216PVAVA12FG X2300

Part Number 216PVAVA12FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Part Name: Lenovo C540 All In One HDD SATA Cable

Part Number : DC02001MU10 / DC02001MU00

SR071 i5-2415M

Part Number SR071 I5-2415M Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

SR071 i5-2415M AV8062701085700 Core i5 Mobile CPU BGA1023 2.3 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GF-GO7400-N-A3

Part Number GF-GO7400-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1243

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Buy BGA repaired Nozzle: * BGA repaired Nozzle Operation manual

Specification:

Total Power 4400W

Top heater 800W

Bottom heater Second heater 1200W, IR preheating

2400w

Power supply AC220V10% 50/60Hz

Dimensions L570*W550*H570mm

Positioning V-groove, PCB support can be adjusted in

any direction with external universal

fixture

Temperature control K Sensor, Closed loop

Temp accuracy 2?

PCB size Min: 20mm*20mm, Max:

320mm*375mm

BGA chip 2*2~80*80mm

Minimum chip spacing 0.15mm

External Temperature Sensor 1(optional)

Net weight 30 KG

DH-380 Main functions:

Three independent heaters all can set 8 segments heating, cooling and constant

temperature, save up to ten temperature profiles. IR preheat area can be controlled

according to PCB size

ARM control system and laser positioning, repairing all kinds of computer

motherboards and PC.

Embedded Industrial PC, high definition drawer style touch screen interface, PLC

control, and instant profile analysis function. Real-time settings and actual temperature

profile display can be used to analyzed and correct parameters if necessary.

K-type close circuit control and automatic temperature adjustment system, with PLC

and temperature module to enable precision temperature control of 2 degC. External

temperature sensor enables temperature monitoring and accurate analysis of real time

temperature profile.

V-groove PCB support for rapid, convenience and accurate positioning that fits for all

kinds of PCB board. Flexible and convenient removable fixture

Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and

replacement;

High powerful cross-flow fan and protect cover to enable fast cooling of PCB board

and prevent it from deformation.

Vacuum sucker and vacuum pen

Voice "early warning" function. 5-10 seconds before the completion of uninstalling or

welding, voice reminder / warning to get the workers prepared. Cooling system will start

after vertical wind stopped heating. When the temperature drops to room temperature, the

cooling process will stop, so that the machine will not age after heated up.

CE certification, with emergency switch and automatic power-off protection device

when emergency happens.

BITMAIN AntMiner APW3+-12-1600 PSU Series

APW3++-12-1600-A3

Output Power :1600W

Brand Name : Antminer

Model Number :APW3++-12-1600-A3

Output Voltage: DC Voltage 12.15V

Output Current :133A

Voltage Range:100-240V AC

Starting Voltage:95-105V AC

Noise Level:<43DB

Input Frequency Range :47-63Hz

Output Interface :PCI-E (6 PIN) X 10

Dimensions :220mm*108mm*62mm

Weight :3kg

Shipping list:

New APW3++-12-1600-A3 PSU X 1 piece (You must provide your own a power cable )

Note:

1. The power cord is not included, please find one with at least 10A from your local market.

2. The APW3++ can deliver a maximum power of only 1200W if it is connected to a 110V mains power supply. To obtain the rated power of 1600W, the APW3++ must be connected to a 220-240V mains power supply. Please check the mains power supply that is the standard in your region before ordering.

3. This batch of PSU comes with only 10 PCIe connectors.

N12E-GE2-A1 G555M

Part Number N12E-GE2-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1042

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N12P-GV-S-A1

Part Number N12P-GV-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1152

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 5.9inch/15cm

Width: approx. 1.85inch/4.7cm

Model: B-7000

Net weight: 1.68fl.oz (50ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

216-0752001 SR880M HD4250

Part Number 216-0752001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0811000 HD6770

Part Number 216-0811000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock