MCP79MXT-B2

Part Number MCP79MXT-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Features:

Notice:This is HC-05 Bluetooth module Slave and master two in one module~

This module can be set to a transmitter or receiver, transmitter could pairing with receiver , receiver and receiver or transmitter and transmitter can't communication between, receiver could pairing with computers and cell phone Bluetooth , when buying, the default for receiver.

Specification:

1. Use the CSR mainstream bluetooth chip, bluetooth V2.0 protocol standards.

2. Module working voltage 3.3 V.

3. Default potter rate is 9600, can be set up from 2400 to 115200 .

4. The core module size : 28 mm x 15 mm x 2.35 mm.

5. Working current: matching for 30 MA, matching the communication for 8 MA.

6. Dormancy current: no dormancy.

7. Used for GPS navigation system, water and electricity gas meter reading system.

8. With computer and bluetooth bluetooth adapter, PDA, seamless connection equipment

Highlights:

1. Commercial Series: Bluetooth module board Series

2. With LED indicator light, use 150mA and 3.3V regulation chip.

3. With VCC?GND?TXD?RXD foot for the Bluetooth

4. With "Re-seach" button(ON/OFF/WAKE foot for it , external MCU outinput "High level" can control module to re-search)

5. Compatible with bluetooth master module", slave module"or master-slave(whole) module.

6. put voltage: 3.3~6V

7. Size: 1.55cm*3.98cm

Note:

1. input power supply 3.3~6V, Prohibit more than 7V

2. No "Automatically prevent power supply peversing func", so please correctly connect power supply

3. We advise to install "Bluetooth master module"

4. The "State" is output foot for LED status, when bluetooth "Unconnected", output "Pulse" ; when bluetooth "connected", output "High level", we can determine the states from "MCU"

5. If only the board , No any "Bluetooth Function "

Package Included:

1Pcs X HC-05 bluetooth module with backboard

GM206-251-A1 GXT950

Part Number GM206-251-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1612

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

M402SD07G VFD MODULE M402SD07GK M402SD07GS M402SD07J M402SD07GM M402SD07GR

Part Number M402SD07G Manufacturer Futaba

Operating Temp -20 ? - 70 ? Made in Japan

Storage Temp -40 ? - 85 ? Description Original new

Digit Format: 5*7 Dot Matrix + Cursor

Outer Dimension: 240*43*20.6 MAX mm

Display Area: 16.4*186.8 mm

Number of Digit: 40 digits*2 lines

Digit Size: 5.0*3.5 mm

Digit Pitch: 10.0*4.7 mm

Color of Illumination: Green(?p=505nm)

Operating Temp: -20? - 70 ?

Storage Temp: -40? - 85 ?

This is the new version of the PCIe 1x to 16x riser with USB 3.0 cable. This is a must have item for 6+ gpu mining rigs. This is the most stable riser in existence today.

Brand New in anti-static bag. Just arrived from China.

1x to 16x PCI-e riser

3 capacitors so the card doesn't burn out like 1st edition riser

4 PIN Molex to 15 PIN SATA power cable (Reinforced 4 pin connector for extra strength)

Flat bottom so it can rest safely on your mining rig supports

50 cm / 20 inch USB 3.0 cable with plenty of length for spacing out your GPUs for maximum airflow.

Version 6.0 (Newest version available!)

Package Includes:

1x - 50cm / 20 inch USB 3.0 cable (Black)

1x - PCI-e 16x adapter board (Black)

1x - PCI-e 1x riser board (Black)

1x - SATA 15 Pin to 4 PIN Molex power cable

Make sure you're buying the best quality risers to protect your expensive GPUs. Ribbon cables and first generation PCI-e risers are dangerous. These risers have 3 capacitors instead of 2 and are from a new / improved vendor.

N15P-GX-A2 GTX860M

Part Number N15P-GX-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1443

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

BD82HM57 SLGZR

Part Number AC82GL40 SLB95 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen HP DV6-3000 P/N: DD0LX6LC000 DD0LX6LC001 595131-001

GF-GO7600T-N-B1

Part Number GF-GO7600T-N-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0921

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0728020 HD4570

Part Number 216-0728020 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 360 Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Lenovo S9 S10

216-0729051 HD4670

Part Number 216-0729051 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock