Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

ACER Swift 5 SF514-51 5 SW5-371T DC Jack Power

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Compaq Presario V2000 Series DC Power Jack Connector: V20xx, V21xx, V22xx, V23xx, V24xx, V25xx, V26xx

HP Pavilion DV1000 Series DC Power Jack Connector: DV10xx, DV11xx, DV12xx, DV13xx, DV14xx, DV15xx, DV16xx, DV17xx

HP Compaq Business Notebook DC Power Jack Connector: NX4800, NX4820

The listings below are for the Jacks for the Main System Board only, not the Power Connector Board. Please see PJ003-1.65mm here for the Power Connector Board Jack that the AC adapter plugs into.

Compaq Presario M2000 Series DC Power Jack Connector: M20xx, M21xx, M22xx, M23xx, M24xx, M25xx

HP Pavilion ZE2000 Series DC Power Jack Connector: ZE20xx, ZE21xx, ZE22xx, ZE23xx, ZE24xx, ZE25xx

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

10pcs TYPE-C Mobile Phone Charging DC Jack Power Sink type Patch

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

ZD7050US, ZD7055EA, ZD7058CL, ZD7060EA, ZD7063EA, ZD7065EA, ZD7066EA, ZD7070EA, ZD7080EA, ZD7101, ZD7101US, ZD7102US, ZD7112EA, ZD7120EA, ZD7128EA, ZD7129EA, ZD7131EA, ZD7139EA, ZD7140US, ZD7141, ZD7141EA, ZD7143EA, ZD7144EA, ZD7145EA, ZD7150EA, ZD7160ca, ZD7160US, ZD7167EA, ZD7168CL, ZD7168EA, ZD7169EA, ZD7170EA, ZD7180US, ZD7188CL, ZD7198CL, ZD7201US, ZD7202US, ZD7228EA, ZD7229EA, ZD7230EA, ZD7230US, ZD7235EA, ZD7236EA, ZD7245EA, ZD7248EA, ZD7249CL, ZD7250EA, ZD7255EA, ZD7256EA, ZD7257EA, ZD7258EA, ZD7259EA, ZD7260EA, ZD7260US, ZD7265EA, ZD7267EA, ZD7269CL, ZD7270EA, ZD7280US, ZD7283EA, ZD7300EA, ZD7310ca, ZD7310US, ZD7320EA, ZD7340EA, ZD7341EA, ZD7342EA, ZD7348EA, ZD7349EA, ZD7350EA, ZD7360US, ZD7373EA, ZD7374EA, ZD7375EA, ZD7376EA, ZD7377EA, ZD7378EA, ZD7379CL, ZD7379EA, ZD7380EA, ZD7380US, ZD7381EA, ZD7382EA, ZD7383EA, ZD7385EA, ZD7389CL, ZD7390EA, ZD7392EA, ZD7395EA, ZD7998US, ZD7999US

HP ZV Series DC Power Jack Connector: ZV5000, ZV5000t, ZV5000z, ZV5001US, ZV5002, ZV5002US, ZV5003AP, ZV5004AP, ZV5005AP, ZV5010AP, ZV5012AP, ZV5015AP, ZV5021AP, ZV5029AP, ZV5030US, ZV5034US, ZV5037WM, ZV5045EA, ZV5101US, ZV5103, ZV5103AP, ZV5103US, ZV5105US, ZV5120, ZV5120CA, ZV5120US, ZV5160, ZV5160CA, ZV5160US, ZV5200, ZV5200T, ZV5201, ZV5201US, ZV5202, ZV5210, ZV5210ca, ZV5210US, ZV5220, ZV5220US, ZV5240US, ZV5227, ZV5230, ZV5235, ZV5240, ZV5242QV, ZV5247LA, ZV5255US, ZV5257LA, ZV5260US, ZV5267LA, ZV5270US, ZV5277LA, ZV5287LA, ZV5316US, ZV5320, ZV5325, ZV5330, ZV5330, ZV5340, ZV5343, ZV5346, ZV5348, ZV5360, ZV5370, ZV5380, ZV5386, ZV6000

