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  • Categories: BGA Soldering Preheating Station
  • Categories: DC Jacks, Connector
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  • Categories: Other BGA Chips & ICs
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PERICOM PI3L500 56Contact T

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000715
€3.45

PERICOM PI3L500 56-Contact T

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DC Power Jack Part PJ060

Compaq Mini 700 Series DC Power Jack Connector: 700, 700EA, 700ED, 700EE, 700EF, 700EI, 700EK, 700EL, 700EN, 700EP, 700ER, 700ES, 700ET, 700EW, 701ED, 701EG, 701EM, 701EN, 701ER, 701ES, 701ET, 702EA, 702EG, 703EA, 705EI, 705EL, 705ES, 730, 730EB, 730EE, 730EJ, 730EO, 730EV, 730EQ, 730EZ, 731EH, 731EI, 731ET, 732EG, 732ET, 733EF, 735EF, 735EI, 735EJ, 735EO, 735EQ

HP Mini 1000 Series DC Power Jack Connector: 1000, 1000 CTO, 1001XX, 1001TU, 1002TU, 1002XX, 1003TU, 1004TU, 1005TU, 1006TU, 1007TU, 1008TU, 1009TU, 1010LA, 1010NR, 1010TU, 1011TU, 1012TU, 1013TU, 1014TU, 1015TU, 1016TU, 1017TU, 1020LA, 1021TU, 1022TU, 1023TU, 1024TU, 1025TU, 1030NR, 1033CL, 1035NR, 1050LA, 1090LA, 1100, 1100 CTO, 1100CM, 1101TU, 1102TU, 1103TU, 1104TU, 1105TU, 1106TU, 1107TU, 1108TU, 1109TU, 1110NR, 1110TU, 1112TU, 1113TU, 1114TU, 1115NR, 1115TU, 1116NR, 1116TU, 1118TU, 1119TU, 1120LA, 1120BR, 1120NR, 1121TU, 1122TU, 1123TU, 1124TU, 1125NR, 1125TU, 1126NR, 1126TU, 1127TU, 1128TU, 1129TU, 1130CM, 1131TU, 1132TU, 1133CA, 1135CA, 1137NR, 1139NR, 1150BR, 1150CM, 1150NR, 1151NR, 1152NR, 1153NR, 1154NR, 1160CM, 1170CM, 1180CM

HP Mini 1000 Vivienne Tam Edition DC Power Jack Connector: 1000, 1018TU, 1019TU, 1020TU, 1097EI, 1098EI, 1099EA, 1099ED, 1099EE, 1099EF, 1099EG, 1099EK, 1099EL, 1099EI, 1099EM, 1099EN, 1099EP, 1099ER, 1099ES, 1099ET, 1099EW, 1100, 1100 CTO, 1111TU, 1117TU, 1120TU, 1140NR, 1141NR, 1198EO, 1199EA, 1199EB, 1199EC, 1199EE, 1199EH, 1199EJ, 1199EO, 1199ET, 1199EQ, 1199EV, 1199EZ

CH004023
€6.96

DC Power Jack, Part #PJ060

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RT8209A5

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000716
€3.45

RT8209(A5)

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Maxim MAX1977

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000719
€3.97

Maxim MAX1977

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OZMICRO OZ8116

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000720
€3.45

OZMICRO OZ8116

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ITE IT8720F CXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000725
€3.97

ITE IT8720F CXS

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ITE IT8517E DXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000727
€3.45

ITE IT8517E (DXS)

PERICOM PI3L500 56Contact T

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000715
€3.45

PERICOM PI3L500 56-Contact T

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DC Power Jack Part PJ060

Compaq Mini 700 Series DC Power Jack Connector: 700, 700EA, 700ED, 700EE, 700EF, 700EI, 700EK, 700EL, 700EN, 700EP, 700ER, 700ES, 700ET, 700EW, 701ED, 701EG, 701EM, 701EN, 701ER, 701ES, 701ET, 702EA, 702EG, 703EA, 705EI, 705EL, 705ES, 730, 730EB, 730EE, 730EJ, 730EO, 730EV, 730EQ, 730EZ, 731EH, 731EI, 731ET, 732EG, 732ET, 733EF, 735EF, 735EI, 735EJ, 735EO, 735EQ

HP Mini 1000 Series DC Power Jack Connector: 1000, 1000 CTO, 1001XX, 1001TU, 1002TU, 1002XX, 1003TU, 1004TU, 1005TU, 1006TU, 1007TU, 1008TU, 1009TU, 1010LA, 1010NR, 1010TU, 1011TU, 1012TU, 1013TU, 1014TU, 1015TU, 1016TU, 1017TU, 1020LA, 1021TU, 1022TU, 1023TU, 1024TU, 1025TU, 1030NR, 1033CL, 1035NR, 1050LA, 1090LA, 1100, 1100 CTO, 1100CM, 1101TU, 1102TU, 1103TU, 1104TU, 1105TU, 1106TU, 1107TU, 1108TU, 1109TU, 1110NR, 1110TU, 1112TU, 1113TU, 1114TU, 1115NR, 1115TU, 1116NR, 1116TU, 1118TU, 1119TU, 1120LA, 1120BR, 1120NR, 1121TU, 1122TU, 1123TU, 1124TU, 1125NR, 1125TU, 1126NR, 1126TU, 1127TU, 1128TU, 1129TU, 1130CM, 1131TU, 1132TU, 1133CA, 1135CA, 1137NR, 1139NR, 1150BR, 1150CM, 1150NR, 1151NR, 1152NR, 1153NR, 1154NR, 1160CM, 1170CM, 1180CM

HP Mini 1000 Vivienne Tam Edition DC Power Jack Connector: 1000, 1018TU, 1019TU, 1020TU, 1097EI, 1098EI, 1099EA, 1099ED, 1099EE, 1099EF, 1099EG, 1099EK, 1099EL, 1099EI, 1099EM, 1099EN, 1099EP, 1099ER, 1099ES, 1099ET, 1099EW, 1100, 1100 CTO, 1111TU, 1117TU, 1120TU, 1140NR, 1141NR, 1198EO, 1199EA, 1199EB, 1199EC, 1199EE, 1199EH, 1199EJ, 1199EO, 1199ET, 1199EQ, 1199EV, 1199EZ

CH004023
€6.96

DC Power Jack, Part #PJ060

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RT8209A5

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000716
€3.45

RT8209(A5)

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Maxim MAX1977

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000719
€3.97

Maxim MAX1977

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OZMICRO OZ8116

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000720
€3.45

OZMICRO OZ8116

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ITE IT8720F CXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000725
€3.97

ITE IT8720F CXS

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ITE IT8517E DXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000727
€3.45

ITE IT8517E (DXS)

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