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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Laptop Parts, Repair tool
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25ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.94inch/10cm

Width: approx. 1.42inch/3.6cm

Model: B-7000

Net weight: 0.84fl.oz (25ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001428
€4.35

25ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

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GL82Q150 SR2C6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000986
€4.35

GL82Q150 SR2C6 Stencil Template

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40W Soldering Iron with Thead Blue Teflon Cable

40W (100-230V) Soldering Iron T-Tip (head) and Teflon rubber for Pixel Ribbon cable Repair

The 40W Electronic Soldering Iron comes with a T-Tip head and Rubber Cable used for repairing and replacing car LCD flat ribbon cables.

Work Voltage: 100-230V

Application:

For BMW dashboard and mid radio ribbon , for Mercedes Benz instrument cluster ribbon , SAAB ( automatic climate control, SID1, SID2), Opel ribbon.etc.

Pacakge:

1P x T-tip (head)

1P x Rubber

Note: Different size for soldering iron Tip, so the power of the tip must the same with your electronic soldering iron power.

CH001449
€2.70

40W Soldering Iron with T-head + Blue Teflon Cable

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2160856040 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000990
€5.40

216-0856040 Stencil Template

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i73517U SR0N6 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001002
€9.97

i7-3517U SR0N6 Stencil Template 90*90

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2160810005 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001006
€9.97

216-0810005 Stencil Template 90*90

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218S4RBSA11G Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001009
€5.40

218S4RBSA11G Stencil Template

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2150848000 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001010
€9.97

215-0848000 Stencil Template 90*90

25ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 3.94inch/10cm

Width: approx. 1.42inch/3.6cm

Model: B-7000

Net weight: 0.84fl.oz (25ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH001428
€4.35

25ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

wishlist
Compare

GL82Q150 SR2C6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000986
€4.35

GL82Q150 SR2C6 Stencil Template

wishlist
Compare

40W Soldering Iron with Thead Blue Teflon Cable

40W (100-230V) Soldering Iron T-Tip (head) and Teflon rubber for Pixel Ribbon cable Repair

The 40W Electronic Soldering Iron comes with a T-Tip head and Rubber Cable used for repairing and replacing car LCD flat ribbon cables.

Work Voltage: 100-230V

Application:

For BMW dashboard and mid radio ribbon , for Mercedes Benz instrument cluster ribbon , SAAB ( automatic climate control, SID1, SID2), Opel ribbon.etc.

Pacakge:

1P x T-tip (head)

1P x Rubber

Note: Different size for soldering iron Tip, so the power of the tip must the same with your electronic soldering iron power.

CH001449
€2.70

40W Soldering Iron with T-head + Blue Teflon Cable

wishlist
Compare

2160856040 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000990
€5.40

216-0856040 Stencil Template

wishlist
Compare

i73517U SR0N6 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001002
€9.97

i7-3517U SR0N6 Stencil Template 90*90

wishlist
Compare

2160810005 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001006
€9.97

216-0810005 Stencil Template 90*90

wishlist
Compare

218S4RBSA11G Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001009
€5.40

218S4RBSA11G Stencil Template

wishlist
Compare

2150848000 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001010
€9.97

215-0848000 Stencil Template 90*90

wishlist
Compare
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