gold Plating > 1 pcs

6: SOP8-DIP8 200-208mil adpater< Gold Plating > 1 pcs

7: Adaptador 150mil SOP16-DIP16 < Gold Plating > 1 pcs

8: Adaptador 150mil SOP8-DIP8< Gold Plating > 1 pcs

9. Adaptador PLCC44-DIP40 1 pcs

10: PLCC32-DIP32 1 pcs

11. Adaptador PLCC28-DIP24 1 pcs

12. Adaptador PLCC20-DIP20 1 pcs

13: SOP16/SOP14/SOP8-DIP8 adpater

14. SOP8/MSOP8/SSOP8/SOP16-DIP16 simple adaptador 1 pcs

15. Adaptador SOP8-DIP8 simples 1 pcs

16: PLCC IC Extractor 1 pcs

CH003261
€45.00

SOP to PLCC 16 Universal Programmer Adapter Sockets for TL866 RT809H

wishlist
Compare

Intersil ISL6265CHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003262
€3.45

Intersil ISL6265CHRTZ

wishlist
Compare

Realtek ALC272X

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003264
€3.45

Realtek ALC272X

wishlist
Compare

i73667U SR0N5 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003265
€17.14

i7-3667U SR0N5 Stencil Template 90*90

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Compare
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