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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: BGA Reballing Kits, Stencils
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216LQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000192
€5.40

216LQA6AVA12FG Stencil Template

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i72675QM SR02S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000195
€5.40

i7-2675QM SR02S Stencil Template

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Wireless Bluetooth Stereo Headset For iPhone Samsung

Product Description

Features of I7 bluetooth headset:

1. listening to the song correct, support songs and call,

2. remind call number, the last call back, all intelligent Chinese and English voice prompts, boot, pair, shut down the phone power will be low voice prompts;

3. Power capacity will show on your Apple Iphone, you can see the power situation anytime, do not worry about the electricity ,make your life without worry;

4. Can be connected to two mobile phones at the same time

5. Bluetooth headset connected to the phone after the shutdown, and then open the Bluetooth headset will connect back to the phoneautomatically, more convenient;

6. Intelligent compatibility: support all Bluetooth mobile phone, tablet, notebook, singing it, QQ music, movies, etc., universal all mobile phone;

Specification:

1. Driver: 15mm

2. Impedance: 32 OHM

3. Bluetooth version: Bluetooth v4.1 + EDR

4. Bluetooth use band: 2.4GHz

5. Power level: CLASS II

6. Output power: 30mW

7. Bluetooth distance: 10 meters barrier

8. Frequency response: 20-20000Hz

9. Operating voltage range: 3.0V-4.2V

10. Mitou sensitivity: -42dB

11. With A2DP / AVRCP high quality stereo audio transmission and remote control protocol

12. Powerful noise de-noising circuit (active noise reduction)

13. switch between Chinese and English (boot does not connect Bluetooth state, press the switch 2 times, hear the tone switch successfully)

14. Charging time about 1 hour (power indicator charging: red light, full power: red light off (blue light).)

15. Product Size: Length 25MM. Width 15MM. High 35mm

16. Talk time is about 4-5 hours

17. music time about 4-5 hours

18. Standby time is about 120 hours

19. The charging time is about 60 minutes

20. Battery capacity 60MAH

Package Includes:

2*mini Bluetooth Headphones (2pcs)

1*USB Charging Cable

1*User Manual

CH000565
€33.44

Wireless Bluetooth Stereo Headset For iPhone Samsung

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GK107250A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000198
€5.40

GK107-250-A2 Stencil Template

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N15EGXA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000205
€7.46

N15E-GX-A2 Stencil Template

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USB30 to NGFFM2 SSD hard disk box

Features:

Portable, Lightweight, Ultrathin.

Super cooling capacity.

No additional power required.

LED indicator light hint USB working condition.

Specification:

Color:Black

Transfer Speed: Super Speed 6Gbp/s

Material: Aluminum with oxidation/sand blasting

Dimensions:9.8x 3.9x 0.98 cm

Operating temperature: 5?~40?, storage temperature: -20?~70?

Assembly: By screws, suitable for all SSD Hard Disk

Weight:41g

Compatible with Windows XP / Vista / 7 / 8 / 10 and Mac OS 10.1 and above.

Package content:

1 x Usb 3.0 to NGFF SSD Case

1 x ScrewDriver

1 x USB 3.0 Male to USB 3.0 SuperSpeed Micro-B

1 x Pocket

1 x Manual

CH000570
€17.41

USB3.0 to NGFF(M.2) SSD hard disk box

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i52520M SR04A Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000209
€5.40

i5-2520M SR04A Stencil Template

216LQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000192
€5.40

216LQA6AVA12FG Stencil Template

wishlist
Compare

i72675QM SR02S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000195
€5.40

i7-2675QM SR02S Stencil Template

wishlist
Compare

Wireless Bluetooth Stereo Headset For iPhone Samsung

Product Description

Features of I7 bluetooth headset:

1. listening to the song correct, support songs and call,

2. remind call number, the last call back, all intelligent Chinese and English voice prompts, boot, pair, shut down the phone power will be low voice prompts;

3. Power capacity will show on your Apple Iphone, you can see the power situation anytime, do not worry about the electricity ,make your life without worry;

4. Can be connected to two mobile phones at the same time

5. Bluetooth headset connected to the phone after the shutdown, and then open the Bluetooth headset will connect back to the phoneautomatically, more convenient;

6. Intelligent compatibility: support all Bluetooth mobile phone, tablet, notebook, singing it, QQ music, movies, etc., universal all mobile phone;

Specification:

1. Driver: 15mm

2. Impedance: 32 OHM

3. Bluetooth version: Bluetooth v4.1 + EDR

4. Bluetooth use band: 2.4GHz

5. Power level: CLASS II

6. Output power: 30mW

7. Bluetooth distance: 10 meters barrier

8. Frequency response: 20-20000Hz

9. Operating voltage range: 3.0V-4.2V

10. Mitou sensitivity: -42dB

11. With A2DP / AVRCP high quality stereo audio transmission and remote control protocol

12. Powerful noise de-noising circuit (active noise reduction)

13. switch between Chinese and English (boot does not connect Bluetooth state, press the switch 2 times, hear the tone switch successfully)

14. Charging time about 1 hour (power indicator charging: red light, full power: red light off (blue light).)

15. Product Size: Length 25MM. Width 15MM. High 35mm

16. Talk time is about 4-5 hours

17. music time about 4-5 hours

18. Standby time is about 120 hours

19. The charging time is about 60 minutes

20. Battery capacity 60MAH

Package Includes:

2*mini Bluetooth Headphones (2pcs)

1*USB Charging Cable

1*User Manual

CH000565
€33.44

Wireless Bluetooth Stereo Headset For iPhone Samsung

wishlist
Compare

GK107250A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000198
€5.40

GK107-250-A2 Stencil Template

wishlist
Compare

N15EGXA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000205
€7.46

N15E-GX-A2 Stencil Template

wishlist
Compare

USB30 to NGFFM2 SSD hard disk box

Features:

Portable, Lightweight, Ultrathin.

Super cooling capacity.

No additional power required.

LED indicator light hint USB working condition.

Specification:

Color:Black

Transfer Speed: Super Speed 6Gbp/s

Material: Aluminum with oxidation/sand blasting

Dimensions:9.8x 3.9x 0.98 cm

Operating temperature: 5?~40?, storage temperature: -20?~70?

Assembly: By screws, suitable for all SSD Hard Disk

Weight:41g

Compatible with Windows XP / Vista / 7 / 8 / 10 and Mac OS 10.1 and above.

Package content:

1 x Usb 3.0 to NGFF SSD Case

1 x ScrewDriver

1 x USB 3.0 Male to USB 3.0 SuperSpeed Micro-B

1 x Pocket

1 x Manual

CH000570
€17.41

USB3.0 to NGFF(M.2) SSD hard disk box

wishlist
Compare

i52520M SR04A Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000209
€5.40

i5-2520M SR04A Stencil Template

wishlist
Compare
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