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MCP89MZEMGA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003328
€5.40

MCP89MZ-EMG-A2 Stencil Template

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Foxconn H3 Socket LGA1150 CPU Base 1150 PC Connector BGA Base

Foxconn H3 Socket LGA1150 CPU Base 1150 PC Connector BGA Base

Part Number LGA1150 Socket Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Socket type BGA1150

Package/Case 1 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003329
€4.97

Foxconn H3 Socket LGA1150 CPU Base 1150 PC Connector BGA Base

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NT71208FG851

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003330
€3.45

NT71208FG-851

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2160833002 HD7650M

216-0833002 HD7650M

Part Number 216-0833002 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003331
€62.69

216-0833002 HD7650M

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2180697020 SB820M

218-0697020 SB820M

Part Number 218-0697020 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003332
€16.81

218-0697020 SB820M

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N10PGEA3 G230M

N10P-GE-A3 G230M

Part Number N10P-GE-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1148

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003333
€25.27

N10P-GE-A3 G230M

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RICHTEK RT8206A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003335
€3.45

RICHTEK RT8206A

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ITE IT8572EAXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003336
€3.45

ITE IT8572E-AXA

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HDD Open repair data recovery tool seagate 2535 HARD DRIVE HEAD SWAP TOOLS 96pcs kits

HDD Open repair&data recovery tool: * Use Tutorials Video

HD HPE PRO: A Must-Have hardware level of disk repair and data recovery equipment, which enables you an easy and exact drive disassembling and HEAD stack/Platter exchange.

Main Features: Easy to use; Universal-fit workbench; Pioneer platter exchanger; change multiple platters without moving the platters out of alignment with each other; Special Actuator Remover with strong magnetism works (removal, installation) easily on the upper magnet of the actuator.

Highlights:

Universal-fit workbench assures you to operate on your HD on a relatively stable table, making your job easier and more reliable.

Pioneer platter exchanger maintains the original cylinder status by removing and placing each platter of the multiple platters together, so that allows you to change multiple platters without moving the platters out of alignment with each other which otherwise will result in data corruption.

Special Actuator Remover assures you to perform easy operation (removal, installation) on the upper magnet of the actuator which is very hard to be removed and put back because of its strong magnetism and it's sensitive and embarrassed position (being very close to both the Head Stack and Media Platter), in case it slips out and touch either of its fragile neighbors during the operations - the consequences will be a disaster.

Packing List:

1.Universal-fit Workbench -1pc;

2.Multiple Platter Exchanger -4pcs;

3.Stable Actuator Exchanger -1pc;

4.Replacement tools for 2.5 inch disk -1pc

5.Replacement tools for 3.5 inch disk -1pc

6.Tool 96pcs kits

CH003337
€231.24

HDD Open repair data recovery tool seagate 2.5-3.5+ HARD DRIVE HEAD SWAP TOOLS 96pcs kits

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CLGD754385QCA CIRRUS LOGIC

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003338
€13.50

CL-GD7543-85QC-A CIRRUS LOGIC

MCP89MZEMGA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003328
€5.40

MCP89MZ-EMG-A2 Stencil Template

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Foxconn H3 Socket LGA1150 CPU Base 1150 PC Connector BGA Base

Foxconn H3 Socket LGA1150 CPU Base 1150 PC Connector BGA Base

Part Number LGA1150 Socket Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Socket type BGA1150

Package/Case 1 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003329
€4.97

Foxconn H3 Socket LGA1150 CPU Base 1150 PC Connector BGA Base

wishlist
Compare

NT71208FG851

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003330
€3.45

NT71208FG-851

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Compare

2160833002 HD7650M

216-0833002 HD7650M

Part Number 216-0833002 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003331
€62.69

216-0833002 HD7650M

wishlist
Compare

2180697020 SB820M

218-0697020 SB820M

Part Number 218-0697020 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003332
€16.81

218-0697020 SB820M

wishlist
Compare

N10PGEA3 G230M

N10P-GE-A3 G230M

Part Number N10P-GE-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1148

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003333
€25.27

N10P-GE-A3 G230M

wishlist
Compare

RICHTEK RT8206A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003335
€3.45

RICHTEK RT8206A

wishlist
Compare

ITE IT8572EAXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003336
€3.45

ITE IT8572E-AXA

wishlist
Compare

HDD Open repair data recovery tool seagate 2535 HARD DRIVE HEAD SWAP TOOLS 96pcs kits

HDD Open repair&data recovery tool: * Use Tutorials Video

HD HPE PRO: A Must-Have hardware level of disk repair and data recovery equipment, which enables you an easy and exact drive disassembling and HEAD stack/Platter exchange.

Main Features: Easy to use; Universal-fit workbench; Pioneer platter exchanger; change multiple platters without moving the platters out of alignment with each other; Special Actuator Remover with strong magnetism works (removal, installation) easily on the upper magnet of the actuator.

Highlights:

Universal-fit workbench assures you to operate on your HD on a relatively stable table, making your job easier and more reliable.

Pioneer platter exchanger maintains the original cylinder status by removing and placing each platter of the multiple platters together, so that allows you to change multiple platters without moving the platters out of alignment with each other which otherwise will result in data corruption.

Special Actuator Remover assures you to perform easy operation (removal, installation) on the upper magnet of the actuator which is very hard to be removed and put back because of its strong magnetism and it's sensitive and embarrassed position (being very close to both the Head Stack and Media Platter), in case it slips out and touch either of its fragile neighbors during the operations - the consequences will be a disaster.

Packing List:

1.Universal-fit Workbench -1pc;

2.Multiple Platter Exchanger -4pcs;

3.Stable Actuator Exchanger -1pc;

4.Replacement tools for 2.5 inch disk -1pc

5.Replacement tools for 3.5 inch disk -1pc

6.Tool 96pcs kits

CH003337
€231.24

HDD Open repair data recovery tool seagate 2.5-3.5+ HARD DRIVE HEAD SWAP TOOLS 96pcs kits

wishlist
Compare

CLGD754385QCA CIRRUS LOGIC

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003338
€13.50

CL-GD7543-85QC-A CIRRUS LOGIC

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Compare
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