Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Taiwan lead-free high quality 936 iron head

Characteristic:

1. special cast iron process, corrosion resistance, oxidation resistance, especially for long life.

2. strong immersion prolonged, easy to melt, Shangxi, solder joint round.

3. ? uniform inductance, stable quality, lead-free material.

4. lead-free environmental production, has passed the SGS test.

All soldering stations used in the 900M-T series

Such as table machine, 936 series welding platform

900M series lead-free soldering iron

? made of pure copper components, high thermal conductivity, fast heat transfer

? special iron surface plating, high temperature resistance, corrosion resistance

Special process, suitable for lead-free solder welding

? strong tin capacity, no oxidation, no tin, no tin, tin climbing phenomenon

? the outer layer is bright and delicate and very strong in rust resistance

? this product has passed the SGS environmental protection test

Life of soldering iron head

The life of the iron head is determined by the number of welds, and the length of life guaranteed depends on the coating thickness of the head. The thicker the coating, the longer the life of the iron head, but the heat transfer efficiency will be greatly reduced, the life of the iron tip for the same temperature series of iron head, fine iron head, life expectancy than a rough iron head life is shorter. Because the iron head is working, it will inevitably cause wear and tear on the surface of the nozzle life. Therefore, the fine iron head is more prone to wear, so to reduce the life of the soldering iron.

Maintenance of iron head

The use of new electric iron, electric iron can not bring the new use, need to be plated with a layer of solder in the iron head method is: according to the power supply when the temperature gradually increased, the rosin coated iron head; rosin smoke, to melt the solder iron head, with a the solder layer so as to strengthen the tip life.

250K PMTC 0.35mm BGA No Pb/Lead Free Solder Balls

Part Number 0.35mm BGA Solder Balls Manufacturer PMTC

BGA Alloy No Pb/Lead Free Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Part Name: Lenovo C540 All In One HDD SATA Cable

Part Number : DC02001MU10 / DC02001MU00

Buy BGA repaired Nozzle: * BGA repaired Nozzle Operation manual

Specification:

Total Power 4400W

Top heater 800W

Bottom heater Second heater 1200W, IR preheating

2400w

Power supply AC220V10% 50/60Hz

Dimensions L570*W550*H570mm

Positioning V-groove, PCB support can be adjusted in

any direction with external universal

fixture

Temperature control K Sensor, Closed loop

Temp accuracy 2?

PCB size Min: 20mm*20mm, Max:

320mm*375mm

BGA chip 2*2~80*80mm

Minimum chip spacing 0.15mm

External Temperature Sensor 1(optional)

Net weight 30 KG

DH-380 Main functions:

Three independent heaters all can set 8 segments heating, cooling and constant

temperature, save up to ten temperature profiles. IR preheat area can be controlled

according to PCB size

ARM control system and laser positioning, repairing all kinds of computer

motherboards and PC.

Embedded Industrial PC, high definition drawer style touch screen interface, PLC

control, and instant profile analysis function. Real-time settings and actual temperature

profile display can be used to analyzed and correct parameters if necessary.

K-type close circuit control and automatic temperature adjustment system, with PLC

and temperature module to enable precision temperature control of 2 degC. External

temperature sensor enables temperature monitoring and accurate analysis of real time

temperature profile.

V-groove PCB support for rapid, convenience and accurate positioning that fits for all

kinds of PCB board. Flexible and convenient removable fixture

Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and

replacement;

High powerful cross-flow fan and protect cover to enable fast cooling of PCB board

and prevent it from deformation.

Vacuum sucker and vacuum pen

Voice "early warning" function. 5-10 seconds before the completion of uninstalling or

welding, voice reminder / warning to get the workers prepared. Cooling system will start

after vertical wind stopped heating. When the temperature drops to room temperature, the

cooling process will stop, so that the machine will not age after heated up.

CE certification, with emergency switch and automatic power-off protection device

when emergency happens.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

BITMAIN AntMiner APW3+-12-1600 PSU Series

APW3++-12-1600-A3

Output Power :1600W

Brand Name : Antminer

Model Number :APW3++-12-1600-A3

Output Voltage: DC Voltage 12.15V

Output Current :133A

Voltage Range:100-240V AC

Starting Voltage:95-105V AC

Noise Level:<43DB

Input Frequency Range :47-63Hz

Output Interface :PCI-E (6 PIN) X 10

Dimensions :220mm*108mm*62mm

Weight :3kg

Shipping list:

New APW3++-12-1600-A3 PSU X 1 piece (You must provide your own a power cable )

Note:

1. The power cord is not included, please find one with at least 10A from your local market.

2. The APW3++ can deliver a maximum power of only 1200W if it is connected to a 110V mains power supply. To obtain the rated power of 1600W, the APW3++ must be connected to a 220-240V mains power supply. Please check the mains power supply that is the standard in your region before ordering.

3. This batch of PSU comes with only 10 PCIe connectors.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 5.9inch/15cm

Width: approx. 1.85inch/4.7cm

Model: B-7000

Net weight: 1.68fl.oz (50ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue