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i54300U SR1ED Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003351
€5.47

i5-4300U SR1ED Stencil Template

GFGO7300TNA3

GF-GO7300T-N-A3

Part Number GF-GO7300T-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003352
€26.26

GF-GO7300T-N-A3

RICHTEK RT8205AGQW CJ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003353
€3.45

RICHTEK RT8205AGQW CJ=

J4205 SR2ZA Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003355
€7.71

J4205 SR2ZA Stencil Template

G98921U2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003356
€5.40

G98-921-U2 Stencil Template

TNM5000 USB fast ISP EEPROM universal Programmer 20 Adapter NAND flash

TNM5000 Universal Programmer Introduction

Login to Download: * Programmer latest Software

User Manual Device List Nand Software Utility Software for RS232 & USB Bl a ster Emulation

? 23000 Supported Devices Flash Memory (Parallel / Nand /Serial) , EPROM , EEPROM , Serial EEPROM , Microcontroller , NVRAM , FRAM , CPLD , PLD , FPGA).

? 48-Pins ZIF Socket with Pin Continuity tester & 10-Pins ISP/JTAG Connector.

? USB 2.0 High Speed ,Program 1 Gbit Nand Flash less than 50 sec , Reading Serial Flash memory with 6 Mbit/Sec Speed.

? Auto detection of all flash Memories/Microcontrollers with Device ID.

? User friendly software for Windows XP/VISTA/7/8 (32,64 bits).

? Multiple Programming is possible by attaching 2 or more Programmers to one PC.

? Very low cost Main Unit & Low cost adaptors.

? Special Abilities like, Altera US,B-B.l*a*s.ter Emulation for Quartus Software, Serial Port Emulation , Vehicle ECU , Immoblizer & Dashboard microcontroller Support.

Parallel Flash Memories: up to 56 pins parallel flash memories are supported by TNM5000. it Supports different kind of packages (PLCC , TSOP1 , TSOP2 ,VSOP & ...).

All Flashes can be automatically detected by software in case of unreadable device names. By using a single adaptor for all 32-48 pins TSOP flashes , user only need 1 adaptor for over 2000 flash chips.

Nand Flash Memories: TNM5000 has an additional Nand+ software , specially designed for Nand flash memories. Nand+ Software has one of the most complete list of Nand flash Memories with algorithms for correction of bad data in MLC Nand Flashes. TNM5000 is one of the fastest Nand Programmers in the world with Read & Write Speed up to 8 MegaByte per Second. All Nand Flashes can be automatically detected by software in case of unreadable or remarked device names.

Serial Flash Memories: All 8-16 Pins Serial SPI flash memories are supported by TNM5000. All SPI flash Memories can be detected automatically by software in case of unreadable device names. It reads & programs SPi flashes with maximum safe speed on ZIF (6-7 Mbit/second) . Also it Unprotects the write protected flashes before writing data to it.

Microcontrollers:

ATMEL: All AVR 8 bits chips (ATMEGA/ATTINY/AT90S) are supported on ZIF Scocket & by ISP cable. High Voltage Parallel on ZIF Programming of AVR up to 64 pins is supported. newly introduced ATXMEGA Series are supported by both PDI & JTAG Method. Old C51 series & new single cycle C51 series are completely supported. All the above series can be detected automatically by TNM5000. ARM7 programming by JTAG is supported.

Microchip: One of the most complete device list for microchip PIC microcontrollers including all PIC12F /PIC12C /PIC16C / PIC16F / PIC18F / DPIC33F / J & K Series. Devices up to 40 Pins can be programmed on ZIF , All PICs can be detected automatically & programmed by ISP cable.

Others: ST, SST, Philips (NXP) , Motorola , Syncmos, Silicon Lab , ICSI , Infineon , Intel , Winbond & ...

Automotive MCUS: Supporting of ST10F & TMS370 Series by ISP cable for many BOSCH/VALEO/SAGEM ECUs (complete ST10F support of XPROG-m programmer device list). supporting of siemense & infineon SAK-C167 connected to 44 or 48 pins flash (Siemense/BOSCH/SAGEM S2000 ECU) like HSE FlasHit Programmer. Supporting NEC & Motorola Devices for Dashboards.

