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N10MGSSA3

N10M-GS-S-A3

Part Number N10M-GS-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001664
€16.89

N10M-GS-S-A3

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DH82HM86 SR17E

DH82HM86 SR17E

Part Number DH82HM86 SR17E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1436

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001667
€45.95

DH82HM86 SR17E

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N10MNSSB1 G103M

N10M-NS-S-B1 G103M

Part Number N10M-NS-S-B1 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001672
€15.59

N10M-NS-S-B1 G103M

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G84600A2 8600MGT 128Bit 256Mb

G84-600-A2 8600MGT 128Bit 256Mb

Part Number G84-600-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1327

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001678
€49.23

G84-600-A2 8600MGT 128Bit 256Mb

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2150752003

215-0752003

Part Number 215-0752003 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1112

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001689
€31.87

215-0752003

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SR29E N3700

SR29E N3700

Part Number SR29E N3700 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001692
€58.88

SR29E N3700

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DC Power Jack Part PJ060

Compaq Mini 700 Series DC Power Jack Connector: 700, 700EA, 700ED, 700EE, 700EF, 700EI, 700EK, 700EL, 700EN, 700EP, 700ER, 700ES, 700ET, 700EW, 701ED, 701EG, 701EM, 701EN, 701ER, 701ES, 701ET, 702EA, 702EG, 703EA, 705EI, 705EL, 705ES, 730, 730EB, 730EE, 730EJ, 730EO, 730EV, 730EQ, 730EZ, 731EH, 731EI, 731ET, 732EG, 732ET, 733EF, 735EF, 735EI, 735EJ, 735EO, 735EQ

HP Mini 1000 Series DC Power Jack Connector: 1000, 1000 CTO, 1001XX, 1001TU, 1002TU, 1002XX, 1003TU, 1004TU, 1005TU, 1006TU, 1007TU, 1008TU, 1009TU, 1010LA, 1010NR, 1010TU, 1011TU, 1012TU, 1013TU, 1014TU, 1015TU, 1016TU, 1017TU, 1020LA, 1021TU, 1022TU, 1023TU, 1024TU, 1025TU, 1030NR, 1033CL, 1035NR, 1050LA, 1090LA, 1100, 1100 CTO, 1100CM, 1101TU, 1102TU, 1103TU, 1104TU, 1105TU, 1106TU, 1107TU, 1108TU, 1109TU, 1110NR, 1110TU, 1112TU, 1113TU, 1114TU, 1115NR, 1115TU, 1116NR, 1116TU, 1118TU, 1119TU, 1120LA, 1120BR, 1120NR, 1121TU, 1122TU, 1123TU, 1124TU, 1125NR, 1125TU, 1126NR, 1126TU, 1127TU, 1128TU, 1129TU, 1130CM, 1131TU, 1132TU, 1133CA, 1135CA, 1137NR, 1139NR, 1150BR, 1150CM, 1150NR, 1151NR, 1152NR, 1153NR, 1154NR, 1160CM, 1170CM, 1180CM

HP Mini 1000 Vivienne Tam Edition DC Power Jack Connector: 1000, 1018TU, 1019TU, 1020TU, 1097EI, 1098EI, 1099EA, 1099ED, 1099EE, 1099EF, 1099EG, 1099EK, 1099EL, 1099EI, 1099EM, 1099EN, 1099EP, 1099ER, 1099ES, 1099ET, 1099EW, 1100, 1100 CTO, 1111TU, 1117TU, 1120TU, 1140NR, 1141NR, 1198EO, 1199EA, 1199EB, 1199EC, 1199EE, 1199EH, 1199EJ, 1199EO, 1199ET, 1199EQ, 1199EV, 1199EZ

CH004023
€6.96

DC Power Jack, Part #PJ060

N10MGSSA3

N10M-GS-S-A3

Part Number N10M-GS-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001664
€16.89

N10M-GS-S-A3

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DH82HM86 SR17E

DH82HM86 SR17E

Part Number DH82HM86 SR17E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1436

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001667
€45.95

DH82HM86 SR17E

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N10MNSSB1 G103M

N10M-NS-S-B1 G103M

Part Number N10M-NS-S-B1 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001672
€15.59

N10M-NS-S-B1 G103M

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G84600A2 8600MGT 128Bit 256Mb

G84-600-A2 8600MGT 128Bit 256Mb

Part Number G84-600-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1327

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001678
€49.23

G84-600-A2 8600MGT 128Bit 256Mb

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2150752003

215-0752003

Part Number 215-0752003 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1112

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001689
€31.87

215-0752003

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SR29E N3700

SR29E N3700

Part Number SR29E N3700 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001692
€58.88

SR29E N3700

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DC Power Jack Part PJ060

Compaq Mini 700 Series DC Power Jack Connector: 700, 700EA, 700ED, 700EE, 700EF, 700EI, 700EK, 700EL, 700EN, 700EP, 700ER, 700ES, 700ET, 700EW, 701ED, 701EG, 701EM, 701EN, 701ER, 701ES, 701ET, 702EA, 702EG, 703EA, 705EI, 705EL, 705ES, 730, 730EB, 730EE, 730EJ, 730EO, 730EV, 730EQ, 730EZ, 731EH, 731EI, 731ET, 732EG, 732ET, 733EF, 735EF, 735EI, 735EJ, 735EO, 735EQ

HP Mini 1000 Series DC Power Jack Connector: 1000, 1000 CTO, 1001XX, 1001TU, 1002TU, 1002XX, 1003TU, 1004TU, 1005TU, 1006TU, 1007TU, 1008TU, 1009TU, 1010LA, 1010NR, 1010TU, 1011TU, 1012TU, 1013TU, 1014TU, 1015TU, 1016TU, 1017TU, 1020LA, 1021TU, 1022TU, 1023TU, 1024TU, 1025TU, 1030NR, 1033CL, 1035NR, 1050LA, 1090LA, 1100, 1100 CTO, 1100CM, 1101TU, 1102TU, 1103TU, 1104TU, 1105TU, 1106TU, 1107TU, 1108TU, 1109TU, 1110NR, 1110TU, 1112TU, 1113TU, 1114TU, 1115NR, 1115TU, 1116NR, 1116TU, 1118TU, 1119TU, 1120LA, 1120BR, 1120NR, 1121TU, 1122TU, 1123TU, 1124TU, 1125NR, 1125TU, 1126NR, 1126TU, 1127TU, 1128TU, 1129TU, 1130CM, 1131TU, 1132TU, 1133CA, 1135CA, 1137NR, 1139NR, 1150BR, 1150CM, 1150NR, 1151NR, 1152NR, 1153NR, 1154NR, 1160CM, 1170CM, 1180CM

HP Mini 1000 Vivienne Tam Edition DC Power Jack Connector: 1000, 1018TU, 1019TU, 1020TU, 1097EI, 1098EI, 1099EA, 1099ED, 1099EE, 1099EF, 1099EG, 1099EK, 1099EL, 1099EI, 1099EM, 1099EN, 1099EP, 1099ER, 1099ES, 1099ET, 1099EW, 1100, 1100 CTO, 1111TU, 1117TU, 1120TU, 1140NR, 1141NR, 1198EO, 1199EA, 1199EB, 1199EC, 1199EE, 1199EH, 1199EJ, 1199EO, 1199ET, 1199EQ, 1199EV, 1199EZ

CH004023
€6.96

DC Power Jack, Part #PJ060

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