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  • Availability: In stock

2150752007 RX881

215-0752007 RX881

Part Number 215-0752007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001877
€43.53

215-0752007 RX881

MCP79DB2

MCP79D-B2

Part Number MCP79D-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001887
€24.62

MCP79D-B2

EME300GBB22GV E300

EME300GBB22GV E-300

Part Number EME300GBB22GV Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 360 Description Original new

EME300GBB22GV E-300 Processor AMD Mobile CPU BGA413 1.3 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001891
€27.50

EME300GBB22GV E-300

GP106300A1

GP106-300-A1

Part Number GP106-300-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001898
€246.15

GP106-300-A1

N12PGSA1 GT540M

N12P-GS-A1 GT540M

Part Number N12P-GS-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1409

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001899
€35.94

N12P-GS-A1 GT540M

N14MGESA2 GT750M

N14M-GE-S-A2 GT750M

Part Number N14M-GE-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001904
€15.59

N14M-GE-S-A2 GT750M

OBDSTAR X300 DP Plus X300 PAD2 8inch Tablet Full package C Package

OBDSTAR X300 Key Master DP Plus Diagnosis and Auto key programmer

CONFIGURATIONS

A Package:

Immobilizer+Special function(EEPROM+Key Renewing)Adapter(P001 programmer+C001circuit board+C002 circuit board+W001 cable+W002 data cable+W003 data cable+Toyota smart key Emulator)+others(Ignition coil+Remote tester)

B Package (Calibration with instrument mileage):

Immobilizer+Special function(EEPROM+Key Renewing)+Mileage correction+Adapter(P001 programmer+C001 circuit board+C002 circuit board+W001 data cable+W002 data cable+W003 data cable+Toyota smarkt key Emulator)+others(Ignition coil+Remote tester)

C Package (With meter mileage correction + maintenance to match special functions):

Immobilizer+Mileage correction+Diagnosis+Special function (Oil rest +ABS+Battery matching+ECU programming+EPB+Throttle programming+Airbag rest+TPMS+Steering angle rest+OBDII+DPF+Injector code+Supension matching+Gear learning+CVT learning+EEPROM+Key renewing+ECU cloning)Adapter(P001 programmer+C001 circuit board+C002 circuit board+W001 data cable+W002 data cable+W003 data cable+Toyota smarkt key Emulator)+others(Ignition coil+Remote tester)

This device is a new Android-based vehicle trouble diagnostic device developed for internet applications. It inherits from OBDSTAR advanced diagnosing technology and it is characterized by covering wide range of vehicles, featuring powerful function, and providing precise result. Through vehicle diagnostic OBD connector and variant mobile intelligent terminals, it achieves vehicle trouble diagnosis for full car model and full system vehicle.

Meanwhile, taking advantage of mobile internet, this device integrates more application and service, such as Maintenance Database, remote assistant, One Key Upgrade etc.

OBDSTAR X300 DP Plus X300 PAD2 8inch Tablet (Full package) C Package

OBDSTAR X300 Key Master DP Plus Hardware Advantages:

1. Built-in VCI box

2. 8-inch touchscreen

3. Charge directly via OBD interface

4. Practical and high-end gift box

5. Industrial design with silicone case

6. Back bracket design:prop on the steering wheel or stand on the table

7. With 4 Toyota simulation keys (the fifth is coming soon)

8. P001 programmer: EEPROM adapter + RFID adapter + Key Renew adapter

9. Add the clip of reading SOP 8PIN EEPROM

10. C001/C002 circuit board to read and write chip data with welding

11. IMMO induction coil to detect the key induction coil failure of the vehicle.

12. Add wiring harness of ECU reading by OBD (for ECU cloning and switch activation)

OBDSTAR X300 Key Master DP Plus Software Advantages:

IMMO:

1. EEPROM

2. Renew Key

3. Key programming

4. Remote programming

Cluster Calibrate: wild vehicle coverage, pls check the carlist

Diagnosis: realize all vehicle systems diagnosis

Special Functions

TPS/ABS/EPB/DPF/TPMS/SRS Reset/Fuel Injector/Gear Learning/Battery Matching/ECU Programming/Throttle Matching/

Oil/service reset/Steering Angle Reset/Remote Manual Setting/Electronic Steering Reset/CVT Learning/value Reset

ECU Clone

1. ECU Clone, means ECU duplication.

The device copies all the data from the original vehicle ECU, and then writes all data copied into ECU with the same hardware to realize the same ECU function with the original vehicle.

2. Clone directly when replacing a new or a used ECU!

Without online matching in 4S store or removal of ECU bonding wire for reading and writing! Directly write without dismantling OBD!

3. Three features for ECU Clone:

A. Free of 4S online:

break monopoly from 4S, benefiting automobile maintenance industry

B. Simplified operation procedures: realize foolproof operation

C. Non-dismantling with zero risks: read and write data without dismantling ECU

Switch Activation Function

(Today many instruments or audio of vehicles activate secondary power supply to go into power-on status by relevant module CAN communication on the vehicle, but sometimes an instrument or an audio is separated from vehicle CANBUS network, causing startup failure when it needs to be repaired by an auto technician. This function can simulate CAN communication to activate secondary power supply, so the instrument or the audio enters into power-on status. In this way, it not only can test and verify the instrument or the audio, but also save an enormous cost for an auto technician to purchase a large number of startup platforms of various vehicles and wiring harnesses!)