PLD/CPLD/FPGA: Supporting All ALTERA JTAG Devices by emulation of USB B l a s t e r Programmer in Quartus Software. Supporting of Xilinx CPLD/FPGA with jed file. Fast Xilinx FPGA configuration with bit file. Supporting of GAL/PALCE Devices with special option for PALCE unlocking.

Software: With multiple language support (English / Chinese / Russian /polska /Arabic / French /FARSI). More languages & Devices can be added by customer request. You Can Download Software & run it in Demo mode to evaluate it.

Package List:

1 x TNM5000 Programmer

1 x USB Cable

1 x software CD

1 x TQFP44-DIP44 Adapter

1 x TQFP32-DIP28 Adapter

1 x TSOP48-DIP48 Adapter

1 x SOP44-DIP44 Adapter

1 x SOP28-DIP28 300mil adapter

1 x SOP8-DIP8 200-208mil adapter

1 x SOP8-DIP8 150mil adapter

1 x TSSOP28 to DIP28 adapter

1 x TSSOP8 to DIP8 adapter

1 x SOP16 TO DIP16 adapter

1 x SOP20-DIP20(200~208mil)adapter

1 x PLCC44-DIP44 adapter

1 x PLCC32-DIP32 adapter

1 x PLCC28-DIP24 Adapter

1 x PLCC20-DIP20 Adapter

1 x SOP4/SOP28-SSOP4/SSOP28simple Adapter

1 x SOP16/SOP8 simple Adapter

1 x SOIC8 SOP8 To DIP8 CLIP

1 x IC Chip Extractor

CH003357
€498.00

TNM5000 USB fast ISP EEPROM universal Programmer + 20 Adapter NAND flash

Intersil ISL6612ACBZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003358
€3.45

Intersil ISL6612ACBZ

AD ADP3211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003359
€3.45

AD ADP3211

ITE IT8712FS KXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003360
€3.45

ITE IT8712F-S KXS

2160774009 HD5470

216-0774009 HD5470

Part Number 216-0774009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 400 pcs Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003361
€60.95

216-0774009 HD5470

2150725018 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003362
€5.40

215-0725018 Stencil Template

i54300U SR1ED Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003351
€5.47

i5-4300U SR1ED Stencil Template

GFGO7300TNA3

GF-GO7300T-N-A3

Part Number GF-GO7300T-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1027

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003352
€26.26

GF-GO7300T-N-A3

RICHTEK RT8205AGQW CJ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003353
€3.45

RICHTEK RT8205AGQW CJ=

J4205 SR2ZA Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003355
€7.71

J4205 SR2ZA Stencil Template

G98921U2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003356
€5.40

G98-921-U2 Stencil Template

TNM5000 USB fast ISP EEPROM universal Programmer 20 Adapter NAND flash

TNM5000 Universal Programmer Introduction

Login to Download: * Programmer latest Software

User Manual Device List Nand Software Utility Software for RS232 & USB Bl a ster Emulation

? 23000 Supported Devices Flash Memory (Parallel / Nand /Serial) , EPROM , EEPROM , Serial EEPROM , Microcontroller , NVRAM , FRAM , CPLD , PLD , FPGA).

? 48-Pins ZIF Socket with Pin Continuity tester & 10-Pins ISP/JTAG Connector.

? USB 2.0 High Speed ,Program 1 Gbit Nand Flash less than 50 sec , Reading Serial Flash memory with 6 Mbit/Sec Speed.

? Auto detection of all flash Memories/Microcontrollers with Device ID.

? User friendly software for Windows XP/VISTA/7/8 (32,64 bits).

? Multiple Programming is possible by attaching 2 or more Programmers to one PC.

? Very low cost Main Unit & Low cost adaptors.

? Special Abilities like, Altera US,B-B.l*a*s.ter Emulation for Quartus Software, Serial Port Emulation , Vehicle ECU , Immoblizer & Dashboard microcontroller Support.

Parallel Flash Memories: up to 56 pins parallel flash memories are supported by TNM5000. it Supports different kind of packages (PLCC , TSOP1 , TSOP2 ,VSOP & ...).

All Flashes can be automatically detected by software in case of unreadable device names. By using a single adaptor for all 32-48 pins TSOP flashes , user only need 1 adaptor for over 2000 flash chips.

