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RT8209A5

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000716
€3.45

RT8209(A5)

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Maxim MAX1977

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000719
€3.97

Maxim MAX1977

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OZMICRO OZ8116

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000720
€3.45

OZMICRO OZ8116

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ITE IT8720F CXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000725
€3.97

ITE IT8720F CXS

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ITE IT8517E DXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000727
€3.45

ITE IT8517E (DXS)

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Multifunction SOIC16 SOP16 SOP8 To DIP8 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 30CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

CH002241
€8.70

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

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91955B TO252

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000732
€3.45

91955B TO252

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KB9012 simple PCB Board for RT80x809H Programmer

RT809F RT809H optional accessories - KB9012 offline read-write adapter board, this is a piece, including PCB, 4 PIN needle row 2 groups.

Need to prepare the following materials and weld: 0603 package piece resistance one, resistance value 47K or 51K, bit number R1; 0603 package piece capacity two, 0.1uF, bit number C3 and C4; 10uF or 22uF capacitor one, package 0603 or 1206, bit number C1 or C2, install one. (Capacitor withstand voltage can be regardless, greater than 5V can be)

CH002252
€2.70

KB9012 simple PCB Board for RT809F RT809H Programmer

RT8209A5

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000716
€3.45

RT8209(A5)

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Maxim MAX1977

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000719
€3.97

Maxim MAX1977

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Compare

OZMICRO OZ8116

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000720
€3.45

OZMICRO OZ8116

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Compare

ITE IT8720F CXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000725
€3.97

ITE IT8720F CXS

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ITE IT8517E DXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000727
€3.45

ITE IT8517E (DXS)

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Multifunction SOIC16 SOP16 SOP8 To DIP8 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 30CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

CH002241
€8.70

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

wishlist
Compare

91955B TO252

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000732
€3.45

91955B TO252

wishlist
Compare

KB9012 simple PCB Board for RT80x809H Programmer

RT809F RT809H optional accessories - KB9012 offline read-write adapter board, this is a piece, including PCB, 4 PIN needle row 2 groups.

Need to prepare the following materials and weld: 0603 package piece resistance one, resistance value 47K or 51K, bit number R1; 0603 package piece capacity two, 0.1uF, bit number C3 and C4; 10uF or 22uF capacitor one, package 0603 or 1206, bit number C1 or C2, install one. (Capacitor withstand voltage can be regardless, greater than 5V can be)

CH002252
€2.70

KB9012 simple PCB Board for RT809F RT809H Programmer

wishlist
Compare
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