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250K PMTC 035mm Sn965Ag3Cu05 BGA No PbLead Free Solder Balls

250K PMTC 0.35mm BGA No Pb/Lead Free Solder Balls

Part Number 0.35mm BGA Solder Balls Manufacturer PMTC

BGA Alloy No Pb/Lead Free Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001122
€20.51

250K PMTC 0.35mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls

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Multifunction SOIC16 SOP16 SOP8 To DIP8 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 30CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

CH002241
€8.70

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

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KB9012 simple PCB Board for RT80x809H Programmer

RT809F RT809H optional accessories - KB9012 offline read-write adapter board, this is a piece, including PCB, 4 PIN needle row 2 groups.

Need to prepare the following materials and weld: 0603 package piece resistance one, resistance value 47K or 51K, bit number R1; 0603 package piece capacity two, 0.1uF, bit number C3 and C4; 10uF or 22uF capacitor one, package 0603 or 1206, bit number C1 or C2, install one. (Capacitor withstand voltage can be regardless, greater than 5V can be)

CH002252
€2.70

KB9012 simple PCB Board for RT809F RT809H Programmer

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BGA rework machine DH380 station platform touch screen

Buy BGA repaired Nozzle: * BGA repaired Nozzle Operation manual

Specification:

Total Power 4400W

Top heater 800W

Bottom heater Second heater 1200W, IR preheating

2400w

Power supply AC220V10% 50/60Hz

Dimensions L570*W550*H570mm

Positioning V-groove, PCB support can be adjusted in

any direction with external universal

fixture

Temperature control K Sensor, Closed loop

Temp accuracy 2?

PCB size Min: 20mm*20mm, Max:

320mm*375mm

BGA chip 2*2~80*80mm

Minimum chip spacing 0.15mm

External Temperature Sensor 1(optional)

Net weight 30 KG

DH-380 Main functions:

Three independent heaters all can set 8 segments heating, cooling and constant

temperature, save up to ten temperature profiles. IR preheat area can be controlled

according to PCB size

ARM control system and laser positioning, repairing all kinds of computer

motherboards and PC.

Embedded Industrial PC, high definition drawer style touch screen interface, PLC

control, and instant profile analysis function. Real-time settings and actual temperature

profile display can be used to analyzed and correct parameters if necessary.

K-type close circuit control and automatic temperature adjustment system, with PLC

and temperature module to enable precision temperature control of 2 degC. External

temperature sensor enables temperature monitoring and accurate analysis of real time

temperature profile.

V-groove PCB support for rapid, convenience and accurate positioning that fits for all

kinds of PCB board. Flexible and convenient removable fixture

Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and

replacement;

High powerful cross-flow fan and protect cover to enable fast cooling of PCB board

and prevent it from deformation.

Vacuum sucker and vacuum pen

Voice "early warning" function. 5-10 seconds before the completion of uninstalling or

welding, voice reminder / warning to get the workers prepared. Cooling system will start

after vertical wind stopped heating. When the temperature drops to room temperature, the

cooling process will stop, so that the machine will not age after heated up.

CE certification, with emergency switch and automatic power-off protection device

when emergency happens.

CH001143
€1,044.29

DH-380 Welding platform drawer type touch screen BGA rework station

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Bitmain Power Supply APW3121600A3 for AntMiner S9 or L3 or D3 w 10 Connectors

BITMAIN AntMiner APW3+-12-1600 PSU Series

APW3++-12-1600-A3

Output Power :1600W

Brand Name : Antminer

Model Number :APW3++-12-1600-A3

Output Voltage: DC Voltage 12.15V

Output Current :133A

Voltage Range:100-240V AC

Starting Voltage:95-105V AC

Noise Level:<43DB

Input Frequency Range :47-63Hz

Output Interface :PCI-E (6 PIN) X 10

Dimensions :220mm*108mm*62mm

Weight :3kg

Shipping list:

New APW3++-12-1600-A3 PSU X 1 piece (You must provide your own a power cable )

Note:

1. The power cord is not included, please find one with at least 10A from your local market.

2. The APW3++ can deliver a maximum power of only 1200W if it is connected to a 110V mains power supply. To obtain the rated power of 1600W, the APW3++ must be connected to a 220-240V mains power supply. Please check the mains power supply that is the standard in your region before ordering.

