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SR2EY i56200U

SR2EY i5-6200U

Part Number i5-6200U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001497
€229.74

SR2EY i5-6200U

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AM5545HE44HL A85545M

AM5545HE44HL A8-5545M

Part Number AM5545HE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

AM5545HE44HL A8-5545M Processor for Laptop AMD A-Series BGA827 1.7 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001503
€46.15

AM5545HE44HL A8-5545M

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N12EGE2BA1 GT555M

N12E-GE2-B-A1 GT555M

Part Number N12E-GE2-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1047

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001508
€45.95

N12E-GE2-B-A1 GT555M

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G98634U2

G98-634-U2

Part Number G98-634-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001522
€6.56

G98-634-U2

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N13MGEBA2

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001530
€25.93

N13M-GE-B-A2

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N13MGSSA2

N13M-GS-S-A2

Part Number N13M-GS-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001531
€16.21

N13M-GS-S-A2

SR2EY i56200U

SR2EY i5-6200U

Part Number i5-6200U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001497
€229.74

SR2EY i5-6200U

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AM5545HE44HL A85545M

AM5545HE44HL A8-5545M

Part Number AM5545HE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

AM5545HE44HL A8-5545M Processor for Laptop AMD A-Series BGA827 1.7 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001503
€46.15

AM5545HE44HL A8-5545M

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N12EGE2BA1 GT555M

N12E-GE2-B-A1 GT555M

Part Number N12E-GE2-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1047

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001508
€45.95

N12E-GE2-B-A1 GT555M

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G98634U2

G98-634-U2

Part Number G98-634-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001522
€6.56

G98-634-U2

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N13MGEBA2

N13M-GE-B-A2

Part Number N13M-GE-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1429

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001530
€25.93

N13M-GE-B-A2

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N13MGSSA2

N13M-GS-S-A2

Part Number N13M-GS-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001531
€16.21

N13M-GS-S-A2

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