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Maxim MAX1632EAI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003536
€3.45

Maxim MAX1632EAI

G71GTNA2

G71-GT-N-A2

Part Number G71-GT-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003537
€36.10

G71-GT-N-A2

GFGO7600THNB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003538
€5.40

GF-GO7600T-H-N-B1 Stencil Template

XELTEK SuperPro 6100N Universal IC Chip Device Programmer NEWEST version 28 Adapters EDID code

XELTEK SuperPro 6100N (so not 6100)Universal Programmer 100,000+ devices supported

Login to Download: Download software

SuperPro 6100N is a cost-effective, reliable, and high-speed universal chip programmer. It is designed to communicate using USB 2.0 port for development requirement and can also work in standalone mode (without connecting to a PC) for production requirement. It has the largest device support count in the programming industry with 144 pin drivers to support high pin count chips.

Application and target customers: Programming houses, electronic repair, car repair shops, forensic and data recovery companies, medical devices, requirement for larger device support.

Advantages of SuperPro 6100N

Ultra Fast Programming Speed SuperPro 6100 is designed with high programming speed in mind. Our semiconductor manufacturer approved algorithms, precision and clean signals guarantee high programming yield. Special design was made to eliminate overshoot and ground bounce. Algorithms are performed with state machine architecture constructed with FPGA to achieve a ultra-high programming speed.

Largest Device Support Located in Silicon Valley, we keep good relationships with many major IC companies that are important for us to continuously support new devices. SuperPro 6100 currently supports more than 100,000 devices, which is the largest device library in the programming industry. Requested device algorithms can be added within a week - average lead time from other manufacturers is over two months.

Built-in 144 Pin Driver Most universal IC programmers are designed with 48 pin driver or less. Programmers with a 48 pin driver design need special adapters (pin mapping) to accommodate devices with more than 48 pins. Bottom boards needed for pin mapping can quickly increase production costs just to support one package type. SuperPro 6100N is equipped with a built-in universal 144 pin driver to accommodate large pin count devices. One universal adapter accommodates all devices with the same package type.

Stand-Alone Mode Unlike many other universal programmers in the industry, SuperPro 6100N is capable of operating in stand-alone mode. Under stand-alone mode, SuperPro 6100 can be operated by an inexperienced operator with minimal training. Once the project file is selected, the operator only has to insert a blank chip and remove the programmed chip upon beeping. This ensures a minimal chance that an operator will make a mistake. Users can also use clusters of stand-alone programmers to achieve high volume production. Last but not the least, stand-alone mode saves both the cost of PC and labor of the trained and qualified operator.

Tester for Logic Devices and SRAMs In addition to having a large device library, SuperPro 6100 programmer is also designed for IC testing of varioudevices such as TTL, CMOS Logic (74/4000 series), and SRAM memory devices.

Hardware and Electrical Specifications

Devices supported

EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU

Package types supported

DIP, SDIP, PLCC, JLCC, PGA, LGA, SOIC, SOJ, SOT, QFP, TQFP, PQFP, VQFP, MQFP, LQFP, TSOP, SOP, TSOPII, PSOP, SSOP, TSSOP, SON, EBGA, FBGA, FTBGA, VFBGA, BGA, CSP, SCSP, QFN, HVQFN etc.

PC interface

USB 2.0

Stand-alone memory

Compact FLASH Card

Power supply

AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

Dimensions

Main unit: 148(L) x 216(W) x 94(H) mm

Package: 301(L) x 252(W) x 145(H) mm

Weight

Main unit: Weight 3.5 lbs (1.6 Kg)

Package: Weight 6.2 lbs (2.8Kg)

Expanded Features

Operate multiple units to construct a concurrent multi-programming system. Cluster 1-15 units for flexible volume production.

Support devices with Vcc from 1.2V - 5V.

Support files up to 256 GB.

Over-current and over-voltage protection for safety of the chip and programmer hardware.

Only IC manufacturer approved programming algorithms used for high reliability.

Vcc verification (at +5% ~ -5% and +10% ~ -10%) enhances programming reliability.

Ac Acessories:

Main unit with a DIP48 adaptor, AC adaptor, USB2.0 cable, user manual, software CD, register card

Optional accessories: adaptor in varies packages, CF card for stand-alone operation.

