216-0810005 HD6750

Part Number 216-0810005 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Features:

Auto/manual ranges True RMS measurement

550V protection in resistance and capacitance ranges Large LCD display,MAX display 6000 counts Sample rate: 3 times per second

backlight MAX/MIN data hold Polarity identification Low voltage indication

20A high current measurement is available Auto power off can be cancelled manually

Main measurements:AC/DC Voltage, AC/DC Current, Resistance,Capacitance, Diode and Continuity Testing,Temperature, Frequency and duty cycle.

Frequency:1Hz to 20MHz

Temperature:-20? to 1000?(-4? to 1832?)

Capacitance :10pF to 6000uF

AC volts: 0.1mV to 750V

DC volts:0.1mV to 1000V

AC current:0.1uA to 20A

DC current:0.1uA to 20A

Resistance :0.1O to 60MO

Duty cycle:1% to 99%

Specifications:

1.frequency:5/50/500/5k/50k/500k/5M/20M (0.1+3)

2.Temperature:?400? (1.0%+5),=400?(1.5%+15)?752? (1.0%+5),=752?(1.5%+15)(3)capacitance:10nF(5.0+20),100nF/1uF/10uF/100uF(2.0%+5),1000uF/10000uF(5.0%+5)

3.DC volt:600mV(1.0%+10), 6V/60V/600V/1000V(0.5%+3)

4.AC volt:600mV(3.0%+3),6V/60V/600V/750V(1.0%+3)

5.ACA/DCA:600uA/6000uA(1.5%+3),60mA/600mA/20A(1.5%+3)

6.Resistance:600O(0.5%+3),6K/60K/600K/6M(0.5%+2),60MO(1.5%+3) (8)Duty cycle:1% to 99%(1%)

7. Measurement mode: Double-integral style A/D transform

10.Supply power: 2 x 1.5V AA batteries (not include)

11.Dimension: 180*90.5*45mm

12.Weight: 420g

Package Includes:

1 x Digital Multimeter

1 x User's manual

a pair of test leads

SR240 i3-5020U

Part Number SR240 i3-5020U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

QK-AK7 Laptop Keyboard Tester Testing Device Machine Tool USB Interface

Part Number GZ-KBK-10.V Manufacturer ATR Tester Technology

Socket Type MiNi USB Date Code 21+

Package/Case 1 PCS Description Original new

4415U SR348 Pentium Dual-Core Mobile FJ8067702739932

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR2EY i5-6200U

Part Number i5-6200U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Test correspondingly double-twisted cables 1, 2, 3, 4, 5, 6, 7, 8 and Ground

Capable to judge wrong connection, short circuit and open circuit

Cable Tester for RJ12, RJ11, RJ45, Cat 5e, Cat 5, 10/100 Base-T, AT&T 258 A, TIA-568A/568B .etc

It can easily clarify cable, continuity, open and short.

Verifying Cable continuity, open, short and cross wire pair up to 1000ft with remote kit.

9 LED lights to indicated wiring connection on both remote and master unit

Grounding Test

Build in power switch for power saving

Power: 9V battery ( Not Included )

Size: 100 x 100 x 25mm

AM5545HE44HL A8-5545M

Part Number AM5545HE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

AM5545HE44HL A8-5545M Processor for Laptop AMD A-Series BGA827 1.7 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N12E-GE2-B-A1 GT555M

Part Number N12E-GE2-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1047

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Specification:

Brand new

Type: K

Material: fiberglass

Size: approx. 24*72*108 mm

Cable length: 1M

Line 2 * 0.4 (Diameter of the wire is 0.4mm )

Temperature range: -50~ 300?

Measurement range: -50? to 750?

Resolution: 1?

Working temperature: 0 to 50?

Storage temperature: -30 to 60?

Probe measuring range: -50 to 204 ?

Humidity: = 80%RH

Power supply: one 9V battery (not included)

Feature:

LCD screen, easy to read.

Low power consumption.

High accuracy and stability.

Safe and reliable.

Durable in use.

Convenient and easy to operate.

Accuracy:

0? to 500?: +(0.75%+1?)

500? to 750?: +(1%+1?)

0? to 20?: +2?

-20? to -40?: +3?

-40? to -50?: +4?

Packaged included:

1 x K Type Thermometer With Thermocouple Probe

G98-634-U2

Part Number G98-634-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock