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SPI SAM EFI Ribbon Cable ROM Debug Connector Tool for Macbook

In package:

1 pcs   x  EFI Ribbon Cable

Shipping time

 You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide) 

Expedited : 5-10 working days  (Europe and Worldwide) 

 

Product description:

Modify, and upgrade your MacBook effortlessly with our Professional BIOS Flashing Set. Perfect for MacBook, MacBook Air, and MacBook Pro models from 2010 to 2017, this set allows manual in bios bin file settings adjustments for ME region, iCloud, and BIOS passw clearing. No de-soldering required.

 

Compatible Mcbooks with SVOD, RT809H/F:

A1534 emc 2746 820-00045, A1534 emc 2991 820-00244, A1534 emc 3099 820-00687, A1370 emc 2393 820-2796, A1370 EMCXXXX 820-2955, A1370 EMCXXXX 820-2955, A1465 emc 2558 820-3208, A1465 emc 2631 820-3435, A1465 emc 2924 820-00164, A1304 EMCXXXX 820-2375, A1304 EMCXXXX 820-2375, A1369 emc 2469 820-3023, A1466 emc 259 820-32509, A1466 emc 2632 820-3437, A1466 emc 2925 820-00165, A1466 emc 3178 820-00165, A1425 emc 2512 820-3462, A1502 emc 2678 820-3536, A1502 emc 2678 820-3476, A1502 emc 2875 820-3476, A1502 emc 2835 820-4924, A1398 emc 2512 820-3332, A1398 emc 2673 820-3332, A1398 emc 2746 820-3662, A1398 emc 2876 820-3662, A1398 emc 2745 820-3787, A1398 emc 2881 820-3787, A1398 emc 2909 820-00138, A1398 emc 2910 820-00163, A1398 emc 2910 820-00426, A1708 EMCXXXX 820-00361, A1708 emc 2978 820-00875, A1708 emc 3164 820-00840, A1706 emc 3071 820-00239, A1706 emc 3163 820-00923, A1707 emc 3072 820-00281, A1707 emc 3162 820-00928, A1283 emc 2264 820-2366,A1283 emc 2336 820-XXXX, A1347 emc 2364 820-2577, A1347 emc 2442 820-2993, A1347 emc 2442 820-3059, A1347 emc 2442 820-3017, A1347 emc 2570 820-3227, A1347 emc XXXX 820-3228, A1347 emc 2840 820-5509 

CH341 supported:

MBA11 2015 A1465 820-00164

MBA11 2013 A1465 820-3435

MBA13 2011 A1369 820-3023

MBA11 2011 A1370 820-3024

MBA 13 2013 A1466 820-3437

MBA 13 2012 A1466 820-3209

MBA13 2015 A1466 820-00165

MBA13 2017 A1466 820-00165

2016 A1708 820-00875 MBP13

MBP13 2016 A1706 820-00239

MBP15 2017 A1707 820-00928

MBP15 2016 A1707 820-00281

MBP13 2017 A1706 820-00923

MBP13 2017 A1708 820-00840

MBP13 2015 A1502 820-4924

MBP13 2014 A1502 820-3476

MBP13 2014 A1502 820-3536 

MBP13 2013 A1502 820-3476

MBP13 2014 A1502 820-3476

MBP15 2012 A1398 820-3332

MBP15 2013 A1398 820-3332

MBP15 2013 A1398 820-3662

MBP15 2013 A1398 820-3787

MBP15 2014 A1398 820-3662

MBP15 2015 A1398 820-00138 

MBP15 2015 A1398 820-00163

MBP12 2015 A1534 820-00045

MBP12 2016 A1534 820-00244

MacMini 2011 A1347 820-2993

  

Warranty

This product will have a 90-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país

 

SE000001
€45.00

In package:

1 pcs   x  EFI Ribbon Cable
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SR2Z9 J3455

SR2Z9 J3455

Part Number SR2Z9 J3455 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000285
€57.44

SR2Z9 J3455

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N10PGV1 GT120M

N10P-GV1 GT120M

Part Number N10P-GV1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000296
€25.93

N10P-GV1 GT120M

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N10MNSSB1

N10M-NS-S-B1

Part Number N10M-NS-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000298
€15.59

N10M-NS-S-B1

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LE82GM965 SLA5T

LE82GM965 SLA5T

Part Number LE82GM965 SLA5T Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000300
€11.49

LE82GM965 SLA5T

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AM3420DDX43GX A63420M

AM3420DDX43GX A6-3420M

Part Number AM3420DDX43GX Manufacturer AMD

socket FS1 772-pin Date Code 12+

Package/Case 1 PCS Description Brand new

AM3420DDX43GX A6-3420M for Notebooks AMD 1.5 GHz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000301
€11.32

AM3420DDX43GX A6-3420M

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SR23L M5Y51

SR23L M-5Y51

Part Number SR23L M-5Y51 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000311
€57.44

SR23L M-5Y51

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N14PGSA2 GT740M

N14P-GS-A2 GT740M

Part Number N14P-GS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1233

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000323
€54.15

N14P-GS-A2 GT740M

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N16SGTRSA2

N16S-GTR-S-A2

Part Number N16S-GTR-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000327
€24.62

N16S-GTR-S-A2

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2150804119

215-0804119

Part Number 215-0804119 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1442

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000330
€35.35

215-0804119

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SR23V i75600U

i7-5600U SR23V

Part Number SR23V i7-5600U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000333
€237.95

SR23V i7-5600U

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N11EGEA1 GTX460M

N11E-GE-A1 GTX460M

Part Number N11E-GE-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1045

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000339
€45.95

N11E-GE-A1 GTX460M

  • New

SPI SAM EFI Ribbon Cable ROM Debug Connector Tool for Macbook

In package:

1 pcs   x  EFI Ribbon Cable

Shipping time

 You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide) 

Expedited : 5-10 working days  (Europe and Worldwide) 

 

Product description:

Modify, and upgrade your MacBook effortlessly with our Professional BIOS Flashing Set. Perfect for MacBook, MacBook Air, and MacBook Pro models from 2010 to 2017, this set allows manual in bios bin file settings adjustments for ME region, iCloud, and BIOS passw clearing. No de-soldering required.