Add Help Functions

1. including built-in testable vehicle models, upgrade announcement, features, help notes and wiring diagrams, etc.

2. Carlist and upgrade announcement, all details are available on the device

3. Customers can look up the features or uniquely support functions on the device

4. Help notes: built-in help notes for each model or function

5. Wiring diagrams: built-in ECU wiring diagrams, more intuitionistic and convenient

TECHNICAL PARAMETER

? Operation system: Android 5.1.1

? CPU: Exynos4418 Dual Core ARM Cortex A9 1.4GHz

? Battery: 3700mA, rechargeable polymer lithium battery

? Extension memory card: 32G Micro SD (TF) card supported

? Memory capacity:1GB

? Storage capacity: 32GB

? LCD: 8.0 inch

? LCD resolution: 1280*800

? Touch screen: Capacitive touch screen

? Camera: 5 mega rear view camera

? Wi-Fi: supported

? Working temperature: -10? ~ 55?(14? ~ 131? )

? Storage temperature: -20? ~ 70?(-4? ~ 158? )

? Weight: about 1.0 Kg

? Dimension: 254mm*174*mm*35mm

I. Functional Overview:

Induction Coil is used to detect the key induction coil failure of the vehicle.

II. Application Method:

Attach the Induction Coil to the key induction coil, and insert the key or turn ignition on, while Induction Coil red indicator lights up and goes out, indicating the key induction coil is good;the indicator does not illuminate to indicate the key coil is damaged, please check and repair or replace.

I. Functional Overview:

Induction Coil is used to detect the key induction coil failure of the vehicle.

II. Application Method:

Attach the Induction Coil to the key induction coil, and insert the key or turn ignition on, while Induction Coil red indicator lights up and goes out, indicating the key induction coil is good;the indicator does not illuminate to indicate the key coil is damaged, please check and repair or replace.

Package includes:

CH002564
€2,220.66

OBDSTAR X300 DP Plus X300 PAD2 8inch Tablet (Full package) C Package

2150752007 RX881

215-0752007 RX881

Part Number 215-0752007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001877
€43.53

215-0752007 RX881

MCP79DB2

MCP79D-B2

Part Number MCP79D-B2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001887
€24.62

MCP79D-B2

EME300GBB22GV E300

EME300GBB22GV E-300

Part Number EME300GBB22GV Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 360 Description Original new

EME300GBB22GV E-300 Processor AMD Mobile CPU BGA413 1.3 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001891
€27.50

EME300GBB22GV E-300

GP106300A1

GP106-300-A1

Part Number GP106-300-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001898
€246.15

GP106-300-A1

N12PGSA1 GT540M

N12P-GS-A1 GT540M

Part Number N12P-GS-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1409

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001899
€35.94

N12P-GS-A1 GT540M

RT80x80E IT8386E Transfer Board

RT809H PEB-1 Extension Board IT8985E IT8595E IT8587E IT8586E IT8585E IT8580E IT8386E Transfer Board

CH002545
€2.70

RT809H PEB-1 Extension Board IT8985E IT8595E IT8587E IT8586E IT8585E IT8580E IT8386E Transfer Board

N14MGESA2 GT750M

N14M-GE-S-A2 GT750M

Part Number N14M-GE-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001904
€15.59

N14M-GE-S-A2 GT750M

OBDSTAR X300 DP Plus X300 PAD2 8inch Tablet Full package C Package

OBDSTAR X300 Key Master DP Plus Diagnosis and Auto key programmer

CONFIGURATIONS

A Package:

Immobilizer+Special function(EEPROM+Key Renewing)Adapter(P001 programmer+C001circuit board+C002 circuit board+W001 cable+W002 data cable+W003 data cable+Toyota smart key Emulator)+others(Ignition coil+Remote tester)

B Package (Calibration with instrument mileage):

Immobilizer+Special function(EEPROM+Key Renewing)+Mileage correction+Adapter(P001 programmer+C001 circuit board+C002 circuit board+W001 data cable+W002 data cable+W003 data cable+Toyota smarkt key Emulator)+others(Ignition coil+Remote tester)

C Package (With meter mileage correction + maintenance to match special functions):

Immobilizer+Mileage correction+Diagnosis+Special function (Oil rest +ABS+Battery matching+ECU programming+EPB+Throttle programming+Airbag rest+TPMS+Steering angle rest+OBDII+DPF+Injector code+Supension matching+Gear learning+CVT learning+EEPROM+Key renewing+ECU cloning)Adapter(P001 programmer+C001 circuit board+C002 circuit board+W001 data cable+W002 data cable+W003 data cable+Toyota smarkt key Emulator)+others(Ignition coil+Remote tester)

This device is a new Android-based vehicle trouble diagnostic device developed for internet applications. It inherits from OBDSTAR advanced diagnosing technology and it is characterized by covering wide range of vehicles, featuring powerful function, and providing precise result. Through vehicle diagnostic OBD connector and variant mobile intelligent terminals, it achieves vehicle trouble diagnosis for full car model and full system vehicle.