HP ZX Series DC Power Jack Connector: ZX5000, ZX5002, ZX5040US, ZX5040EA, ZX5041, ZX5060US, ZX5065US, ZX5070US, ZX5078, ZX5180US, ZX5190US, ZX5200, ZX5275US, ZX5280US

HP Business NoteBook DC Power Jack Connector: NX9100 Series, NX9110

Compaq Presario DC Power Jack Connector: R3000, R3000T, R3000Z, R3001, R3001US, R3002, R3003, R3003US, R3004, R3004US, R3005, R3005US, R3020, R3030, R3030US, R3038, R3038CL, R3040, R3050, R3050US, R3055, R3055CA, R3055US, R3056RS, R3060, R3060CA, R3060EA, R3060US, R3065, R3065US, R3070, R3070US, R3120CA, R3120US, R3140, R3140CA, R3140US, R3150, R3158, R3160, R3160US, R3190, R3190EA, R3190US, R3200, R3210, R3220, R3230, R3240, R3265, R3290, R3550US

Compaq Presario DC Power Jack Connector: 3000, 3000US, 3005, 3005US, 3008, 3008CL, 3015, 3015CA, 3015US, 3016US, 3017, 3017CL, 3017US, 3019, 3019CL, 3020, 3020US, 3045, 3045US, 3050, 3050US, 3070, 3070US, 3077, 3077WM, 3080, 3080US

Everx StepNote: NC1500, VA4100, VA4100M, VA4101M, VA4103M, VA4300, VA4300M, LM7WZ

*Gateway 4000 Series DC Power Jack Connector: M325, 4012GZ, 4024GZ, 4025GZ, 4026GZ, 4028GZ, 4028JP, 4030GZ, 4520GZ, 4525GZ, 4530GH, 4530GZ, 4535GZ, 4536GZ, 4538GZ, 4540GZ, 4541BZ, 4542GP, 4543BZ

*Gateway 7000 Series DC Power Jack Connector: M520, 7110GX, 7210GX, 7215GX, 7305GZ, 7320GZ, 7322GZ,7324GZ, 7325GZ, 7326GZ, 7330GH, 7330GZ, 7405GH, 7405GX, 7410GX, 7415GX, 7422GX, 7426GX, 7508GX, 7510GX, MX7118, MX7315, MX7337, MX7337H, MX7340, MX7515, MX7515H, MX7525, S-7200C

Gateway P-78, P-7800 Series: P-7800, P-78xx, P-7801u, P-7805u FX, P-7807u FX, P-7808u, P-7811 FX, P-7812j FX, MS2252

IBM Thinkpad DC Power Jack Connector: 570E, 600, 600A, 600D, 600E, 600X, A20, A20M, A20P, A21, A21E, A21M, A21P, A22, A22E, A22M, A22P, A30, A30P, A31, A31P, X, X20, X21, X22, X23, X24, X30

Toshiba Satellite DC Power Jack Connector: A70, A75, A79, M30X, M35X, L15-S104, 1800, 1900, 1905, 1955

Acer TravelMate DC Power Jack Connector: 430, 1500, 1510, 2200

*eMachine DC Power Jack Connector: M2100 Series, M2300 Series, M6800 Series

Fujitsu Amilo DC Power Jack Connector: L1300

Packard Bell DC Power Jack Connector: EasyNote: E5, E6, R2125

WinBook DC Power Jack Connector: 700 Series

*Gateway is known to use both 2.0mm and 2.5mm center pin sizes, personal verification must be done in order to get the correct part. The 2.5mm pin size is the most common size used, please see PJ012 for the 2.0mm size.

*eMachines is known to use both 1.65mm and 2.5mm center pin sizes, personal verification must be done in order to get the correct part. The 2.5mm pin size is the most common size used, please see PJ013 for the 1.65mm size.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

JACK POWER for Asus ZENBOOK UX51 UX51V UX51VZ