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  • Categories: Other BGA Chips & ICs
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NUVOTON NPCE783LA0DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000587
€3.45

NUVOTON NPCE783LA0DX

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i5 I53230M ME662LLA

PO000082
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i7 I73540M BTOCTO

PO000083
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000084
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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TI TPS51116RG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000590
€3.45

TI TPS51116RG

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ACTIONS ATC2603A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000591
€3.45

ACTIONS ATC2603A

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Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel

Gauge Evaluator

Login to Download: * EV2300a Device Driver Installer Multilanguage

Model No: EV2300 HPA002

Included:

1 x Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Description:

The EV2300 is a USB-based interface board for a PC that can be used to evaluate battery fuel gauge circuits designed with Texas Instruments' ICs. The EV2300 has connections on it for a USB cable and also accepts inputs from a battery fuel gauge circuit's communication port (SMBus or HDQ). By running the appropriate PC software for the correspondingfuel gauge IC, the EV2300 interface board allows the user to evaluate the battery fuel gauge circuit. Note: The driver on this page is for 32 bit Windows. See the 64 bit driver e2e post for 64 bit Windows 7 driver information.

Feature:

USB-based interface board for evaluation of battery fuel gauge circuits developed with fuel gauge ICs using the HDQ and SMBus communication protocol

Provides interface between intelligent battery circuit and a Windows-based PC

Connects to the USB port of a PC

Allows for on screen display and programming of gas gauge register functions when used with the appropriate PC software

CH001659
€128.05

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

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PANASONIC ANX3110

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000592
€3.45

PANASONIC ANX3110

  • -20%
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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000086
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

NUVOTON NPCE783LA0DX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000587
€3.45

NUVOTON NPCE783LA0DX

wishlist
Compare
  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i5 I53230M ME662LLA

PO000082
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i7 I73540M BTOCTO

PO000083
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000084
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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TI TPS51116RG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000590
€3.45

TI TPS51116RG

wishlist
Compare

ACTIONS ATC2603A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000591
€3.45

ACTIONS ATC2603A

wishlist
Compare

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel

Gauge Evaluator

Login to Download: * EV2300a Device Driver Installer Multilanguage

Model No: EV2300 HPA002

Included:

1 x Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Description:

The EV2300 is a USB-based interface board for a PC that can be used to evaluate battery fuel gauge circuits designed with Texas Instruments' ICs. The EV2300 has connections on it for a USB cable and also accepts inputs from a battery fuel gauge circuit's communication port (SMBus or HDQ). By running the appropriate PC software for the correspondingfuel gauge IC, the EV2300 interface board allows the user to evaluate the battery fuel gauge circuit. Note: The driver on this page is for 32 bit Windows. See the 64 bit driver e2e post for 64 bit Windows 7 driver information.

Feature:

USB-based interface board for evaluation of battery fuel gauge circuits developed with fuel gauge ICs using the HDQ and SMBus communication protocol

Provides interface between intelligent battery circuit and a Windows-based PC

Connects to the USB port of a PC

Allows for on screen display and programming of gas gauge register functions when used with the appropriate PC software

CH001659
€128.05

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

wishlist
Compare

PANASONIC ANX3110

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000592
€3.45

PANASONIC ANX3110

wishlist
Compare
  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000086
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

wishlist
Compare
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