Meanwhile, taking advantage of mobile internet, this device integrates more application and service, such as Maintenance Database, remote assistant, One Key Upgrade etc.

OBDSTAR X300 DP Plus X300 PAD2 8inch Tablet (Full package) C Package

OBDSTAR X300 Key Master DP Plus Hardware Advantages:

1. Built-in VCI box

2. 8-inch touchscreen

3. Charge directly via OBD interface

4. Practical and high-end gift box

5. Industrial design with silicone case

6. Back bracket design:prop on the steering wheel or stand on the table

7. With 4 Toyota simulation keys (the fifth is coming soon)

8. P001 programmer: EEPROM adapter + RFID adapter + Key Renew adapter

9. Add the clip of reading SOP 8PIN EEPROM

10. C001/C002 circuit board to read and write chip data with welding

11. IMMO induction coil to detect the key induction coil failure of the vehicle.

12. Add wiring harness of ECU reading by OBD (for ECU cloning and switch activation)

OBDSTAR X300 Key Master DP Plus Software Advantages:

IMMO:

1. EEPROM

2. Renew Key

3. Key programming

4. Remote programming

Cluster Calibrate: wild vehicle coverage, pls check the carlist

Diagnosis: realize all vehicle systems diagnosis

Special Functions

TPS/ABS/EPB/DPF/TPMS/SRS Reset/Fuel Injector/Gear Learning/Battery Matching/ECU Programming/Throttle Matching/

Oil/service reset/Steering Angle Reset/Remote Manual Setting/Electronic Steering Reset/CVT Learning/value Reset

ECU Clone

1. ECU Clone, means ECU duplication.

The device copies all the data from the original vehicle ECU, and then writes all data copied into ECU with the same hardware to realize the same ECU function with the original vehicle.

2. Clone directly when replacing a new or a used ECU!

Without online matching in 4S store or removal of ECU bonding wire for reading and writing! Directly write without dismantling OBD!

3. Three features for ECU Clone:

A. Free of 4S online:

break monopoly from 4S, benefiting automobile maintenance industry

B. Simplified operation procedures: realize foolproof operation

C. Non-dismantling with zero risks: read and write data without dismantling ECU

Switch Activation Function

(Today many instruments or audio of vehicles activate secondary power supply to go into power-on status by relevant module CAN communication on the vehicle, but sometimes an instrument or an audio is separated from vehicle CANBUS network, causing startup failure when it needs to be repaired by an auto technician. This function can simulate CAN communication to activate secondary power supply, so the instrument or the audio enters into power-on status. In this way, it not only can test and verify the instrument or the audio, but also save an enormous cost for an auto technician to purchase a large number of startup platforms of various vehicles and wiring harnesses!)

Add Help Functions

1. including built-in testable vehicle models, upgrade announcement, features, help notes and wiring diagrams, etc.

2. Carlist and upgrade announcement, all details are available on the device

3. Customers can look up the features or uniquely support functions on the device

4. Help notes: built-in help notes for each model or function

5. Wiring diagrams: built-in ECU wiring diagrams, more intuitionistic and convenient

TECHNICAL PARAMETER

? Operation system: Android 5.1.1

? CPU: Exynos4418 Dual Core ARM Cortex A9 1.4GHz

? Battery: 3700mA, rechargeable polymer lithium battery

? Extension memory card: 32G Micro SD (TF) card supported

? Memory capacity:1GB

? Storage capacity: 32GB

? LCD: 8.0 inch

? LCD resolution: 1280*800

? Touch screen: Capacitive touch screen

? Camera: 5 mega rear view camera

? Wi-Fi: supported

? Working temperature: -10? ~ 55?(14? ~ 131? )

? Storage temperature: -20? ~ 70?(-4? ~ 158? )

? Weight: about 1.0 Kg

? Dimension: 254mm*174*mm*35mm

I. Functional Overview:

Induction Coil is used to detect the key induction coil failure of the vehicle.

II. Application Method:

Attach the Induction Coil to the key induction coil, and insert the key or turn ignition on, while Induction Coil red indicator lights up and goes out, indicating the key induction coil is good;the indicator does not illuminate to indicate the key coil is damaged, please check and repair or replace.

I. Functional Overview:

Induction Coil is used to detect the key induction coil failure of the vehicle.

II. Application Method:

Attach the Induction Coil to the key induction coil, and insert the key or turn ignition on, while Induction Coil red indicator lights up and goes out, indicating the key induction coil is good;the indicator does not illuminate to indicate the key coil is damaged, please check and repair or replace.

Package includes:

CH002564
€2,220.66

OBDSTAR X300 DP Plus X300 PAD2 8inch Tablet (Full package) C Package