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AUO11301

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003500
€3.45

AUO-11301

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H59457 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003501
€4.35

H59457 Stencil Template

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IXFT20N80Q TO268 IXYS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003502
€39.71

IXFT20N80Q TO-268 IXYS

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PCIE to SSD Convert Card for 2013 2014 2015 Apple Macbook Air Pro A1493 A1502 A1465 A1466

1.The product only support computer model is 2013 version Apple MacBook Pro retina model is A1398 A1502 (ME864 ME865 ME866 ME293 ME294),

2014 version Apple MacBook Pro retina model is A1502 A1398 (MGX72 MGX82 MGX92 MGXA2 MGXC2),

2015 version Apple MacBook Pro retina model is A1502 A1398(MF839 MF840 MF841 MGXA2 MGXC2),

2013-2014 version Apple MacBook Air model is A1465 A1466(MD711 MD712 MD760 MD761),

2015 version Apple MacBook Air model is A1465 A1466(MJVM2 MJVP2 MJVE2 MJVG2) laptop using SSD.

2.The product only support read data and write data in SSD,not support as the system startup disk.

3.Board Size:(L*W)12.00*10.90cm/4.72"*4.29"

Notice:

1:Only sales adapter card,images of SSD and mainboard is not sales!

2:The computer must have a PCI Express 4x socket,version 2.0 or higher.The motherboard must be Intel 7 series chipset or higher version than 7 Series chipset.

3:Mac OS and some digital camera system use disk format can't compatible with Microsoft system,new SSD if there is no partition,open the "my computer"can't see the ssd, please use the Disk Manager in Windows to delete the partitions or to create a new partition on the SSD.

4:The adapter card and SSD and PCIe slot contact is clean, avoid poor contact.

5:Update your computer BIOS to the latest version

6:This product performance is being improved unceasingly, like has the change, not separate informs

About MacBook Air SSD interface standard:

1: 2010 and 2011 version MacBook Air SSD is 6+12 pin, only one side have contact,size is 109 mm*24 mm.It's SATA interface.

2: 2012 version MacBook Air SSD is 7+17 pin, size is 109 mm*24 mm.2012 version MacBook Pro SSD is 7+17 pin, size is 89 mm*33 mm.It's SATA interface.

3: 2013 and 2014 and 2015 version MacBook Air SSD is both side have contact,one sid is 16+12 pin,the other side is 11+14 pin,size is 89 mm*24 mm.It's PCIe X4 interface.

4: 2013 and 2014 and 2015 version MacBook Pro SSD is both side have contact,one sid is 16+12 pin,the other side is 11+14 pin,size is 89 mm*33 mm.It's PCIe X4 interface.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003504
€8.58

PCI-E to SSD Convert Card for 2013 2014 2015 Apple Macbook Air Pro A1493 A1502 A1465 A1466

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LE82G33 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003505
€5.40

LE82G33 Stencil Template

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INTEL PC82573L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003506
€3.45

INTEL PC82573L

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THGBM5G5A1JBAIR

THGBM5G5A1JBAIR

Part Number THGBM5G5A1JBAIR Manufacturer TOSHIBA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003507
€9.04

THGBM5G5A1JBAIR

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Compare
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N11MLP1SB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003509
€5.40

N11M-LP1-S-B1 Stencil Template

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i75500U SR23W Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003510
€9.97

i7-5500U SR23W Stencil Template 90*90

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i52435M SR06Y Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003511
€9.97

i5-2435M SR06Y Stencil Template 90*90

AUO11301

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003500
€3.45

AUO-11301

wishlist
Compare

H59457 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003501
€4.35

H59457 Stencil Template

wishlist
Compare

IXFT20N80Q TO268 IXYS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003502
€39.71

IXFT20N80Q TO-268 IXYS

wishlist
Compare

PCIE to SSD Convert Card for 2013 2014 2015 Apple Macbook Air Pro A1493 A1502 A1465 A1466

1.The product only support computer model is 2013 version Apple MacBook Pro retina model is A1398 A1502 (ME864 ME865 ME866 ME293 ME294),

2014 version Apple MacBook Pro retina model is A1502 A1398 (MGX72 MGX82 MGX92 MGXA2 MGXC2),

2015 version Apple MacBook Pro retina model is A1502 A1398(MF839 MF840 MF841 MGXA2 MGXC2),

2013-2014 version Apple MacBook Air model is A1465 A1466(MD711 MD712 MD760 MD761),

2015 version Apple MacBook Air model is A1465 A1466(MJVM2 MJVP2 MJVE2 MJVG2) laptop using SSD.

2.The product only support read data and write data in SSD,not support as the system startup disk.

3.Board Size:(L*W)12.00*10.90cm/4.72"*4.29"

Notice:

1:Only sales adapter card,images of SSD and mainboard is not sales!

2:The computer must have a PCI Express 4x socket,version 2.0 or higher.The motherboard must be Intel 7 series chipset or higher version than 7 Series chipset.

3:Mac OS and some digital camera system use disk format can't compatible with Microsoft system,new SSD if there is no partition,open the "my computer"can't see the ssd, please use the Disk Manager in Windows to delete the partitions or to create a new partition on the SSD.

4:The adapter card and SSD and PCIe slot contact is clean, avoid poor contact.

5:Update your computer BIOS to the latest version

6:This product performance is being improved unceasingly, like has the change, not separate informs

About MacBook Air SSD interface standard:

1: 2010 and 2011 version MacBook Air SSD is 6+12 pin, only one side have contact,size is 109 mm*24 mm.It's SATA interface.

2: 2012 version MacBook Air SSD is 7+17 pin, size is 109 mm*24 mm.2012 version MacBook Pro SSD is 7+17 pin, size is 89 mm*33 mm.It's SATA interface.

3: 2013 and 2014 and 2015 version MacBook Air SSD is both side have contact,one sid is 16+12 pin,the other side is 11+14 pin,size is 89 mm*24 mm.It's PCIe X4 interface.

4: 2013 and 2014 and 2015 version MacBook Pro SSD is both side have contact,one sid is 16+12 pin,the other side is 11+14 pin,size is 89 mm*33 mm.It's PCIe X4 interface.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003504
€8.58

PCI-E to SSD Convert Card for 2013 2014 2015 Apple Macbook Air Pro A1493 A1502 A1465 A1466

wishlist
Compare

LE82G33 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003505
€5.40

LE82G33 Stencil Template

wishlist
Compare

INTEL PC82573L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003506
€3.45

INTEL PC82573L

wishlist
Compare

THGBM5G5A1JBAIR

THGBM5G5A1JBAIR

Part Number THGBM5G5A1JBAIR Manufacturer TOSHIBA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003507
€9.04

THGBM5G5A1JBAIR

wishlist
Compare

N11MLP1SB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003509
€5.40

N11M-LP1-S-B1 Stencil Template

wishlist
Compare

i75500U SR23W Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003510
€9.97

i7-5500U SR23W Stencil Template 90*90

wishlist
Compare

i52435M SR06Y Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003511
€9.97

i5-2435M SR06Y Stencil Template 90*90

wishlist
Compare
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