Nand Flash Memories: TNM5000 has an additional Nand+ software , specially designed for Nand flash memories. Nand+ Software has one of the most complete list of Nand flash Memories with algorithms for correction of bad data in MLC Nand Flashes. TNM5000 is one of the fastest Nand Programmers in the world with Read & Write Speed up to 8 MegaByte per Second. All Nand Flashes can be automatically detected by software in case of unreadable or remarked device names.

Serial Flash Memories: All 8-16 Pins Serial SPI flash memories are supported by TNM5000. All SPI flash Memories can be detected automatically by software in case of unreadable device names. It reads & programs SPi flashes with maximum safe speed on ZIF (6-7 Mbit/second) . Also it Unprotects the write protected flashes before writing data to it.

Microcontrollers:

ATMEL: All AVR 8 bits chips (ATMEGA/ATTINY/AT90S) are supported on ZIF Scocket & by ISP cable. High Voltage Parallel on ZIF Programming of AVR up to 64 pins is supported. newly introduced ATXMEGA Series are supported by both PDI & JTAG Method. Old C51 series & new single cycle C51 series are completely supported. All the above series can be detected automatically by TNM5000. ARM7 programming by JTAG is supported.

Microchip: One of the most complete device list for microchip PIC microcontrollers including all PIC12F /PIC12C /PIC16C / PIC16F / PIC18F / DPIC33F / J & K Series. Devices up to 40 Pins can be programmed on ZIF , All PICs can be detected automatically & programmed by ISP cable.

Others: ST, SST, Philips (NXP) , Motorola , Syncmos, Silicon Lab , ICSI , Infineon , Intel , Winbond & ...

Automotive MCUS: Supporting of ST10F & TMS370 Series by ISP cable for many BOSCH/VALEO/SAGEM ECUs (complete ST10F support of XPROG-m programmer device list). supporting of siemense & infineon SAK-C167 connected to 44 or 48 pins flash (Siemense/BOSCH/SAGEM S2000 ECU) like HSE FlasHit Programmer. Supporting NEC & Motorola Devices for Dashboards.

PLD/CPLD/FPGA: Supporting All ALTERA JTAG Devices by emulation of USB B l a s t e r Programmer in Quartus Software. Supporting of Xilinx CPLD/FPGA with jed file. Fast Xilinx FPGA configuration with bit file. Supporting of GAL/PALCE Devices with special option for PALCE unlocking.

Software: With multiple language support (English / Chinese / Russian /polska /Arabic / French /FARSI). More languages & Devices can be added by customer request. You Can Download Software & run it in Demo mode to evaluate it.

Package List:

1 x TNM5000 Programmer

1 x USB Cable

1 x software CD

1 x TQFP44-DIP44 Adapter

1 x TQFP32-DIP28 Adapter

1 x TSOP48-DIP48 Adapter

1 x SOP44-DIP44 Adapter

1 x SOP28-DIP28 300mil adapter

1 x SOP8-DIP8 200-208mil adapter

1 x SOP8-DIP8 150mil adapter

1 x TSSOP28 to DIP28 adapter

1 x TSSOP8 to DIP8 adapter

1 x SOP16 TO DIP16 adapter

1 x SOP20-DIP20(200~208mil)adapter

1 x PLCC44-DIP44 adapter

1 x PLCC32-DIP32 adapter

1 x PLCC28-DIP24 Adapter

1 x PLCC20-DIP20 Adapter

1 x SOP4/SOP28-SSOP4/SSOP28simple Adapter

1 x SOP16/SOP8 simple Adapter

1 x SOIC8 SOP8 To DIP8 CLIP

1 x IC Chip Extractor

CH003357
€498.00

TNM5000 USB fast ISP EEPROM universal Programmer + 20 Adapter NAND flash

Intersil ISL6612ACBZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003358
€3.45

Intersil ISL6612ACBZ

AD ADP3211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003359
€3.45

AD ADP3211

ITE IT8712FS KXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003360
€3.45

ITE IT8712F-S KXS

2160774009 HD5470

216-0774009 HD5470

Part Number 216-0774009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 400 pcs Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003361
€60.95

216-0774009 HD5470

2150725018 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003362
€5.40

215-0725018 Stencil Template