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * DX0001 Adapter

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adaptador

1 * SOP16-DIP16 (300mil) Adaptador

1 * SOP20-DIP20 (300mil) Adaptador

1 * SOP28-DIP28 (300mil) Adaptador

1 * TSSOP16-DIP16 (170mil) Adaptador

1 * TSSOP20-DIP20 (170mil) Adaptador

1 * TSSOP24-DIP24 (170mil) Adaptador

1 * TSSOP28-DIP28 (170mil) Adaptador

1 * SSOP20-DIP20 (220mil) Adaptador

1 * SSOP28-DIP28 (220mil) Adaptador

1 * SSOP34-DIP34 (220mil) Adaptador

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adaptador

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adaptador

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adaptador

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adaptador

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adaptador

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adaptador

1 * QFN8 WSON8 Simple Adaptador

1 * SOP16/8-DIP8 REV4 Simple Adaptador

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adaptador

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adaptador

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH003539
€1,162.39

XELTEK SuperPro 6100N Universal IC Chip Device Programmer NEWEST version + 28 Adapters EDID code

ITE IT8511TE BXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003540
€3.45

ITE IT8511TE BXA

G98740U2 9200MGS

G98-740-U2 9200MGS

Part Number G98-740-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1012

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003541
€15.72

G98-740-U2 9200MGS

i74702HQ SR15F Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003542
€9.94

i7-4702HQ SR15F Stencil Template 90*90

RICHTEK RT8207A DH

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003543
€3.45

RICHTEK RT8207A DH=

PM8841

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003545
€3.45

PM8841

Intersil ISL6258AHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003546
€3.45

Intersil ISL6258AHRTZ

G84280A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003547
€5.40

G84-280-A2 Stencil Template

Maxim MAX1632EAI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003536
€3.45

Maxim MAX1632EAI

G71GTNA2

G71-GT-N-A2

Part Number G71-GT-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003537
€36.10

G71-GT-N-A2

GFGO7600THNB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003538
€5.40

GF-GO7600T-H-N-B1 Stencil Template

XELTEK SuperPro 6100N Universal IC Chip Device Programmer NEWEST version 28 Adapters EDID code

XELTEK SuperPro 6100N (so not 6100)Universal Programmer 100,000+ devices supported

Login to Download: Download software

SuperPro 6100N is a cost-effective, reliable, and high-speed universal chip programmer. It is designed to communicate using USB 2.0 port for development requirement and can also work in standalone mode (without connecting to a PC) for production requirement. It has the largest device support count in the programming industry with 144 pin drivers to support high pin count chips.

Application and target customers: Programming houses, electronic repair, car repair shops, forensic and data recovery companies, medical devices, requirement for larger device support.

Advantages of SuperPro 6100N

Ultra Fast Programming Speed SuperPro 6100 is designed with high programming speed in mind. Our semiconductor manufacturer approved algorithms, precision and clean signals guarantee high programming yield. Special design was made to eliminate overshoot and ground bounce. Algorithms are performed with state machine architecture constructed with FPGA to achieve a ultra-high programming speed.

Largest Device Support Located in Silicon Valley, we keep good relationships with many major IC companies that are important for us to continuously support new devices. SuperPro 6100 currently supports more than 100,000 devices, which is the largest device library in the programming industry. Requested device algorithms can be added within a week - average lead time from other manufacturers is over two months.

Built-in 144 Pin Driver Most universal IC programmers are designed with 48 pin driver or less. Programmers with a 48 pin driver design need special adapters (pin mapping) to accommodate devices with more than 48 pins. Bottom boards needed for pin mapping can quickly increase production costs just to support one package type. SuperPro 6100N is equipped with a built-in universal 144 pin driver to accommodate large pin count devices. One universal adapter accommodates all devices with the same package type.

Stand-Alone Mode Unlike many other universal programmers in the industry, SuperPro 6100N is capable of operating in stand-alone mode. Under stand-alone mode, SuperPro 6100 can be operated by an inexperienced operator with minimal training. Once the project file is selected, the operator only has to insert a blank chip and remove the programmed chip upon beeping. This ensures a minimal chance that an operator will make a mistake. Users can also use clusters of stand-alone programmers to achieve high volume production. Last but not the least, stand-alone mode saves both the cost of PC and labor of the trained and qualified operator.