3. This batch of PSU comes with only 10 PCIe connectors.

CH001149
€999.00

Bitmain Power Supply APW3++-12-1600-A3 for AntMiner S9 or L3+ or D3 w/ 10 Connectors

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50ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 5.9inch/15cm

Width: approx. 1.85inch/4.7cm

Model: B-7000

Net weight: 1.68fl.oz (50ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001154
€4.85

50ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

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Compare
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10g Japan goot BS10 BGA Reballing repair Flux paste

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001158
€5.35

10g Japan goot BS-10 BGA Reballing repair Flux paste

250K PMTC 035mm Sn965Ag3Cu05 BGA No PbLead Free Solder Balls

250K PMTC 0.35mm BGA No Pb/Lead Free Solder Balls

Part Number 0.35mm BGA Solder Balls Manufacturer PMTC

BGA Alloy No Pb/Lead Free Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001122
€20.51

250K PMTC 0.35mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls

wishlist
Compare

Multifunction SOIC16 SOP16 SOP8 To DIP8 CLIP for RT80x809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000 SoFi-SP8 SoFi-SP16

Cable Size: 30CM

SPI FLASH chip SOP8 and SOP16 connection

A lot of new types of notebook and router is currently using 25 SPI memory chip, SOP16 chip package, such as MX25L3205 chip; although many programmers can support MX25L3205 chip, but it is the MX25L3205 chip supports SOP8 package, the MX25L3205 chip does not directly support the SOP16 package; and the adapter chip are not the same. One is 8 feet, one is 16 feet. So, is it possible to program SOP15 MX25L3205 chips in a simple way? In fact, the process is simple, because the 25 SPI chip SOP8 and SOP16 package chip, the definition of the corresponding foot is the same, as long as the corresponding SOP16 feet and SOP8 feet corresponding connection, the operating process can be used SOP8 MX25L3205 chip to operate on SOP16 MX25L3205 chip. (as long as 25 SPI chip models are identical, SOP8 and SOP16 chips can be used in this way)

25 SPI chip, SOP8 and SOP16 chip is interchangeable, as long as the chip pin corresponding to the line

Specifications for SOP8 packages and SOP16 packages:

SOP8 and SOP16 package, the foot spacing is the same, are 1.27, but the chip width is different. And chip definition of the corresponding pin is exactly the same, but the SOP16 chip packaging more than 8 feet NC empty feet (for future expansion as a basis), refer to the following figure, you can easily determine the SOP and SOP 25 SPI chip foot definition:

25 SPI SOP16 and SOP8 chip pins define the relationship:

The program can be programmed as long as the SOP16 pin is connected to the SOP8 adapter or directly to the programmer's seat.

In addition, MX25L3205 also has a TSSOP14 chip, the foot corresponding to the following picture:

CH002241
€8.70

Multi-function SOIC16 SOP16 SOP8 To DIP8 CLIP for RT809H RT809F TL866CS TL866A TL866II EZP2010 EZP2013 TNM5000

wishlist
Compare

KB9012 simple PCB Board for RT80x809H Programmer

RT809F RT809H optional accessories - KB9012 offline read-write adapter board, this is a piece, including PCB, 4 PIN needle row 2 groups.

