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VIA VT1211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000409
€3.45

VIA VT1211

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N14EGTXWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000410
€7.46

N14E-GTX-W-A2 Stencil Template

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MASTECH MS8239C Digital Multimeters wFrequency Capacitance Temperature Test

Features:

Pocket Size

Tests Voltage, Current, Resistance, Capacitance, Frequency and Duty Cycle

Diode Check and Continuity Test

Type K thermocouple contact temperature measurement

Data Hold and Display Back Light

MAX LCD Display: 4000Counts

Auto Power Off

Specification:

DC voltage: 400mV/4V/40V/400V/600V (0.5% +3)

AC voltage: 4V/40V/400V/600V (1.2% +5)

DC current: 400uA/4000uA/40mA/400mA (1.0% +5), 10A (2.0% +10)

AC current: 400uA/4000uA/40mA/400mA (1.2% +5), 10A (2.5% +10)

Resistance: 200O/2KO/20KO/200KO/2MO (0.8% +5)

Frequency: 0HZ ~ 9.999MHz (1.5% +5)

Capacitance: 5nF/50nF/500nF/5uF/50uF/100uF (3.0% +5)

Duty cycle: 1% ~ 99.9% (3.0% +5)

Temperature ( C) -20 C ~ 1000 C (3.0% +3)

Temperature ( F) -4 F ~ 1832 F (3.0% +3)

General Characteristics:

Dimension: 150mm * 74mm * 41mm

Product Weight: 202g

Power Supply: 2 * 1.5V AAA (not included)

Package Size: 16 * 11 * 5cm / 6.2 * 4.4 * 2in

Package Weight: 330g / 11.7oz

Package List:H13110 *1 / MS8239C

1 * Palm Size MASTECH MS8239C Auto Ranging Digital Multimeter

1 * Type K Thermocouple

1 * Pair Test Lead

1 * English Manual

CH000411
€30.96

MASTECH MS8239C Digital Multimeters w/Frequency Capacitance Temperature Test

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RT9921GQV Richtek A9FA X18

RT9921GQV Richtek A9=FA X18

Part Number RT9921GQV Manufacturer Richtek

BGA Alloy No Pb/Lead Free Date Code 1306

Package/Case 1500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000412
€3.45

RT9921GQV Richtek A9=FA X18

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2160811030 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000413
€9.97

216-0811030 Stencil Template 90*90

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Maxim MAX3243

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000415
€3.45

Maxim MAX3243

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STLINK V2 JTAG USB Programming STM8 STM32 Debug Programmer Downloader Tools

ST-Link/V2 STM8 STM32 Debugging Emulator Download Programming Unit

Basic Properties:

ST-LINK / V2 is ST STMicroelectronics evaluation, development STM8 and STM32 family MCU series designed to set online download for the integration of simulation and development tools.

STM8 family via SWIM interface with the ST-LINK / V2 connection;

STM32 family through the JTAG / SWD interface with the ST-LINK / V2 connections.

ST-LINK / V2 and PC via high speed USB2.0 connection.

Supported Software:

Direct support ST official IDE (Integrated Development Environment software) ST Visual Develop (STVD) and burning software ST Visual Program (STVP).

Support ATOLLIC, IAR and Keil, TASKING integrated development environment such as the STM32.

Supported Devices:

Supports all interfaces with SWIM STM8 MCU

Supports all with JTAG / SWD interface STM32 MCU

Package list:

1 x ST-Link/V2 main unit

1 x USB Data Cable

1 x 20pin cable

2 x SWIM Cable

CH000416
€14.30

ST-LINK V2 JTAG USB Programming STM8 / STM32 Debug Programmer Downloader Tools

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M5Y71 SR23Q Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000417
€7.46

M-5Y71 SR23Q Stencil Template

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H99261 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000418
€14.92

H99261 Stencil Template 90*90

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RICHTEK RT9202

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000420
€3.45

RICHTEK RT9202

VIA VT1211

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000409
€3.45

VIA VT1211

wishlist
Compare

N14EGTXWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000410
€7.46

N14E-GTX-W-A2 Stencil Template

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MASTECH MS8239C Digital Multimeters wFrequency Capacitance Temperature Test