Tester for Logic Devices and SRAMs In addition to having a large device library, SuperPro 6100 programmer is also designed for IC testing of varioudevices such as TTL, CMOS Logic (74/4000 series), and SRAM memory devices.

Hardware and Electrical Specifications

Devices supported

EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU

Package types supported

DIP, SDIP, PLCC, JLCC, PGA, LGA, SOIC, SOJ, SOT, QFP, TQFP, PQFP, VQFP, MQFP, LQFP, TSOP, SOP, TSOPII, PSOP, SSOP, TSSOP, SON, EBGA, FBGA, FTBGA, VFBGA, BGA, CSP, SCSP, QFN, HVQFN etc.

PC interface

USB 2.0

Stand-alone memory

Compact FLASH Card

Power supply

AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

Dimensions

Main unit: 148(L) x 216(W) x 94(H) mm

Package: 301(L) x 252(W) x 145(H) mm

Weight

Main unit: Weight 3.5 lbs (1.6 Kg)

Package: Weight 6.2 lbs (2.8Kg)

Expanded Features

Operate multiple units to construct a concurrent multi-programming system. Cluster 1-15 units for flexible volume production.

Support devices with Vcc from 1.2V - 5V.

Support files up to 256 GB.

Over-current and over-voltage protection for safety of the chip and programmer hardware.

Only IC manufacturer approved programming algorithms used for high reliability.

Vcc verification (at +5% ~ -5% and +10% ~ -10%) enhances programming reliability.

Ac Acessories:

Main unit with a DIP48 adaptor, AC adaptor, USB2.0 cable, user manual, software CD, register card

Optional accessories: adaptor in varies packages, CF card for stand-alone operation.

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * DX0001 Adapter

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adaptador

1 * SOP16-DIP16 (300mil) Adaptador

1 * SOP20-DIP20 (300mil) Adaptador

1 * SOP28-DIP28 (300mil) Adaptador

1 * TSSOP16-DIP16 (170mil) Adaptador

1 * TSSOP20-DIP20 (170mil) Adaptador

1 * TSSOP24-DIP24 (170mil) Adaptador

1 * TSSOP28-DIP28 (170mil) Adaptador

1 * SSOP20-DIP20 (220mil) Adaptador

1 * SSOP28-DIP28 (220mil) Adaptador

1 * SSOP34-DIP34 (220mil) Adaptador

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adaptador

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adaptador

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adaptador

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adaptador

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adaptador

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adaptador

1 * QFN8 WSON8 Simple Adaptador

1 * SOP16/8-DIP8 REV4 Simple Adaptador

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adaptador

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adaptador

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH003539
€1,162.39

XELTEK SuperPro 6100N Universal IC Chip Device Programmer NEWEST version + 28 Adapters EDID code

ITE IT8511TE BXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003540
€3.45

ITE IT8511TE BXA

G98740U2 9200MGS

G98-740-U2 9200MGS

Part Number G98-740-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1012

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003541
€15.72

G98-740-U2 9200MGS

i74702HQ SR15F Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003542
€9.94

i7-4702HQ SR15F Stencil Template 90*90

RICHTEK RT8207A DH

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003543
€3.45

RICHTEK RT8207A DH=

10pcs Screw Lot For Apple Macbook Pro 13 15 17 A1278 A1286 A1297 Bottom Case

100% brand new and high quality

Color: As picture showed.

Material: Metal.

Quantity: 10pcs/set

Compatible With:

MacBook Pro 13" A1278 2009 2010 2011 2012

MacBook Pro 15" A1286 2008 2009 2010 2011 2012

MacBook Pro 17" A1297 2009 2010 2011

Package Includes:

10pcs * Bottom Case Screw (3 Long 7 Short)

CH003544
€3.73

10pcs Screw Lot For Apple Macbook Pro 13 15 17 A1278 A1286 A1297 Bottom Case

PM8841

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003545
€3.45

PM8841

Intersil ISL6258AHRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003546
€3.45

Intersil ISL6258AHRTZ

G84280A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003547
€5.40

G84-280-A2 Stencil Template