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2150752003

215-0752003

Part Number 215-0752003 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1112

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001689
€31.87

215-0752003

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DC Power Jack Part PJ060

Compaq Mini 700 Series DC Power Jack Connector: 700, 700EA, 700ED, 700EE, 700EF, 700EI, 700EK, 700EL, 700EN, 700EP, 700ER, 700ES, 700ET, 700EW, 701ED, 701EG, 701EM, 701EN, 701ER, 701ES, 701ET, 702EA, 702EG, 703EA, 705EI, 705EL, 705ES, 730, 730EB, 730EE, 730EJ, 730EO, 730EV, 730EQ, 730EZ, 731EH, 731EI, 731ET, 732EG, 732ET, 733EF, 735EF, 735EI, 735EJ, 735EO, 735EQ

HP Mini 1000 Series DC Power Jack Connector: 1000, 1000 CTO, 1001XX, 1001TU, 1002TU, 1002XX, 1003TU, 1004TU, 1005TU, 1006TU, 1007TU, 1008TU, 1009TU, 1010LA, 1010NR, 1010TU, 1011TU, 1012TU, 1013TU, 1014TU, 1015TU, 1016TU, 1017TU, 1020LA, 1021TU, 1022TU, 1023TU, 1024TU, 1025TU, 1030NR, 1033CL, 1035NR, 1050LA, 1090LA, 1100, 1100 CTO, 1100CM, 1101TU, 1102TU, 1103TU, 1104TU, 1105TU, 1106TU, 1107TU, 1108TU, 1109TU, 1110NR, 1110TU, 1112TU, 1113TU, 1114TU, 1115NR, 1115TU, 1116NR, 1116TU, 1118TU, 1119TU, 1120LA, 1120BR, 1120NR, 1121TU, 1122TU, 1123TU, 1124TU, 1125NR, 1125TU, 1126NR, 1126TU, 1127TU, 1128TU, 1129TU, 1130CM, 1131TU, 1132TU, 1133CA, 1135CA, 1137NR, 1139NR, 1150BR, 1150CM, 1150NR, 1151NR, 1152NR, 1153NR, 1154NR, 1160CM, 1170CM, 1180CM

HP Mini 1000 Vivienne Tam Edition DC Power Jack Connector: 1000, 1018TU, 1019TU, 1020TU, 1097EI, 1098EI, 1099EA, 1099ED, 1099EE, 1099EF, 1099EG, 1099EK, 1099EL, 1099EI, 1099EM, 1099EN, 1099EP, 1099ER, 1099ES, 1099ET, 1099EW, 1100, 1100 CTO, 1111TU, 1117TU, 1120TU, 1140NR, 1141NR, 1198EO, 1199EA, 1199EB, 1199EC, 1199EE, 1199EH, 1199EJ, 1199EO, 1199ET, 1199EQ, 1199EV, 1199EZ

CH004023
€6.96

DC Power Jack, Part #PJ060

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SR29E N3700

SR29E N3700

Part Number SR29E N3700 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001692
€58.88

SR29E N3700

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2150674058

215-0674058

Part Number 215-0674058 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001696
€36.53

215-0674058

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GM107400A2 GTX750TI

GM107-400-A2 GTX750TI

Part Number GM107-400-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1630

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001698
€116.51

GM107-400-A2 GTX750TI

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SR2UW i36006U

SR2UW i3-6006U

Part Number i3-6006U SR2UW Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

i3-6006U SR2UW FJ8066201931106 Core i3 Mobile

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001710
€210.05

SR2UW i3-6006U

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2160729042 HD4650

216-0729042 HD4650

Part Number 216-0729042 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001713
€33.05

216-0729042 HD4650

2150752003

215-0752003

Part Number 215-0752003 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1112

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001689
€31.87

215-0752003

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DC Power Jack Part PJ060

Compaq Mini 700 Series DC Power Jack Connector: 700, 700EA, 700ED, 700EE, 700EF, 700EI, 700EK, 700EL, 700EN, 700EP, 700ER, 700ES, 700ET, 700EW, 701ED, 701EG, 701EM, 701EN, 701ER, 701ES, 701ET, 702EA, 702EG, 703EA, 705EI, 705EL, 705ES, 730, 730EB, 730EE, 730EJ, 730EO, 730EV, 730EQ, 730EZ, 731EH, 731EI, 731ET, 732EG, 732ET, 733EF, 735EF, 735EI, 735EJ, 735EO, 735EQ

HP Mini 1000 Series DC Power Jack Connector: 1000, 1000 CTO, 1001XX, 1001TU, 1002TU, 1002XX, 1003TU, 1004TU, 1005TU, 1006TU, 1007TU, 1008TU, 1009TU, 1010LA, 1010NR, 1010TU, 1011TU, 1012TU, 1013TU, 1014TU, 1015TU, 1016TU, 1017TU, 1020LA, 1021TU, 1022TU, 1023TU, 1024TU, 1025TU, 1030NR, 1033CL, 1035NR, 1050LA, 1090LA, 1100, 1100 CTO, 1100CM, 1101TU, 1102TU, 1103TU, 1104TU, 1105TU, 1106TU, 1107TU, 1108TU, 1109TU, 1110NR, 1110TU, 1112TU, 1113TU, 1114TU, 1115NR, 1115TU, 1116NR, 1116TU, 1118TU, 1119TU, 1120LA, 1120BR, 1120NR, 1121TU, 1122TU, 1123TU, 1124TU, 1125NR, 1125TU, 1126NR, 1126TU, 1127TU, 1128TU, 1129TU, 1130CM, 1131TU, 1132TU, 1133CA, 1135CA, 1137NR, 1139NR, 1150BR, 1150CM, 1150NR, 1151NR, 1152NR, 1153NR, 1154NR, 1160CM, 1170CM, 1180CM

HP Mini 1000 Vivienne Tam Edition DC Power Jack Connector: 1000, 1018TU, 1019TU, 1020TU, 1097EI, 1098EI, 1099EA, 1099ED, 1099EE, 1099EF, 1099EG, 1099EK, 1099EL, 1099EI, 1099EM, 1099EN, 1099EP, 1099ER, 1099ES, 1099ET, 1099EW, 1100, 1100 CTO, 1111TU, 1117TU, 1120TU, 1140NR, 1141NR, 1198EO, 1199EA, 1199EB, 1199EC, 1199EE, 1199EH, 1199EJ, 1199EO, 1199ET, 1199EQ, 1199EV, 1199EZ

CH004023
€6.96

DC Power Jack, Part #PJ060

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SR29E N3700

SR29E N3700

Part Number SR29E N3700 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001692
€58.88

SR29E N3700

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2150674058

215-0674058

Part Number 215-0674058 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001696
€36.53

215-0674058

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GM107400A2 GTX750TI

GM107-400-A2 GTX750TI

Part Number GM107-400-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1630

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001698
€116.51

GM107-400-A2 GTX750TI

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SR2UW i36006U

SR2UW i3-6006U

Part Number i3-6006U SR2UW Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

i3-6006U SR2UW FJ8066201931106 Core i3 Mobile

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001710
€210.05

SR2UW i3-6006U

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2160729042 HD4650

216-0729042 HD4650

Part Number 216-0729042 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001713
€33.05

216-0729042 HD4650

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