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Winbond 25Q64CVSIG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003412
€3.45

Winbond 25Q64CVSIG

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E09A92GA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003413
€6.16

E09A92GA

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PM8916

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003414
€3.45

PM8916

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SEMS 18LF SAMSUNG

SEMS 18-LF SAMSUNG

Part Number SEMS 18-LF Manufacturer SAMSUNG

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003415
€7.94

SEMS 18-LF SAMSUNG

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AON7410

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003417
€3.45

AON7410

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FUJITSU MB39A136

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003418
€3.45

FUJITSU MB39A136

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AMIC A25L032MF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003419
€3.45

AMIC A25L032M-F

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TI SN608098

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003420
€3.45

TI SN608098

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ITE IT8512E EXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003421
€3.45

ITE IT8512E (EXA)

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PCI PCIE LPC MiniPCIE Analyzer Type B Card KQCPET6V8 for PC Laptop Android phone Tester

PCI PCIE LPC MiniPCI-E Analyzer Type B Diagnostic Card KQCPET6-V8 for PC Laptop Tester Android phone

KQCPET6-V8

Login to Download: Download software Use Tutorials Video

Highlights

? Fit for desktop computer and laptop.

? An advanced computer motherboard CPU ram hardware diagnostic test card with motherboards stability test feature

? Latest 4-in-1 version with LCD panel extension connector

? An extra nice feature of quick test of the computer system stability

? Can work with/without CPU/RAM on board

? Come with extra method (QG diagnosis) of testing the computers besides the traditional Bios POST code method

? Great for onsite technicians, computer admin and home/office personal uses

? Allows the users to test the hardware errors + testing the computer working stability in a matter of minute

Specifications

? This is an advanced PC device that is capable of testing the PC computers with different types of CPUs, including ALL series of previous and latest Intel / AMD / Cyrix CPUs

? It can test the components of computer main board working or not and test the initialization of the system hardware, such as: System Chipset, CPU Initialization and Registration, HDD Controllers, System Cache, Extended Memory RAM, Keyboard/Mouse Controller, Sound and LAN Controller, Video Memory and Controller etc

What is in the box

? 1 x Main Diagnostic Card

? 1 x USB Power Cable

? 1 x MiniPCI-E PCB. for Laptop

? 1 x Campal EC Cable

? 1 x LPC Fly Line

? 1 x English Manual

Note

? Please kindly note that it is suitable for PCI slot, PCIE, LPC and MiniPCIE

? Do not plug PCI-E interface to PCI or AGP or any other NON-PCI-E slot, it will damage the diagnostic card or computer when power supply is on

CH003422
€34.69

PCI PCIE LPC MiniPCI-E Analyzer Type B Card KQCPET6-V8 for PC Laptop Android phone Tester

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Intersil ISL6208D

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003423
€3.45

Intersil ISL6208D

Winbond 25Q64CVSIG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003412
€3.45

Winbond 25Q64CVSIG

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E09A92GA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003413
€6.16

E09A92GA

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PM8916

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003414
€3.45

PM8916

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SEMS 18LF SAMSUNG

SEMS 18-LF SAMSUNG

Part Number SEMS 18-LF Manufacturer SAMSUNG

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003415
€7.94

SEMS 18-LF SAMSUNG

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AON7410

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003417
€3.45

AON7410

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Compare

FUJITSU MB39A136

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003418
€3.45

FUJITSU MB39A136

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AMIC A25L032MF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003419
€3.45

AMIC A25L032M-F

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TI SN608098

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003420
€3.45

TI SN608098

wishlist
Compare

ITE IT8512E EXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003421
€3.45

ITE IT8512E (EXA)

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PCI PCIE LPC MiniPCIE Analyzer Type B Card KQCPET6V8 for PC Laptop Android phone Tester

PCI PCIE LPC MiniPCI-E Analyzer Type B Diagnostic Card KQCPET6-V8 for PC Laptop Tester Android phone

KQCPET6-V8

Login to Download: Download software Use Tutorials Video

Highlights

? Fit for desktop computer and laptop.

? An advanced computer motherboard CPU ram hardware diagnostic test card with motherboards stability test feature

? Latest 4-in-1 version with LCD panel extension connector

? An extra nice feature of quick test of the computer system stability

? Can work with/without CPU/RAM on board

? Come with extra method (QG diagnosis) of testing the computers besides the traditional Bios POST code method

? Great for onsite technicians, computer admin and home/office personal uses

? Allows the users to test the hardware errors + testing the computer working stability in a matter of minute

Specifications

? This is an advanced PC device that is capable of testing the PC computers with different types of CPUs, including ALL series of previous and latest Intel / AMD / Cyrix CPUs

? It can test the components of computer main board working or not and test the initialization of the system hardware, such as: System Chipset, CPU Initialization and Registration, HDD Controllers, System Cache, Extended Memory RAM, Keyboard/Mouse Controller, Sound and LAN Controller, Video Memory and Controller etc

What is in the box

? 1 x Main Diagnostic Card

? 1 x USB Power Cable

? 1 x MiniPCI-E PCB. for Laptop

? 1 x Campal EC Cable

? 1 x LPC Fly Line

? 1 x English Manual

Note

? Please kindly note that it is suitable for PCI slot, PCIE, LPC and MiniPCIE

? Do not plug PCI-E interface to PCI or AGP or any other NON-PCI-E slot, it will damage the diagnostic card or computer when power supply is on

CH003422
€34.69

PCI PCIE LPC MiniPCI-E Analyzer Type B Card KQCPET6-V8 for PC Laptop Android phone Tester

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Intersil ISL6208D

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003423
€3.45

Intersil ISL6208D

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