Features:

Pocket Size

Tests Voltage, Current, Resistance, Capacitance, Frequency and Duty Cycle

Diode Check and Continuity Test

Type K thermocouple contact temperature measurement

Data Hold and Display Back Light

MAX LCD Display: 4000Counts

Auto Power Off

Specification:

DC voltage: 400mV/4V/40V/400V/600V (0.5% +3)

AC voltage: 4V/40V/400V/600V (1.2% +5)

DC current: 400uA/4000uA/40mA/400mA (1.0% +5), 10A (2.0% +10)

AC current: 400uA/4000uA/40mA/400mA (1.2% +5), 10A (2.5% +10)

Resistance: 200O/2KO/20KO/200KO/2MO (0.8% +5)

Frequency: 0HZ ~ 9.999MHz (1.5% +5)

Capacitance: 5nF/50nF/500nF/5uF/50uF/100uF (3.0% +5)

Duty cycle: 1% ~ 99.9% (3.0% +5)

Temperature ( C) -20 C ~ 1000 C (3.0% +3)

Temperature ( F) -4 F ~ 1832 F (3.0% +3)

General Characteristics:

Dimension: 150mm * 74mm * 41mm

Product Weight: 202g

Power Supply: 2 * 1.5V AAA (not included)

Package Size: 16 * 11 * 5cm / 6.2 * 4.4 * 2in

Package Weight: 330g / 11.7oz

Package List:H13110 *1 / MS8239C

1 * Palm Size MASTECH MS8239C Auto Ranging Digital Multimeter

1 * Type K Thermocouple

1 * Pair Test Lead

1 * English Manual

CH000411
€30.96

MASTECH MS8239C Digital Multimeters w/Frequency Capacitance Temperature Test

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RT9921GQV Richtek A9FA X18

RT9921GQV Richtek A9=FA X18

Part Number RT9921GQV Manufacturer Richtek

BGA Alloy No Pb/Lead Free Date Code 1306

Package/Case 1500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000412
€3.45

RT9921GQV Richtek A9=FA X18

wishlist
Compare

2160811030 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000413
€9.97

216-0811030 Stencil Template 90*90

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Compare

FULL SET OF CPU SOCKET TESTER FOR LAPTOP

FULL SET OF CPU SOCKET TESTER FOR LAPTOP

The two generation, the three generation, the five generation, AMD638, 989, MIN, DDR3, DDR4

Login to Download: * User Manual Download

CH000414
€69.00

FULL SET OF CPU SOCKET TESTER FOR LAPTOP

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Maxim MAX3243

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000415
€3.45

Maxim MAX3243

wishlist
Compare

STLINK V2 JTAG USB Programming STM8 STM32 Debug Programmer Downloader Tools

ST-Link/V2 STM8 STM32 Debugging Emulator Download Programming Unit

Basic Properties:

ST-LINK / V2 is ST STMicroelectronics evaluation, development STM8 and STM32 family MCU series designed to set online download for the integration of simulation and development tools.

STM8 family via SWIM interface with the ST-LINK / V2 connection;

STM32 family through the JTAG / SWD interface with the ST-LINK / V2 connections.

ST-LINK / V2 and PC via high speed USB2.0 connection.

Supported Software:

Direct support ST official IDE (Integrated Development Environment software) ST Visual Develop (STVD) and burning software ST Visual Program (STVP).

Support ATOLLIC, IAR and Keil, TASKING integrated development environment such as the STM32.

Supported Devices:

Supports all interfaces with SWIM STM8 MCU

Supports all with JTAG / SWD interface STM32 MCU

Package list:

1 x ST-Link/V2 main unit

1 x USB Data Cable

1 x 20pin cable

2 x SWIM Cable

CH000416
€14.30

ST-LINK V2 JTAG USB Programming STM8 / STM32 Debug Programmer Downloader Tools

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Compare

M5Y71 SR23Q Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000417
€7.46

M-5Y71 SR23Q Stencil Template

wishlist
Compare

H99261 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000418
€14.92

H99261 Stencil Template 90*90

wishlist
Compare

RICHTEK RT9202

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000420
€3.45

RICHTEK RT9202

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