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2150752001 SR880M

215-0752001 SR880M

Part Number 215-0752001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003449
€22.60

215-0752001 SR880M

BD82H61 SLJ4B Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003450
€5.40

BD82H61 SLJ4B Stencil Template

Arduino Nano V30 ATmega328P CH340 5V 16M Microcontroller Compatible Mini USB

Item Description

Specification:

-CH340G Replace FT232RL.

-Operating Voltage(logic level): 5V.

-8 analog inputs ports:A0 ~ A7.

-14 Digital input / output ports:TX,RX,D2 ~ D13.

-6 PWM ports:D3, D5, D6, D9, D10, D11.

-1 pairs of TTL level serial transceiver ports RX / TX.

-Support USB download and Power.

-Support for external 5V ~ 12V DC power supply, and 9V battery.

-Support ISP download.

2014 Driver version 3.4.2014.8 for Windows 8+: arduined.eu/ch340-windows-8-driver-download/

The new driver CH34x_Install.zip for Mac OS-X El Capitan: kig.re/downloads/CH34x_Install.zip Older Driver for MAC: kig.re/downloads/CH341SER_MAC.ZIP

Arduino IDE download link : arduino.cc/en/Main/Software

You can learn more about how to use the nano at below link:

https://kiguino.moos.io/2014/12/31/how-to-use-arduino-nano-mini-pro-with-CH340G-on-mac-osx-yosemite.html

Package included

1* Nano V3.0 ATmega328P 5V 16MHz CH340G Micro-controller Development Board (Welded)

Main Features

CH340G Replace FT232RL, works well with Arduino IDE

Micro-controller chip: Atmega328P, support ISP download

8 Analog inputs ports and 14 digital input/output ports

Mini USB for download and power supply

Support for external 5V~12V DC power supply and 9V battery

CH003452
€6.50

Arduino Nano V3.0 ATmega328P CH340 5V 16M Microcontroller Compatible Mini USB

216QMAKA14FG M72M

216QMAKA14FG M72-M

Part Number 216QMAKA14FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0831

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003453
€40.05

216QMAKA14FG M72-M

N10MGE2S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003454
€5.40

N10M-GE2-S Stencil Template

Realtek RTM862480

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003455
€3.45

Realtek RTM862-480

i52467M SR0D6 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003456
€17.14

i5-2467M SR0D6 Stencil Template 90*90

Pentium DualCore Mobile 967 SR0FC Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003457
€5.40

Pentium Dual-Core Mobile 967 SR0FC Stencil Template

2180755046 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003458
€5.40

218-0755046 Stencil Template

Intersil ISL6232

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003459
€3.45

Intersil ISL6232

2150752001 SR880M

215-0752001 SR880M

Part Number 215-0752001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003449
€22.60

215-0752001 SR880M

BD82H61 SLJ4B Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003450
€5.40

BD82H61 SLJ4B Stencil Template

Arduino Nano V30 ATmega328P CH340 5V 16M Microcontroller Compatible Mini USB

Item Description

Specification:

-CH340G Replace FT232RL.

-Operating Voltage(logic level): 5V.

-8 analog inputs ports:A0 ~ A7.

-14 Digital input / output ports:TX,RX,D2 ~ D13.

-6 PWM ports:D3, D5, D6, D9, D10, D11.

-1 pairs of TTL level serial transceiver ports RX / TX.

-Support USB download and Power.

-Support for external 5V ~ 12V DC power supply, and 9V battery.

-Support ISP download.

2014 Driver version 3.4.2014.8 for Windows 8+: arduined.eu/ch340-windows-8-driver-download/

The new driver CH34x_Install.zip for Mac OS-X El Capitan: kig.re/downloads/CH34x_Install.zip Older Driver for MAC: kig.re/downloads/CH341SER_MAC.ZIP

Arduino IDE download link : arduino.cc/en/Main/Software

You can learn more about how to use the nano at below link:

https://kiguino.moos.io/2014/12/31/how-to-use-arduino-nano-mini-pro-with-CH340G-on-mac-osx-yosemite.html

Package included

1* Nano V3.0 ATmega328P 5V 16MHz CH340G Micro-controller Development Board (Welded)

Main Features

CH340G Replace FT232RL, works well with Arduino IDE

Micro-controller chip: Atmega328P, support ISP download

8 Analog inputs ports and 14 digital input/output ports

Mini USB for download and power supply

Support for external 5V~12V DC power supply and 9V battery

CH003452
€6.50

Arduino Nano V3.0 ATmega328P CH340 5V 16M Microcontroller Compatible Mini USB

216QMAKA14FG M72M

216QMAKA14FG M72-M

Part Number 216QMAKA14FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0831

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003453
€40.05

216QMAKA14FG M72-M

N10MGE2S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003454
€5.40

N10M-GE2-S Stencil Template

Realtek RTM862480

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003455
€3.45

Realtek RTM862-480

i52467M SR0D6 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003456
€17.14

i5-2467M SR0D6 Stencil Template 90*90

Pentium DualCore Mobile 967 SR0FC Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003457
€5.40

Pentium Dual-Core Mobile 967 SR0FC Stencil Template

2180755046 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003458
€5.40

218-0755046 Stencil Template

Intersil ISL6232

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003459
€3.45

Intersil ISL6232