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Realtek RTL8150L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003564
€3.45

Realtek RTL8150L

G86735A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003567
€5.40

G86-735-A2 Stencil Template

15 15mm15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 1.5T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

CH003568
€2.70

1.5 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

N11PGT1A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003569
€5.40

N11P-GT1-A1 Stencil Template

IRF8707

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003570
€3.45

IRF8707

TI TPS51125

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003572
€3.45

TI TPS51125

DHA1LC Digital display of ferrochrome laser positioning BGA rework station

Dinghua Model:DH-A1L-C BGA rework station

Buy BGA repaired Nozzle: * BGA repaired Nozzle Operation manual

Specification:

Total Power 4900W

Top heater 800W

Bottom heater Second heater 1200W,IR preheating

2700w, digital thermostat soldering iron

80W

Power AC220V10% 50/60Hz

Dimensions L650W700H650 mm

Positioning V-groove, PCB support can be adjusted in any direction with

external universal fixture

Temperature control K Sensor, Closed loop

Temp accuracy 1?

PCB size Max 500450 mm Min 2222 mm

BGA chip 22-8080mm

Minimum chip spacing 0.15mm

External Temperature Sensor 1(optional)

Net weight 55kg

Feature:

1.Embedded Industrial PC, high definition touch screen interface, PLC control, and

instant profile analysis function. Real-time settings and actual temperature profile

display can be used to analyzed and correct parameters if necessary.

2.It uses precise K-type close circuit control and automatic temperature adjustment

system, with PLC and temperature module to enable precision temperature control of

1 deg C. External temperature sensor enables temperature monitoring and accurate

analysis of real time temperature profile.

3.V-groove PCB support for rapid, convenience and accurate positioning that fits for

all kinds of PCB board.

4.Flexible and convenient removable fixture on the PCB board which protects and

prevent damage to PCB. It can also adapt to rework various BGA packages.

5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy

installation and replacement;

6.Three temperature areas can independently heat and are multiple controllable and

adjustable to ensure best integration of different temperature areas. Heating

temperature, time, angle, cooling and vacuuming can all be set on the interface.

7.There are 6-8 levels of variable and constant temperature controls. Massive storage

of temperature curves which are Instant accessible according to different BGA. Curve

analysis, setting and adjustment are all accessible via touch screen. Three heating

areas adopts independent PID calculation to control heating process to enable more

accurate and precise temperature control.

8.It uses high powered blower to enable fast cooling of PCB board and prevent it from

deformation. There are also internal vacuum pump and external vacuum pen to assist

with fetching the BGA chip.

9.Laser positioning, fast and effectively fix PCB

10.USB output interface.

11.Equipped with constant temperature digital display soldering iron

12.Including Voice "early warning" function. 5-10 seconds before the completion of

uninstalling or welding, voice reminder / warning to get the workers prepared.

Cooling system will start after vertical wind stopped heating. When the temperature

drops to room temperature, the cooling process will stop, so that the machine will not

age after

heated up.

13.HD Display screen+camera + support. With the equipment, we can see the

melting ball of outermost row very clear.

14.CE certification, with emergency switch and automatic power-off protection

device when emergency happens.

CH003574
€2,672.73

DH-A1L-C Digital display of ferrochrome laser positioning BGA rework station

Realtek RTL8150L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003564
€3.45

Realtek RTL8150L

G86735A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003567
€5.40

G86-735-A2 Stencil Template

15 15mm15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 1.5T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

CH003568
€2.70

1.5 15mm*15mm Heatsink Thermal Pad Copper Shim for Laptop CPU GPU Copper Plate

N11PGT1A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003569
€5.40

N11P-GT1-A1 Stencil Template

IRF8707

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003570
€3.45

IRF8707

TI TPS51125

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003572
€3.45

TI TPS51125

DHA1LC Digital display of ferrochrome laser positioning BGA rework station

Dinghua Model:DH-A1L-C BGA rework station

Buy BGA repaired Nozzle: * BGA repaired Nozzle Operation manual

Specification:

Total Power 4900W

Top heater 800W

Bottom heater Second heater 1200W,IR preheating

2700w, digital thermostat soldering iron

80W

Power AC220V10% 50/60Hz

Dimensions L650W700H650 mm

Positioning V-groove, PCB support can be adjusted in any direction with

external universal fixture

Temperature control K Sensor, Closed loop

Temp accuracy 1?

PCB size Max 500450 mm Min 2222 mm

BGA chip 22-8080mm

Minimum chip spacing 0.15mm

External Temperature Sensor 1(optional)

Net weight 55kg

Feature:

1.Embedded Industrial PC, high definition touch screen interface, PLC control, and

instant profile analysis function. Real-time settings and actual temperature profile

display can be used to analyzed and correct parameters if necessary.

2.It uses precise K-type close circuit control and automatic temperature adjustment

system, with PLC and temperature module to enable precision temperature control of

1 deg C. External temperature sensor enables temperature monitoring and accurate

analysis of real time temperature profile.

3.V-groove PCB support for rapid, convenience and accurate positioning that fits for

all kinds of PCB board.

4.Flexible and convenient removable fixture on the PCB board which protects and

prevent damage to PCB. It can also adapt to rework various BGA packages.

5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy

installation and replacement;

6.Three temperature areas can independently heat and are multiple controllable and

adjustable to ensure best integration of different temperature areas. Heating

temperature, time, angle, cooling and vacuuming can all be set on the interface.

7.There are 6-8 levels of variable and constant temperature controls. Massive storage

of temperature curves which are Instant accessible according to different BGA. Curve

analysis, setting and adjustment are all accessible via touch screen. Three heating

areas adopts independent PID calculation to control heating process to enable more

accurate and precise temperature control.

8.It uses high powered blower to enable fast cooling of PCB board and prevent it from

deformation. There are also internal vacuum pump and external vacuum pen to assist

with fetching the BGA chip.

9.Laser positioning, fast and effectively fix PCB

10.USB output interface.

11.Equipped with constant temperature digital display soldering iron

12.Including Voice "early warning" function. 5-10 seconds before the completion of

uninstalling or welding, voice reminder / warning to get the workers prepared.

Cooling system will start after vertical wind stopped heating. When the temperature

drops to room temperature, the cooling process will stop, so that the machine will not

age after

heated up.

13.HD Display screen+camera + support. With the equipment, we can see the

melting ball of outermost row very clear.

14.CE certification, with emergency switch and automatic power-off protection

device when emergency happens.

CH003574
€2,672.73

DH-A1L-C Digital display of ferrochrome laser positioning BGA rework station