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  • Categories: DC Jacks, Connector
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Realtek ALC889

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000687
€3.45

Realtek ALC889

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Maxim MAX17811G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000690
€3.45

Maxim MAX17811G

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GMT G547E2P81U

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000691
€3.45

GMT G547E2P81U

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Intersil ISL6224

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000705
€3.45

Intersil ISL6224

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H2JTDG8UD1BMS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000707
€9.53

H2JTDG8UD1BMS

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PERICOM PI3L500 56Contact T

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000715
€3.45

PERICOM PI3L500 56-Contact T

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DC Power Jack Part PJ060

Compaq Mini 700 Series DC Power Jack Connector: 700, 700EA, 700ED, 700EE, 700EF, 700EI, 700EK, 700EL, 700EN, 700EP, 700ER, 700ES, 700ET, 700EW, 701ED, 701EG, 701EM, 701EN, 701ER, 701ES, 701ET, 702EA, 702EG, 703EA, 705EI, 705EL, 705ES, 730, 730EB, 730EE, 730EJ, 730EO, 730EV, 730EQ, 730EZ, 731EH, 731EI, 731ET, 732EG, 732ET, 733EF, 735EF, 735EI, 735EJ, 735EO, 735EQ

HP Mini 1000 Series DC Power Jack Connector: 1000, 1000 CTO, 1001XX, 1001TU, 1002TU, 1002XX, 1003TU, 1004TU, 1005TU, 1006TU, 1007TU, 1008TU, 1009TU, 1010LA, 1010NR, 1010TU, 1011TU, 1012TU, 1013TU, 1014TU, 1015TU, 1016TU, 1017TU, 1020LA, 1021TU, 1022TU, 1023TU, 1024TU, 1025TU, 1030NR, 1033CL, 1035NR, 1050LA, 1090LA, 1100, 1100 CTO, 1100CM, 1101TU, 1102TU, 1103TU, 1104TU, 1105TU, 1106TU, 1107TU, 1108TU, 1109TU, 1110NR, 1110TU, 1112TU, 1113TU, 1114TU, 1115NR, 1115TU, 1116NR, 1116TU, 1118TU, 1119TU, 1120LA, 1120BR, 1120NR, 1121TU, 1122TU, 1123TU, 1124TU, 1125NR, 1125TU, 1126NR, 1126TU, 1127TU, 1128TU, 1129TU, 1130CM, 1131TU, 1132TU, 1133CA, 1135CA, 1137NR, 1139NR, 1150BR, 1150CM, 1150NR, 1151NR, 1152NR, 1153NR, 1154NR, 1160CM, 1170CM, 1180CM

HP Mini 1000 Vivienne Tam Edition DC Power Jack Connector: 1000, 1018TU, 1019TU, 1020TU, 1097EI, 1098EI, 1099EA, 1099ED, 1099EE, 1099EF, 1099EG, 1099EK, 1099EL, 1099EI, 1099EM, 1099EN, 1099EP, 1099ER, 1099ES, 1099ET, 1099EW, 1100, 1100 CTO, 1111TU, 1117TU, 1120TU, 1140NR, 1141NR, 1198EO, 1199EA, 1199EB, 1199EC, 1199EE, 1199EH, 1199EJ, 1199EO, 1199ET, 1199EQ, 1199EV, 1199EZ

CH004023
€6.96

DC Power Jack, Part #PJ060

Realtek ALC889

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000687
€3.45

Realtek ALC889

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Maxim MAX17811G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000690
€3.45

Maxim MAX17811G

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Compare

GMT G547E2P81U

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000691
€3.45

GMT G547E2P81U

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Compare

Intersil ISL6224

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000705
€3.45

Intersil ISL6224

wishlist
Compare

H2JTDG8UD1BMS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000707
€9.53

H2JTDG8UD1BMS

wishlist
Compare

PERICOM PI3L500 56Contact T

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000715
€3.45

PERICOM PI3L500 56-Contact T

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Compare

DC Power Jack Part PJ060

Compaq Mini 700 Series DC Power Jack Connector: 700, 700EA, 700ED, 700EE, 700EF, 700EI, 700EK, 700EL, 700EN, 700EP, 700ER, 700ES, 700ET, 700EW, 701ED, 701EG, 701EM, 701EN, 701ER, 701ES, 701ET, 702EA, 702EG, 703EA, 705EI, 705EL, 705ES, 730, 730EB, 730EE, 730EJ, 730EO, 730EV, 730EQ, 730EZ, 731EH, 731EI, 731ET, 732EG, 732ET, 733EF, 735EF, 735EI, 735EJ, 735EO, 735EQ

HP Mini 1000 Series DC Power Jack Connector: 1000, 1000 CTO, 1001XX, 1001TU, 1002TU, 1002XX, 1003TU, 1004TU, 1005TU, 1006TU, 1007TU, 1008TU, 1009TU, 1010LA, 1010NR, 1010TU, 1011TU, 1012TU, 1013TU, 1014TU, 1015TU, 1016TU, 1017TU, 1020LA, 1021TU, 1022TU, 1023TU, 1024TU, 1025TU, 1030NR, 1033CL, 1035NR, 1050LA, 1090LA, 1100, 1100 CTO, 1100CM, 1101TU, 1102TU, 1103TU, 1104TU, 1105TU, 1106TU, 1107TU, 1108TU, 1109TU, 1110NR, 1110TU, 1112TU, 1113TU, 1114TU, 1115NR, 1115TU, 1116NR, 1116TU, 1118TU, 1119TU, 1120LA, 1120BR, 1120NR, 1121TU, 1122TU, 1123TU, 1124TU, 1125NR, 1125TU, 1126NR, 1126TU, 1127TU, 1128TU, 1129TU, 1130CM, 1131TU, 1132TU, 1133CA, 1135CA, 1137NR, 1139NR, 1150BR, 1150CM, 1150NR, 1151NR, 1152NR, 1153NR, 1154NR, 1160CM, 1170CM, 1180CM

HP Mini 1000 Vivienne Tam Edition DC Power Jack Connector: 1000, 1018TU, 1019TU, 1020TU, 1097EI, 1098EI, 1099EA, 1099ED, 1099EE, 1099EF, 1099EG, 1099EK, 1099EL, 1099EI, 1099EM, 1099EN, 1099EP, 1099ER, 1099ES, 1099ET, 1099EW, 1100, 1100 CTO, 1111TU, 1117TU, 1120TU, 1140NR, 1141NR, 1198EO, 1199EA, 1199EB, 1199EC, 1199EE, 1199EH, 1199EJ, 1199EO, 1199ET, 1199EQ, 1199EV, 1199EZ

CH004023
€6.96

DC Power Jack, Part #PJ060

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