Need to prepare the following materials and weld: 0603 package piece resistance one, resistance value 47K or 51K, bit number R1; 0603 package piece capacity two, 0.1uF, bit number C3 and C4; 10uF or 22uF capacitor one, package 0603 or 1206, bit number C1 or C2, install one. (Capacitor withstand voltage can be regardless, greater than 5V can be)

CH002252
€2.70

KB9012 simple PCB Board for RT809F RT809H Programmer

wishlist
Compare

BGA rework machine DH380 station platform touch screen

Buy BGA repaired Nozzle: * BGA repaired Nozzle Operation manual

Specification:

Total Power 4400W

Top heater 800W

Bottom heater Second heater 1200W, IR preheating

2400w

Power supply AC220V10% 50/60Hz

Dimensions L570*W550*H570mm

Positioning V-groove, PCB support can be adjusted in

any direction with external universal

fixture

Temperature control K Sensor, Closed loop

Temp accuracy 2?

PCB size Min: 20mm*20mm, Max:

320mm*375mm

BGA chip 2*2~80*80mm

Minimum chip spacing 0.15mm

External Temperature Sensor 1(optional)

Net weight 30 KG

DH-380 Main functions:

Three independent heaters all can set 8 segments heating, cooling and constant

temperature, save up to ten temperature profiles. IR preheat area can be controlled

according to PCB size

ARM control system and laser positioning, repairing all kinds of computer

motherboards and PC.

Embedded Industrial PC, high definition drawer style touch screen interface, PLC

control, and instant profile analysis function. Real-time settings and actual temperature

profile display can be used to analyzed and correct parameters if necessary.

K-type close circuit control and automatic temperature adjustment system, with PLC

and temperature module to enable precision temperature control of 2 degC. External

temperature sensor enables temperature monitoring and accurate analysis of real time

temperature profile.

V-groove PCB support for rapid, convenience and accurate positioning that fits for all

kinds of PCB board. Flexible and convenient removable fixture

Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and

replacement;

High powerful cross-flow fan and protect cover to enable fast cooling of PCB board

and prevent it from deformation.

Vacuum sucker and vacuum pen

Voice "early warning" function. 5-10 seconds before the completion of uninstalling or

welding, voice reminder / warning to get the workers prepared. Cooling system will start

after vertical wind stopped heating. When the temperature drops to room temperature, the

cooling process will stop, so that the machine will not age after heated up.

CE certification, with emergency switch and automatic power-off protection device

when emergency happens.

CH001143
€1,044.29

DH-380 Welding platform drawer type touch screen BGA rework station

wishlist
Compare

Bitmain Power Supply APW3121600A3 for AntMiner S9 or L3 or D3 w 10 Connectors

BITMAIN AntMiner APW3+-12-1600 PSU Series

APW3++-12-1600-A3

Output Power :1600W

Brand Name : Antminer

Model Number :APW3++-12-1600-A3

Output Voltage: DC Voltage 12.15V

Output Current :133A

Voltage Range:100-240V AC

Starting Voltage:95-105V AC

Noise Level:<43DB

Input Frequency Range :47-63Hz

Output Interface :PCI-E (6 PIN) X 10

Dimensions :220mm*108mm*62mm

Weight :3kg

Shipping list:

New APW3++-12-1600-A3 PSU X 1 piece (You must provide your own a power cable )

Note:

1. The power cord is not included, please find one with at least 10A from your local market.

2. The APW3++ can deliver a maximum power of only 1200W if it is connected to a 110V mains power supply. To obtain the rated power of 1600W, the APW3++ must be connected to a 220-240V mains power supply. Please check the mains power supply that is the standard in your region before ordering.

3. This batch of PSU comes with only 10 PCIe connectors.

CH001149
€999.00

Bitmain Power Supply APW3++-12-1600-A3 for AntMiner S9 or L3+ or D3 w/ 10 Connectors

wishlist
Compare

50ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 5.9inch/15cm

Width: approx. 1.85inch/4.7cm

Model: B-7000

Net weight: 1.68fl.oz (50ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001154
€4.85

50ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

wishlist
Compare

10g Japan goot BS10 BGA Reballing repair Flux paste

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001158
€5.35

10g Japan goot BS-10 BGA Reballing repair Flux paste

wishlist
Compare
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