 

Compatible Mcbooks with SVOD, RT809H/F:

A1534 emc 2746 820-00045, A1534 emc 2991 820-00244, A1534 emc 3099 820-00687, A1370 emc 2393 820-2796, A1370 EMCXXXX 820-2955, A1370 EMCXXXX 820-2955, A1465 emc 2558 820-3208, A1465 emc 2631 820-3435, A1465 emc 2924 820-00164, A1304 EMCXXXX 820-2375, A1304 EMCXXXX 820-2375, A1369 emc 2469 820-3023, A1466 emc 259 820-32509, A1466 emc 2632 820-3437, A1466 emc 2925 820-00165, A1466 emc 3178 820-00165, A1425 emc 2512 820-3462, A1502 emc 2678 820-3536, A1502 emc 2678 820-3476, A1502 emc 2875 820-3476, A1502 emc 2835 820-4924, A1398 emc 2512 820-3332, A1398 emc 2673 820-3332, A1398 emc 2746 820-3662, A1398 emc 2876 820-3662, A1398 emc 2745 820-3787, A1398 emc 2881 820-3787, A1398 emc 2909 820-00138, A1398 emc 2910 820-00163, A1398 emc 2910 820-00426, A1708 EMCXXXX 820-00361, A1708 emc 2978 820-00875, A1708 emc 3164 820-00840, A1706 emc 3071 820-00239, A1706 emc 3163 820-00923, A1707 emc 3072 820-00281, A1707 emc 3162 820-00928, A1283 emc 2264 820-2366,A1283 emc 2336 820-XXXX, A1347 emc 2364 820-2577, A1347 emc 2442 820-2993, A1347 emc 2442 820-3059, A1347 emc 2442 820-3017, A1347 emc 2570 820-3227, A1347 emc XXXX 820-3228, A1347 emc 2840 820-5509 

CH341 supported:

MBA11 2015 A1465 820-00164

MBA11 2013 A1465 820-3435

MBA13 2011 A1369 820-3023

MBA11 2011 A1370 820-3024

MBA 13 2013 A1466 820-3437

MBA 13 2012 A1466 820-3209

MBA13 2015 A1466 820-00165

MBA13 2017 A1466 820-00165

2016 A1708 820-00875 MBP13

MBP13 2016 A1706 820-00239

MBP15 2017 A1707 820-00928

MBP15 2016 A1707 820-00281

MBP13 2017 A1706 820-00923

MBP13 2017 A1708 820-00840

MBP13 2015 A1502 820-4924

MBP13 2014 A1502 820-3476

MBP13 2014 A1502 820-3536 

MBP13 2013 A1502 820-3476

MBP13 2014 A1502 820-3476

MBP15 2012 A1398 820-3332

MBP15 2013 A1398 820-3332

MBP15 2013 A1398 820-3662

MBP15 2013 A1398 820-3787

MBP15 2014 A1398 820-3662

MBP15 2015 A1398 820-00138 

MBP15 2015 A1398 820-00163

MBP12 2015 A1534 820-00045

MBP12 2016 A1534 820-00244

MacMini 2011 A1347 820-2993

  

Warranty

This product will have a 90-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país

 

SE000001
€45.00

In package:

1 pcs   x  EFI Ribbon Cable
wishlist
Compare

SR2Z9 J3455

SR2Z9 J3455

Part Number SR2Z9 J3455 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000285
€57.44

SR2Z9 J3455

wishlist
Compare

N10PGV1 GT120M

N10P-GV1 GT120M

Part Number N10P-GV1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000296
€25.93

N10P-GV1 GT120M

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N10MNSSB1

N10M-NS-S-B1

Part Number N10M-NS-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000298
€15.59

N10M-NS-S-B1

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Compare

LE82GM965 SLA5T

LE82GM965 SLA5T

Part Number LE82GM965 SLA5T Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000300
€11.49

LE82GM965 SLA5T

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Compare

AM3420DDX43GX A63420M

AM3420DDX43GX A6-3420M

Part Number AM3420DDX43GX Manufacturer AMD

socket FS1 772-pin Date Code 12+

Package/Case 1 PCS Description Brand new

AM3420DDX43GX A6-3420M for Notebooks AMD 1.5 GHz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000301
€11.32

AM3420DDX43GX A6-3420M

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Compare

SR23L M5Y51

SR23L M-5Y51

Part Number SR23L M-5Y51 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000311
€57.44

SR23L M-5Y51

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N14PGSA2 GT740M

N14P-GS-A2 GT740M

Part Number N14P-GS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1233

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000323
€54.15

N14P-GS-A2 GT740M

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N16SGTRSA2

N16S-GTR-S-A2

Part Number N16S-GTR-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000327
€24.62

N16S-GTR-S-A2

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2150804119

215-0804119

Part Number 215-0804119 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1442

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000330
€35.35

215-0804119

wishlist
Compare

SR23V i75600U

i7-5600U SR23V

Part Number SR23V i7-5600U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000333
€237.95

SR23V i7-5600U

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N11EGEA1 GTX460M

N11E-GE-A1 GTX460M

Part Number N11E-GE-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1045

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000339
€45.95

N11E-GE-A1 GTX460M

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